公开(公告)号：US20240258768A1

公开(公告)日：2024-08-01

申请号：US18631271

申请日：2024-04-10

Applicant: NICHIA CORPORATION

Inventor： Soichiro MIURA ,  Takuya HASHIMOTO

IPC: H01S5/026 ,  F21K9/235 ,  H01L33/60 ,  H01S5/40

CPC classification number: H01S5/0267 ,  F21K9/235 ,  H01S5/0261 ,  H01S5/4031 ,  H01L33/60

Abstract: A light emitting device includes: a package having a light extraction face that has a light transmitting region, and including a base that has a mounting face; a first light emitting element disposed on the mounting face in the package and having a first emission face configured to emit divergent light, the first emission face being perpendicular to the mounting face of the base and parallel to the light extraction face; and a second light emitting element disposed on the mounting face in the package and having a second emission face configured to emit divergent light, the second emission face being perpendicular to the mounting face of the base and parallel to the light extraction face. The light emitted from the first light emitting element exits from the package through the light transmitting region.

公开(公告)号：US20240213739A1

公开(公告)日：2024-06-27

申请号：US18600738

申请日：2024-03-10

Applicant: NICHIA CORPORATION

Inventor： Soichiro MIURA ,  Ryota OKUNO

IPC: H01S5/02345 ,  H01S5/00 ,  H01S5/02255 ,  H01S5/023 ,  H01S5/02315 ,  H01S5/0233 ,  H01S5/042 ,  H01S5/40

CPC classification number: H01S5/02345 ,  H01S5/0071 ,  H01S5/02255 ,  H01S5/023 ,  H01S5/02315 ,  H01S5/0233 ,  H01S5/0425 ,  H01S5/4025

Abstract: A light emitting device includes a base, a frame, first and second semiconductor laser elements, one or more light-reflective members, and wires. The frame part has first inner lateral surfaces, second inner lateral surfaces, a first and second step-parts respectively formed along the second inner lateral surfaces. The wires are bonded to an upper surface of the first step-part or an upper surface of the second step-part. The first semiconductor laser element is disposed closer to the first step-part.
The second semiconductor laser element is disposed closer to the second step-part. All of the wires that electrically connect the first semiconductor laser element to the frame part are not bonded to the upper surface of the second step-part. All of the wires that electrically connect the second semiconductor laser element to the frame part are not bonded to the upper surface of the first step-part.

公开(公告)号：US20230090933A1

公开(公告)日：2023-03-23

申请号：US17947294

申请日：2022-09-19

Applicant: NICHIA CORPORATION

Inventor： Soichiro MIURA ,  Shota TAKASE

IPC: H01L33/48

Abstract: A light emitting device includes a semiconductor light emitting element and a package that seals the semiconductor light emitting element. The package includes a base having a first upper surface region directly or indirectly supporting the semiconductor light emitting element, and a second upper surface region surrounding the first upper surface region in a plan view viewed in a direction normal to the first upper surface region. The package further includes a cover bonded to the base, an inner metal layer disposed on the second upper surface region of the base, an outer metal layer extending along the outer edge of the inner metal layer, and a slit part on the second upper surface region between the inner metal layer and the outer metal layer. In the plan view, the inner edge of the inner metal layer is positioned inward of the outer edge of the cover. In the plan view, at least a portion of the outer edge of the outer metal layer is positioned outward of the outer edge of the cover. The cover is bonded to the base via a bonding material disposed on the inner metal layer.

公开(公告)号：US20220320822A1

公开(公告)日：2022-10-06

申请号：US17845464

申请日：2022-06-21

Applicant: NICHIA CORPORATION

Inventor： Takuya HASHIMOTO ,  Soichiro MIURA

IPC: H01S5/02257 ,  H01S5/02208 ,  H01S5/40 ,  H01S5/02255

Abstract: A light emitting device includes a package, a cap fixed to the package, and at least one laser element. The cap includes a light-transmissive member having a lower surface facing the package and an upper surface opposite to the lower surface, and a light blocking film arranged on the lower surface of the light-transmissive member and having a shape which has at least one opening. The at least one laser element is disposed in a space bounded by the cap and the package at a position such that the at least one opening is irradiated by laser light emitted from the at least one laser element, at least a part of each of the at least one laser element being disposed in the at least one opening in the light blocking film in a top view.

公开(公告)号：US20200251881A1

公开(公告)日：2020-08-06

申请号：US16774516

申请日：2020-01-28

Applicant: NICHIA CORPORATION

Inventor： Masatoshi NAKAGAKI ,  Soichiro MIURA

IPC: H01S5/022 ,  H01S5/40

Abstract: A mount member includes first and second conduction parts. In the first conduction part, as seen in a top view, a length in a first direction parallel to an emission end surface of a first semiconductor laser element is smaller than a length in a second direction perpendicular to the emission end surface, and, in relation to the second direction, a first wiring region extends from a first mounting region in a direction from the light emission end surface to an opposite end surface. In relation to the second direction, a second conduction part extends further than the first conduction part in a direction from an emission end surface to an opposite end surface of a second semiconductor laser element, and from a region where the second conduction part extends further than the first conduction part, the second conduction part extends toward the first conduction part in the first direction.

公开(公告)号：US20200235548A1

公开(公告)日：2020-07-23

申请号：US16748246

申请日：2020-01-21

Applicant: NICHIA CORPORATION

Inventor： Soichiro MIURA ,  Ryota OKUNO

IPC: H01S5/022 ,  H01S5/40

Abstract: A light emitting device includes semiconductor laser elements, a frame part, a light-reflective member, a step part, metal films, wires, and a first protective element. The frame part surrounds a bottom surface on which the semiconductor laser elements are disposed. The light-reflective member is disposed on the bottom surface inside of a frame formed by the frame part. The step part is formed along a second inner lateral surface of the frame part, and disposed inside of the frame. The metal films are provided on an upper surface of the step part. The wires electrically connect the semiconductor laser elements respectively to the metal films. The first protective element is disposed on the upper surface of the step part and on a light traveling side of the laser light with respect to a plane including an emitting end surface of the first semiconductor laser element.

公开(公告)号：US20190234565A1

公开(公告)日：2019-08-01

申请号：US16259989

申请日：2019-01-28

Applicant: NICHIA CORPORATION

Inventor： Tadayuki KITAJIMA ,  Soichiro MIURA

IPC: F21K9/64 ,  F21V7/10 ,  F21V11/16 ,  F21V13/10

CPC classification number: F21K9/64 ,  F21V7/10 ,  F21V11/16 ,  F21V13/10 ,  F21Y2115/30 ,  H01S5/005 ,  H01S5/0071

Abstract: A light emitting device includes: a base; a first semiconductor laser element disposed on an upper surface of the base and configured to emit first light; a first light reflecting member disposed on the upper surface of the base and configured to reflect the first light upwards; a phosphor member having a lower surface onto which the first light is irradiated and an upper surface serving as a light extraction surface; and a light shielding member surrounding lateral surfaces of the phosphor member. First and second regions of the first light reflecting member are formed such that a portion of the light reflected by the first region that is reflected on a side close to the second region and a portion of the light reflected by the second region that is reflected on a side close to the first region intersect before reaching the lower surface of the phosphor member.

公开(公告)号：US20230209715A1

公开(公告)日：2023-06-29

申请号：US18069805

申请日：2022-12-21

Applicant: NICHIA CORPORATION

Inventor： Soichiro MIURA

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/11 ,  H01S3/23

CPC classification number: H05K1/181 ,  H01S3/2383 ,  H05K1/113 ,  H05K1/0274 ,  H05K2201/09409 ,  H05K2201/09609 ,  H05K2201/10121 ,  H05K2201/10522

Abstract: A wiring board includes: an insulating member having a first upper surface, and a second upper surface located higher than the first upper surface; and a first wiring layer located on the first upper surface. The first upper surface has a wiring region that does not overlap with the second upper surface in a top view, and that is located in an exposed region. The first wiring layer extends from the wiring region to a connecting region that is connected to the wiring region, that overlaps with the second upper surface in a top view, and that is not exposed. The first wiring layer comprises a first pad portion located in the wiring region, and a first pattern portion located in the connecting region.

公开(公告)号：US20230147991A1

公开(公告)日：2023-05-11

申请号：US18149241

申请日：2023-01-03

Applicant: NICHIA CORPORATION

Inventor： Soichiro MIURA ,  Ryota OKUNO

IPC: H01S5/02326

CPC classification number: H01S5/02326

Abstract: A light emitting device includes: a plurality of laser elements including a first laser element and a second laser element; a case enclosing the laser elements and including a light-transmissive region; and a plurality of main lenses including a first main lens configured to collimate or converge light emitted from the first laser element and a second main lens configured to collimate or converge light emitted from the second laser element. At least a first portion of the light-transmissive region is disposed on a first imaginary line passing through a light emitting end surface of the first laser element and the first main lens, and at least a second portion of the light-transmissive region is disposed on a second imaginary line passing through a light emitting end surface of the second laser element and the second main lens.

公开(公告)号：US20220113548A1

公开(公告)日：2022-04-14

申请号：US17561698

申请日：2021-12-23

Applicant: NICHIA CORPORATION

Inventor： Soichiro MIURA

IPC: G02B27/09 ,  G02B27/14 ,  G02B27/28 ,  G02B19/00

Abstract: A polarization control member includes a first dichroic mirror having a first incident face, a second dichroic mirror joined to the first dichroic mirror, the second dichroic mirror having a second incident face, and a waveplate joined to the first incident face of the first dichroic mirror.