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公开(公告)号:US20220386676A1
公开(公告)日:2022-12-08
申请号:US17779298
申请日:2020-03-25
Applicant: NISSHA CO., LTD.
Inventor: Masateru CHIYAMA , Ikuya TAKAHASHI , Mariko SANADA , Hiroyuki NAGAI
Abstract: An edible powder formed of particles smaller than a film thickness, a predetermined component, and an edible liquid having a mass 35% or less of a mass of the powder are kneaded to generate a plastic solid material containing a liquid. The solid material is extruded from a mold to plastically deform the solid material and a predetermined cross-sectional shape is imparted to the solid material. The solid material having the predetermined cross-sectional shape is sliced with a cutting edge so as to have a film shape having a predetermined thickness.
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公开(公告)号:US20190134368A1
公开(公告)日:2019-05-09
申请号:US16201300
申请日:2018-11-27
Applicant: Nissha Co., Ltd.
Inventor: Hiroyuki NAGAI , Kensaku AKITA , Masateru CHIYAMA
Abstract: Provided is an inexpensive microneedle array with little dimensional error that can control, with high precision, the amount of a predetermined component to be introduced to the inner part of the skin, and a production method for this microneedle array. A foundation that is insoluble or sparingly soluble in inner part of the skin is overlaid on a mold. A plurality of frustum-shaped protrusions, which are insoluble or sparingly soluble in the raw material liquid, provided on a first main surface of the foundation are fit into a plurality of cone-shaped recesses. The raw material liquid in the plurality of cone-shaped recesses dries and, as a result, a plurality of microneedles, which are dissolvable in the inner part of the skin, are fixed to tip surfaces of the plurality of frustum-shaped protrusions.
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公开(公告)号:US20180259315A1
公开(公告)日:2018-09-13
申请号:US15759861
申请日:2016-10-14
Applicant: NISSHA CO., LTD.
Inventor: Kazuto NAKAMURA , Yoshihiro SAKATA , Eiji KAWASHIMA , Rokusuke TAKEMURA , Koji OKAMOTO , Hiroyuki NAGAI
IPC: G01B7/16
CPC classification number: G01B7/18 , G01B7/16 , G01B7/20 , G01L1/205 , G01L1/2287
Abstract: A multipoint-measurement strain sensor which is free of a conduction failure originated from slippage at the time of lamination and which can reduce the material cost, and a method for producing the multipoint-measurement strain sensor are provided. A multipoint-measurement strain sensor 31 of the present invention includes a substrate film 34, a plurality of strain-sensing parts 33 formed on a first main surface 34a of the substrate film 34, routing circuits 37, 38 formed, in correspondence with the respective strain-sensing parts 33, on a second main surface 34b of the substrate film 34, and having outer connection terminals 37b, 38b near an outer edge of the substrate film 34, and a conductive paste 41, 42 to fill via holes 39, 40 such that each of the strain-sensing parts 33 is connected to the corresponding routing circuit 37, 38.
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