公开(公告)号：US20240113492A1

公开(公告)日：2024-04-04

申请号：US18473012

申请日：2023-09-22

Applicant: NICHIA CORPORATION

Inventor： Tadayuki KITAJIMA ,  Soichiro MIURA ,  Munetake FUKUNAGA ,  Yusuke MORI

IPC: H01S5/00

CPC classification number: H01S5/0087

Abstract: A light-emitting device includes a semiconductor laser element, a wavelength conversion member, and a package. The wavelength conversion member includes a wavelength conversion portion and a reflective portion. The wavelength conversion portion includes a light incident surface and a light-emitting surface. The package includes a disposition region. The wavelength conversion member is disposed at a position away in a first direction from a position at which the semiconductor laser element is disposed. The light-emitting surface has a shape that, in a plan view perpendicular to the light-emitting surface, has a first region decreasing in width in a second direction perpendicular to the first direction from the side closest to the semiconductor laser element toward the first direction.