公开(公告)号：US20140369052A1

公开(公告)日：2014-12-18

申请号：US14299065

申请日：2014-06-09

Applicant: NICHIA CORPORATION

Inventor： Yukiko OSHIMA ,  Yoshiki SATO ,  Toshiyuki OKAZAKI ,  Takayoshi WAKAKI

IPC: F21V15/01

CPC classification number: H01L33/44 ,  H01L33/486 ,  H01L33/644 ,  H01L2224/48247 ,  H01L2224/48257 ,  Y10T29/49002

Abstract: A light emitting device has a light emitting element, a package, a lead, and a cover film. The package is arranged to form at least part of an inner peripheral face of a recess portion. The light emitting element is housed in the recess portion. The lead is disposed on a bottom face of the recess portion. The lead is electrically connected to the light emitting element. The cover film is arranged to cover the inner peripheral face of the recess portion. The cover film has light transmissive and electrical insulation. The package includes a base material and a plurality of particles. The base material includes a resin. A coefficient of thermal expansion of the particles is different from a coefficient of thermal expansion of the base material. The particles are disposed at least near the inner peripheral face of the recess portion.

Abstract translation: 发光器件具有发光元件，封装，引线和覆盖膜。 所述包装被配置成形成凹部的内周面的至少一部分。 发光元件容纳在凹部中。 引线设置在凹部的底面上。 引线电连接到发光元件。 盖膜布置成覆盖凹部的内周面。 覆盖膜具有透光和电绝缘。 包装包括基材和多个颗粒。 基材包括树脂。 颗粒的热膨胀系数与基材的热膨胀系数不同。 颗粒至少设置在凹部的内周面附近。

公开(公告)号：US20180108813A1

公开(公告)日：2018-04-19

申请号：US15837434

申请日：2017-12-11

Applicant: NICHIA CORPORATION

Inventor： Yukiko OSHIMA ,  Yoshiki SATO ,  Toshiyuki OKAZAKI ,  Takayoshi WAKAKI

IPC: H01L33/44 ,  H01L33/64 ,  H01L33/48

CPC classification number: H01L33/44 ,  H01L33/486 ,  H01L33/644 ,  H01L2224/48247 ,  H01L2224/48257 ,  Y10T29/49002

Abstract: A method for manufacturing a light emitting device includes: integrally molding a package and a lead, the package arranged to form at least part of an inner peripheral face of a recess portion in which the light emitting element is housed, the package including a base material and a plurality of particles, the base material including a resin, a coefficient of thermal expansion of the particles being different from a coefficient of thermal expansion of the base material; and covering the inner peripheral face of the recess portion with a cover film, the cover film having light transmissive and electrical insulation.