FINE PARTICLE PRODUCTION METHOD AND FINE PARTICLES

    公开(公告)号:US20210069782A1

    公开(公告)日:2021-03-11

    申请号:US16965279

    申请日:2019-01-10

    Abstract: Provided are: a fine particle production method that makes it possible to control the acidity, i.e., a surface property, of fine particles; and fine particles. A fine particle production method in which a raw material powder is used to produce fine particles by means of a gas phase method. The fine particle production method has a step for supplying an organic acid to raw material fine particles. The gas phase method is, for example, a thermal plasma method or a flame method. The fine particles have a surface coating that includes at least a carboxyl group.

    SILVER FINE PARTICLE PRODUCTION METHOD AND SILVER FINE PARTICLES

    公开(公告)号:US20200346286A1

    公开(公告)日:2020-11-05

    申请号:US16963796

    申请日:2019-01-10

    Abstract: Provided are: a production method for silver fine particles that retain capabilities such as conductivity and make it possible to form wiring at even lower temperatures; and silver fine particles. A silver fine particle production method in which silver powder is used to produce silver fine particles by means of a gas phase method. The silver fine particle production method has a step for supplying an organic acid to the silver fine particles. The gas phase method is, for example, a plasma method or a flame method. The silver fine particles have a surface coating that includes at least a carboxyl group.

    FINE PARTICLE PRODUCTION DEVICE AND FINE PARTICLE PRODUCTION METHOD

    公开(公告)号:US20220402029A1

    公开(公告)日:2022-12-22

    申请号:US17777196

    申请日:2020-11-10

    Abstract: Provided is a fine particle production apparatus and a fine particle production method capable of easily obtaining surface treated fine particles. The fine particle production apparatus produces fine particles using feedstock by means of a gas-phase process. The apparatus includes a treatment section configured to transform the feedstock into a mixture in a gas phase state by means of the gas-phase process, a feedstock supply section configured to supply the feedstock to the treatment section, a cooling section configured to cool the mixture in a gas phase state in the treatment section using a quenching gas containing an inert gas, and a supply section configured to supply a surface treating agent to fine particle bodies in a temperature region in which the surface treating agent is not denatured, the fine particle bodies being produced by cooling the mixture in the gas phase state with the quenching gas.

    FINE PARTICLES AND FINE PARTICLE PRODUCTION METHOD

    公开(公告)号:US20220402025A1

    公开(公告)日:2022-12-22

    申请号:US17777459

    申请日:2020-09-29

    Abstract: Fine particles that can be sintered and grow to 100 nm or larger without oxidation even when retained at a baking temperature in an oxygen-containing atmosphere and that can suppress oxidation in a long-term preservation in the air or other oxygen-containing atmospheres, a method of producing the fine particles, and a method of producing fine particles that can suppress oxidation in a collecting process after the production of the fine particles. A fine particle production method for producing fine particles using feedstock powder by means of a gas-phase process includes a step of producing fine particle bodies by converting the feedstock powder into a mixture in a gas phase state using a gas-phase process and cooling the mixture in a gas phase state with a quenching gas containing an inert gas and a hydrocarbon gas having 4 or less carbon atoms, and a step of supplying an organic acid to the produced fine particle bodies.

    COPPER MICROPARTICLES
    8.
    发明申请

    公开(公告)号:US20200368811A1

    公开(公告)日:2020-11-26

    申请号:US16961612

    申请日:2019-01-10

    Abstract: Provided are copper microparticles which have exceptional oxidation resistance, in which oxidation is reduced even when the copper microparticles are held at a firing temperature in an oxygen-containing atmosphere, and in which sintering also occurs. The copper microparticles have a particle diameter of 10-100 nm, have a surface coating material, and are such that, after the copper microparticles are held for one hour at a temperature of 400° C. in an oxygen-containing atmosphere, the particle diameter exceeds 100 nm while a copper state is retained.

Patent Agency Ranking