公开(公告)号：US20150010754A1

公开(公告)日：2015-01-08

申请号：US14369276

申请日：2012-11-27

Applicant: NITTO DENKO CORPORATION

Inventor： Masatsugu Higashi ,  Azusa Iseki ,  Akiko Tanaka ,  Katsuhiko Kamiya

IPC: C09J133/10 ,  C09J7/02

CPC classification number: C09J133/10 ,  B32B17/064 ,  C08J7/047 ,  C09J7/385 ,  C09J133/06 ,  C09J133/066 ,  C09J2201/122 ,  C09J2201/606 ,  C09J2203/318 ,  C09J2433/00 ,  Y10T428/2891 ,  C08F2220/1891 ,  C08F2220/1841 ,  C08F220/20 ,  C08F2220/1875

Abstract: A pressure-sensitive adhesive of the present invention comprises a (meth)acryl-based polymer obtained by polymerization of a monomer component containing 40 to 99.5% by weight of an alkyl (meth)acrylate having an alkyl group of 10 to 18 carbon atoms at an ester end and more than 0 to 50% by weight or less of an alicyclic structure-containing monomer. The pressure-sensitive adhesive is capable of forming a pressure-sensitive adhesive layer that has a sufficiently low level of dielectric constant and a satisfactory level of adhesion performance.

Abstract translation: 本发明的压敏粘合剂包含通过将含有40〜99.5重量％的具有碳原子数为10〜18的烷基的（甲基）丙烯酸烷基酯的单体成分聚合得到的（甲基）丙烯酸类聚合物， 酯末端和大于0〜50重量％以下的含脂环结构的单体。 压敏粘合剂能够形成具有足够低的介电常数和令人满意的粘合性能的压敏粘合剂层。