公开(公告)号：US20240213427A1

公开(公告)日：2024-06-27

申请号：US18389775

申请日：2023-12-20

申请人： NICHIA CORPORATION

发明人： Atsushi HOSOKAWA ,  Masaaki KATSUMATA ,  Eiko MINATO

IPC分类号： H01L33/62 ,  H01L33/52 ,  H01L33/60

CPC分类号： H01L33/62 ,  H01L33/52 ,  H01L33/60 ,  H01L24/16 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066

摘要： A wiring substrate including a base body provided with a via hole, a conductive portion disposed in the via hole, and a wiring portion electrically connected to the conductive portion and disposed on a surface of the body. The conductive portion includes a first conductive member containing copper particles and a resin. The first member contains small-sized particles with a particle size from 0.1 μm to 1.0 μm and large-sized particles with a particle size from more than 1.0 μm to 10 μm. The wiring portion includes a second conductive member containing copper particles. The second member contains small-sized particles with a particle size from 0.1 μm to 1.0 μm and large-sized particles with a particle size from more than 1.0 μm to 10 μm. A weight proportion of the small-sized particles in the first member is lower than a weight proportion of the small-sized particles in the second member.

公开(公告)号：US20240038957A1

公开(公告)日：2024-02-01

申请号：US18360076

申请日：2023-07-27

申请人： NICHIA CORPORATION

发明人： Atsushi HOSOKAWA ,  Masaaki KATSUMATA

IPC分类号： H01L33/62 ,  H01L27/15 ,  H01L25/075

CPC分类号： H01L33/62 ,  H01L27/156 ,  H01L25/0753 ,  H01L2933/0066

摘要： A wiring substrate includes: a base body having an insulating property and including a first surface and a second surface on a side opposite the first surface; a resist portion covering at least part of the first surface and at least a part of the second surface of the base body and including a hole portion having a predetermined pattern; and a wiring line disposed in the hole portion of the resist portion so as to be in contact with the base body. In a cross-sectional view in a thickness direction of the base body, a length of an exposed surface of the wiring line exposed from the resist portion is less than a length of a contact surface of the wiring line in contact with the base body.

公开(公告)号：US20240355987A1

公开(公告)日：2024-10-24

申请号：US18637994

申请日：2024-04-17

申请人： NICHIA CORPORATION

发明人： Masaaki KATSUMATA ,  Eiko MINATO ,  Takashi KAWAMATA ,  Atsushi HOSOKAWA

IPC分类号： H01L33/62 ,  H01L25/075 ,  H01L33/20

CPC分类号： H01L33/62 ,  H01L25/0753 ,  H01L33/20 ,  H01L2933/0066

摘要： A wiring substrate includes a base body, a metal member, and an insulating member. The base body is insulating and has a first surface and a second surface on an opposite side to the first surface. The base body includes a groove portion provided on a second surface side, and a through hole connecting the first surface and a bottom surface of the groove portion. The metal member is disposed in the groove portion on the bottom surface side of the groove portion and in the through hole away from an opening of the groove portion. The insulating member is disposed so as to close the opening of the groove portion.

公开(公告)号：US20230420269A1

公开(公告)日：2023-12-28

申请号：US18342424

申请日：2023-06-27

申请人： NICHIA CORPORATION

发明人： Eiko MINATO ,  Masaaki KATSUMATA ,  Atsushi HOSOKAWA

IPC分类号： H01L21/48 ,  H01L33/62 ,  H01L23/498

CPC分类号： H01L21/4867 ,  H01L33/62 ,  H01L23/49827 ,  H01L2933/0066 ,  H01L25/0753

摘要： A method of manufacturing a wiring substrate includes providing a conductive paste including metal nanoparticles, metal particles, and a resin, disposing the conductive paste on at least a first surface of an insulating base body, and forming a wiring layer by heating and pressurizing the conductive paste by using a roll press or a hard SUS plate. In the providing the conductive paste, the ratio of a mass of the metal nanoparticles to the total mass of the metal nanoparticles and the metal particles is in a range of 5 mass % to 95 mass %, and the conductive paste is heated and pressurized such that part of the wiring layer in a thickness direction is embedded in at least the first surface of the insulating base body.