公开(公告)号：US10742859B2

公开(公告)日：2020-08-11

申请号：US15785374

申请日：2017-10-16

申请人： NINGBO SUNNY OPOTECH CO., LTD.

发明人： Mingzhu Wang ,  Zhenyu Chen ,  Nan Guo ,  Takehiko Tanaka ,  Bojie Zhao ,  Zhong Deng

IPC分类号： H04N5/225 ,  H05K1/02 ,  H05K1/18 ,  H05K3/28 ,  B29C43/18 ,  B29C33/44 ,  B29C45/40 ,  G02B7/10 ,  B29C70/72 ,  B29C70/88 ,  G02B13/00 ,  B29C45/14 ,  B29C43/36 ,  B29C43/52 ,  G02B7/02 ,  B29D11/00 ,  B29L31/00 ,  B29K101/12 ,  B29L31/34 ,  B29C45/00

摘要： A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.