公开(公告)号：US20180097152A1

公开(公告)日：2018-04-05

申请号：US15720346

申请日：2017-09-29

Applicant: NICHIA CORPORATION

Inventor： Seitaro AKAGAWA ,  Kazuki KODA

IPC: H01L33/50 ,  H01L25/075

Abstract: A method for manufacturing a light emitting device includes: mounting a first light emitting element whose emission peak wavelength is in a range of 430 nm to 490 nm and a second light emitting element whose emission peak wavelength is in a range of 490 nm to 570 nm; and providing a light transmitting member including a red phosphor and at least one of a green phosphor of which a half width of an emission spectrum is not more than 45 nm and a blue phosphor of which a half width of an emission spectrum is not more than 60 nm. The step of providing the light transmitting member includes adding at least one of a predetermined amount of the green phosphor and a predetermined amount of the blue phosphor based on the emission peak wavelength of the second light emitting element.

公开(公告)号：US20180375004A1

公开(公告)日：2018-12-27

申请号：US16019408

申请日：2018-06-26

Applicant: NICHIA CORPORATION

Inventor： Ryohei YAMASHITA ,  Seitaro AKAGAWA ,  Toshiyuki HASHIMOTO ,  Kazuki KODA ,  Kiyoshi KAYAMA ,  Yuta HORIKAWA ,  Ryosuke WAKAKI

IPC: H01L33/62 ,  H01L25/075 ,  H01L25/16 ,  H01L29/866 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/64 ,  H01L23/00

Abstract: A light emitting device includes a resin package having a rectangular shape in a top view and two short-side lateral surfaces and two long-side lateral surfaces. The two short-side lateral surfaces include a first external surface and a second external surface located on an opposite side from the first external surface. The two long-side lateral surfaces include a third external surface and a fourth external lateral surface located on an opposite side from the third external lateral surface. The lead is not exposed on the third external lateral surface nor the fourth external lateral surface. The first lead is exposed at the first external lateral surface and the second external lateral surface, respectively flush with the resin member at the first external lateral surface and the second external lateral surface. The second lead is exposed at the second external lateral surface, flush with the resin part at the second external lateral surface.