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公开(公告)号：US12007585B2
公开(公告)日：2024-06-11
申请号：US17285052
申请日：2019-09-12
发明人： Mingzhu Wang , Lifeng Yao , Zhenyu Chen
CPC分类号： G02B3/04 , G02B5/20 , G02B7/021 , G02B7/025 , G03B30/00 , H04M1/0264 , H04N23/55 , H04N23/57
摘要： A terminal device having a camera module having an optical camera lens is provided. The optical camera lens includes: a lens barrel having an axis and a lens barrel side face surrounding the axis, wherein the lens barrel side face includes a first side and a second side opposite to the first side and a lens sheet set mounted in the lens barrel and including a plurality of lenses, wherein the plurality of lenses include at least one free-form lens, and the at least one free-form lens is adapted to deflect incident light toward the second side, so that an imaging plane of an optical system composed of the plurality of lens sheets is deflected toward the second side.
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公开(公告)号：US11728368B2
公开(公告)日：2023-08-15
申请号：US17352961
申请日：2021-06-21
发明人： Mingzhu Wang , Bojie Zhao , Takehiko Tanaka , Zhenyu Chen , Heng Jiang , Nan Guo
IPC分类号： H01L27/146 , H01L21/02 , H01L23/06 , H04N23/57
CPC分类号： H01L27/14683 , H01L21/02 , H01L23/06 , H01L27/14618 , H04N23/57
摘要： The present invention provides a semiconductor packaging method and semiconductor device based on a molding process. In the packaging method, first, at least a portion of a compensation part is kept on at least a portion of a bonding region formed between a first adjoining surface of a semiconductor element and a second adjoining surface of a packaging component, to form a semi-finished product of a semiconductor device; then, during hardening of the packaging component, the compensation part is caused to undergo different degrees of deformation at different positions to compensate for a difference between a magnitude of deformation of the packaging component and a magnitude of deformation of the semiconductor element, so as to package the semiconductor element to form the semiconductor device. By means of the method, undesirable phenomena such as cracking and deformation of the surface of the semiconductor element can be avoided.
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公开(公告)号：US11627239B2
公开(公告)日：2023-04-11
申请号：US17540642
申请日：2021-12-02
发明人： Mingzhu Wang , Zhenyu Chen , Takehiko Tanaka , Zhongyu Luan , Bojie Zhao , Zhen Huang , Nan Guo , Fengsheng Xi , Heng Jiang , Zilong Deng
IPC分类号： H04N5/225
摘要： A camera module and its photosensitive assembly and manufacturing method thereof are provided. The photosensitive assembly includes a photosensitive element, a window circuit board and a packaging body integrally packaged the photosensitive element and the window circuit board to form an integrated body, wherein the window circuit board has at least one window for receiving the photosensitive element therein.
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公开(公告)号：US11601576B2
公开(公告)日：2023-03-07
申请号：US17404633
申请日：2021-08-17
发明人： Mingzhu Wang , Takehiko Tanaka , Zhenyu Chen , Nan Guo , Bojie Zhao , Zhewen Mei
摘要： An array camera module having a height difference, a circuit board assembly and a manufacturing method therefor, and an electronic device. The array camera module comprises a first camera module unit and a second camera module unit, wherein the first camera module unit comprises at least one first photosensitive assembly and at least one first lens; the first lens is located on a photosensitive path of the first photosensitive assembly; the first photosensitive assembly comprises at least one extension portion; the extension portion at least partially extends towards the direction away from the first photosensitive assembly; and the second camera module unit is fixedly connected to a second extension portion, so that the ends of the two camera module units are consistent.
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公开(公告)号：US11531183B2
公开(公告)日：2022-12-20
申请号：US16765005
申请日：2018-10-16
发明人： Zhenyu Chen , Hongde Tu , Yinli Fang , Hui Qiu
摘要： An optical assembly, a camera module having the optical assembly, and a smart device having the camera module. The optical assembly comprises: a lens module (10) having an outer frame (12), wherein the outer frame (12) comprises four side surfaces divided according to an angle range, the lens module (10) comprises a first support portion (13) and a second support portion (14) on each side surface of the outer frame (12), and both the first support portion (13) and the second support portion (14) on each side surface are located at a group of diagonal regions (12A) of the outer frame (12); and a fixing means (30) disposed at another group of diagonal regions (12B) of the outer frame (12) of the lens module (10), wherein the fixing means (30) has a first power supply fixing portion (311) and a first groundwire fixing portion (321) corresponding to the first support portion (13), and a second power supply fixing portion (331) and a second groundwire fixing portion (322) corresponding to the second support portion (14), on a respective fixing surface corresponding to each side surface of the outer frame (12).
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公开(公告)号：US11451693B2
公开(公告)日：2022-09-20
申请号：US17314723
申请日：2021-05-07
发明人： Mingzhu Wang , Duanliang Cheng , Fengsheng Xi , Bojie Zhao , Takehiko Tanaka , Zhen Huang , Zhenyu Chen , Nan Guo
摘要： The present invention provides a camera module and a molding circuit board assembly, circuit board and application thereof, the circuit board comprising a digital circuit unit, an analog circuit unit and a substrate. The digital circuit nit and the analog circuit unit are respectively formed on the substrate, and the digital circuit unit and the analog circuit unit are conductively connected to each other, wherein at least one part of the analog circuit unit has a safe distance from the digital circuit unit, so as to prevent an electromagnetic wave generated by a circuit of the digital circuit unit from interfering with an electrical signal transmitted and processed by the analog circuit unit, thereby improving the stability and reliability of the transmission and the processing of the electrical signal by the circuit board.
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公开(公告)号：US11289521B2
公开(公告)日：2022-03-29
申请号：US16088435
申请日：2016-10-25
发明人： Mingzhu Wang , Zhenyu Chen , Nan Guo , Bojie Zhao , Takehiko Tanaka , Zhen Huang , Zhongyu Luan , Heng Jiang
IPC分类号： H01L27/146 , H04N5/225 , H01L23/00
摘要： A molded photosensitive assembly of a camera module includes at least one supporting member formed by a first substance, at least one photosensitive element, at least one circuit board, at least one set of wires electrically connecting the photosensitive element to the circuit board, and at least one molded base. Two ends of each of the wires are respectively connected to a chip connector of the photosensitive element and a circuit connector of the circuit board. The molded base is formed by a second substance and comprises a molded body and has at least one light window, wherein the photosensitive element and the wires are protected by a supporting member which is provided for avoiding an upper mold of a molding-die pressing on the wires during the molding process.
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公开(公告)号：US20210377427A1
公开(公告)日：2021-12-02
申请号：US17404633
申请日：2021-08-17
发明人： Mingzhu Wang , Takehiko Tanaka , Zhenyu Chen , Nan Guo , Bojie Zhao , Zhewen Mei
摘要： An array camera module having a height difference, a circuit board assembly and a manufacturing method therefor, and an electronic device. The array camera module comprises a first camera module unit and a second camera module unit, wherein the first camera module unit comprises at least one first photosensitive assembly and at least one first lens; the first lens is located on a photosensitive path of the first photosensitive assembly; the first photosensitive assembly comprises at least one extension portion; the extension portion at least partially extends towards the direction away from the first photosensitive assembly; and the second camera module unit is fixedly connected to a second extension portion, so that the ends of the two camera module units are consistent.
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公开(公告)号：US11081518B2
公开(公告)日：2021-08-03
申请号：US16578014
申请日：2019-09-20
发明人： Mingzhu Wang , Bojie Zhao , Takehiko Tanaka , Zhenyu Chen , Heng Jiang , Nan Guo
IPC分类号： H01L27/146 , H01L21/02 , H01L23/06 , H04N5/225
摘要： The present invention provides a semiconductor packaging method and semiconductor device based on a molding process. In the packaging method, first, at least a portion of a compensation part is kept on at least a portion of a bonding region formed between a first adjoining surface of a semiconductor element and a second adjoining surface of a packaging component, to form a semi-finished product of a semiconductor device; then, during hardening of the packaging component, the compensation part is caused to undergo different degrees of deformation at different positions to compensate for a difference between a magnitude of deformation of the packaging component and a magnitude of deformation of the semiconductor element, so as to package the semiconductor element to form the semiconductor device. By means of the method, undesirable phenomena such as cracking and deformation of the surface of the semiconductor element can be avoided.
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公开(公告)号：US10742859B2
公开(公告)日：2020-08-11
申请号：US15785374
申请日：2017-10-16
发明人： Mingzhu Wang , Zhenyu Chen , Nan Guo , Takehiko Tanaka , Bojie Zhao , Zhong Deng
IPC分类号： H04N5/225 , H05K1/02 , H05K1/18 , H05K3/28 , B29C43/18 , B29C33/44 , B29C45/40 , G02B7/10 , B29C70/72 , B29C70/88 , G02B13/00 , B29C45/14 , B29C43/36 , B29C43/52 , G02B7/02 , B29D11/00 , B29L31/00 , B29K101/12 , B29L31/34 , B29C45/00
摘要： A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.
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