公开(公告)号：US20240038957A1

公开(公告)日：2024-02-01

申请号：US18360076

申请日：2023-07-27

Applicant: NICHIA CORPORATION

Inventor： Atsushi HOSOKAWA ,  Masaaki KATSUMATA

IPC: H01L33/62 ,  H01L27/15 ,  H01L25/075

CPC classification number: H01L33/62 ,  H01L27/156 ,  H01L25/0753 ,  H01L2933/0066

Abstract: A wiring substrate includes: a base body having an insulating property and including a first surface and a second surface on a side opposite the first surface; a resist portion covering at least part of the first surface and at least a part of the second surface of the base body and including a hole portion having a predetermined pattern; and a wiring line disposed in the hole portion of the resist portion so as to be in contact with the base body. In a cross-sectional view in a thickness direction of the base body, a length of an exposed surface of the wiring line exposed from the resist portion is less than a length of a contact surface of the wiring line in contact with the base body.

公开(公告)号：US20250096054A1

公开(公告)日：2025-03-20

申请号：US18830590

申请日：2024-09-11

Applicant: NICHIA CORPORATION

Inventor： Eiko MINATO ,  Atsushi HOSOKAWA ,  Akiko NAGAE ,  Takashi KAWAMATA

IPC: H01L23/15 ,  C04B41/00 ,  C04B41/45 ,  C04B41/51 ,  C04B41/52 ,  C04B41/88 ,  C04B41/90 ,  H01L21/48 ,  H01L23/00 ,  H01L23/498

Abstract: A wiring substrate includes a ceramic substrate having an upper surface, a lower surface, and a lateral surface. The lower surface includes a first lower surface and a second lower surface inward from the first lower surface. The lateral surface includes a first lateral surface and a second lateral surface inward from the first lateral surface. The wiring substrate includes a first wiring having a thickness of 80% or more of a height from the second lower surface to the first lower surface and disposed in contact with the second lower surface and the second lateral surface. A lateral surface of the first wiring is exposed from the first lateral surface. A main surface of 50% or more of a surface area of a lower surface of the first wiring is substantially parallel to the second lower surface and is disposed inward from the first lower surface.

公开(公告)号：US20250081701A1

公开(公告)日：2025-03-06

申请号：US18813021

申请日：2024-08-23

Applicant: NICHIA CORPORATION

Inventor： Hiroto KUME ,  Atsushi HOSOKAWA

IPC: H01L33/64

Abstract: A bonded substrate includes a metal plate; a first ceramic; and a first metal body disposed between a first surface of the metal plate and a first surface of the first ceramic and disposed on 80% or more of a lateral surface continuous with the first surface of the first ceramic.

公开(公告)号：US20250034051A1

公开(公告)日：2025-01-30

申请号：US18765311

申请日：2024-07-07

Applicant: NICHIA CORPORATION

Inventor： Atsushi HOSOKAWA

IPC: C04B37/02

Abstract: A composite substrate including a metal substrate having a first surface and a second surface opposite to the first surface, a ceramic substrate, and a bonding member disposed on the first surface. The bonding member bonds the metal substrate and the ceramic substrate. The ceramic substrate includes a plurality of sections and a groove between sections of the plurality of sections adjacent to each other. The bonding member is present in the groove.

公开(公告)号：US20240213427A1

公开(公告)日：2024-06-27

申请号：US18389775

申请日：2023-12-20

Applicant: NICHIA CORPORATION

Inventor： Atsushi HOSOKAWA ,  Masaaki KATSUMATA ,  Eiko MINATO

IPC: H01L33/62 ,  H01L33/52 ,  H01L33/60

CPC classification number: H01L33/62 ,  H01L33/52 ,  H01L33/60 ,  H01L24/16 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A wiring substrate including a base body provided with a via hole, a conductive portion disposed in the via hole, and a wiring portion electrically connected to the conductive portion and disposed on a surface of the body. The conductive portion includes a first conductive member containing copper particles and a resin. The first member contains small-sized particles with a particle size from 0.1 μm to 1.0 μm and large-sized particles with a particle size from more than 1.0 μm to 10 μm. The wiring portion includes a second conductive member containing copper particles. The second member contains small-sized particles with a particle size from 0.1 μm to 1.0 μm and large-sized particles with a particle size from more than 1.0 μm to 10 μm. A weight proportion of the small-sized particles in the first member is lower than a weight proportion of the small-sized particles in the second member.

公开(公告)号：US20240405176A1

公开(公告)日：2024-12-05

申请号：US18671989

申请日：2024-05-23

Applicant: NICHIA CORPORATION

Inventor： Atsushi HOSOKAWA ,  Masaaki KATSUMATA

IPC: H01L33/62 ,  H01L33/64

Abstract: A method includes providing a ceramic substrate having a first arrangement portion recessed from a first planar portion; disposing a first conductive paste containing a first metal powder in the first arrangement portion; obtaining a first conductor by firing the first conductive paste; forming first recessed portions on a surface of the first conductor disposed in the first arrangement portion by polishing the first conductor and the ceramic substrate so that the first conductor and the first surface form a same plane; disposing a second conductive paste containing a second metal powder and a second organic resin binder in the first recessed portions; obtaining a second conductor by curing the second conductive paste; polishing the second conductor so that the second conductor and the first conductor form the same plane; and forming a first metal layer on surfaces of the first conductor and the second conductor.

公开(公告)号：US20240355987A1

公开(公告)日：2024-10-24

申请号：US18637994

申请日：2024-04-17

Applicant: NICHIA CORPORATION

Inventor： Masaaki KATSUMATA ,  Eiko MINATO ,  Takashi KAWAMATA ,  Atsushi HOSOKAWA

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/20

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L33/20 ,  H01L2933/0066

Abstract: A wiring substrate includes a base body, a metal member, and an insulating member. The base body is insulating and has a first surface and a second surface on an opposite side to the first surface. The base body includes a groove portion provided on a second surface side, and a through hole connecting the first surface and a bottom surface of the groove portion. The metal member is disposed in the groove portion on the bottom surface side of the groove portion and in the through hole away from an opening of the groove portion. The insulating member is disposed so as to close the opening of the groove portion.

公开(公告)号：US20230420269A1

公开(公告)日：2023-12-28

申请号：US18342424

申请日：2023-06-27

Applicant: NICHIA CORPORATION

Inventor： Eiko MINATO ,  Masaaki KATSUMATA ,  Atsushi HOSOKAWA

IPC: H01L21/48 ,  H01L33/62 ,  H01L23/498

CPC classification number: H01L21/4867 ,  H01L33/62 ,  H01L23/49827 ,  H01L2933/0066 ,  H01L25/0753

Abstract: A method of manufacturing a wiring substrate includes providing a conductive paste including metal nanoparticles, metal particles, and a resin, disposing the conductive paste on at least a first surface of an insulating base body, and forming a wiring layer by heating and pressurizing the conductive paste by using a roll press or a hard SUS plate. In the providing the conductive paste, the ratio of a mass of the metal nanoparticles to the total mass of the metal nanoparticles and the metal particles is in a range of 5 mass % to 95 mass %, and the conductive paste is heated and pressurized such that part of the wiring layer in a thickness direction is embedded in at least the first surface of the insulating base body.