公开(公告)号：US12060263B2

公开(公告)日：2024-08-13

申请号：US17801070

申请日：2021-08-05

申请人： NITTO DENKO CORPORATION

发明人： Hiroki Kigami ,  Kenji Onishi

IPC分类号： C09J7/35 ,  B81B7/00 ,  C09J133/08

CPC分类号： B81B7/0029 ,  C09J7/35 ,  C09J133/08 ,  C09J2203/326 ,  C09J2301/304 ,  C09J2301/312 ,  H01L2924/1461 ,  Y10T428/2891

摘要： A provided protective cover member is a protective cover member configured to be placed on a face of an object, the face having an opening. The protective cover member includes a laminate, and the laminate includes: a protective membrane having a shape configured to cover the opening when the member is placed on the face; and an adhesive agent layer. The adhesive agent layer includes a thermosetting adhesive layer including a thermosetting resin composition. The thermosetting resin composition has a storage modulus of 1×105 Pa or more at 130 to 170° C. The above protective cover member is suitable for reducing deformation thereof and/or peeling thereof from a placement face in a high-temperature treatment such as reflow soldering.

公开(公告)号：US20240218213A1

公开(公告)日：2024-07-04

申请号：US18606008

申请日：2024-03-15

申请人： NITTO DENKO CORPORATION

发明人： Yuji OKAWA

IPC分类号： C09J7/38 ,  C08G18/62 ,  C08G18/81 ,  C09J133/02 ,  C09J133/08 ,  H01L21/683 ,  H01L23/00 ,  H01L23/31

CPC分类号： C09J7/385 ,  C08G18/6225 ,  C08G18/8116 ,  C09J133/02 ,  C09J133/08 ,  H01L21/6836 ,  H01L24/00 ,  C08G2170/40 ,  C09J2203/326 ,  C09J2433/00 ,  H01L23/3128 ,  H01L2221/68377 ,  Y10T428/2809 ,  Y10T428/2891

摘要： Provided is a masking tape to be used at the time of formation of an electromagnetic wave shield, which is excellent in followability to irregularities, and which is capable of being peeled off from an irregular surface without any adhesive residue. The masking tape for forming an electromagnetic wave shield includes a pressure-sensitive adhesive layer that is increased in modulus of elasticity through active energy ray irradiation to 20 times or more as high as that before the active energy ray irradiation, wherein the pressure-sensitive adhesive layer has a modulus of elasticity after the active energy ray irradiation of 500 MPa or less.

公开(公告)号：US11980478B2

公开(公告)日：2024-05-14

申请号：US16633970

申请日：2018-07-23

申请人： Heraeus Deutschland Gmbh & Co. KG

发明人： Christian Neumann ,  Armin Sautter ,  Tim Asmus

IPC分类号： A61B5/00 ,  A61L24/06 ,  C09J9/02 ,  C09J11/08 ,  C09J133/08 ,  A61B5/0536 ,  A61B5/259 ,  A61B5/291 ,  A61B5/296 ,  A61B5/398

CPC分类号： A61B5/6833 ,  A61L24/06 ,  C09J9/02 ,  C09J11/08 ,  C09J133/08 ,  A61B5/0536 ,  A61B5/259 ,  A61B5/291 ,  A61B5/296 ,  A61B5/398 ,  A61B2562/0209 ,  A61B2562/0215 ,  Y10T428/2891

摘要： Disclosed is a layered body comprising a polymer comprising repeating units having the general structure —CH2—CHR1—COOR2— as defined herein, to a process for producing such a layered body, to a layered body produced by that process and to the use of a layered body for electrophysical measurements.

公开(公告)号：US09899553B2

公开(公告)日：2018-02-20

申请号：US14018958

申请日：2013-09-05

申请人： FUJIFILM Corporation

发明人： Yusuke Akasaki ,  Naoya Imamura ,  Shin Ozawa

IPC分类号： H01L31/049 ,  C08J7/04 ,  C09J7/02 ,  B32B27/30 ,  B32B27/20 ,  B32B27/08 ,  B32B27/26 ,  B32B27/32 ,  H01L31/048 ,  C08K5/00 ,  C08K3/00

CPC分类号： H01L31/049 ,  B32B27/08 ,  B32B27/20 ,  B32B27/26 ,  B32B27/306 ,  B32B27/32 ,  B32B2264/102 ,  B32B2264/108 ,  B32B2457/12 ,  C08J7/042 ,  C08J7/047 ,  C08J2367/02 ,  C08J2423/04 ,  C08J2423/10 ,  C08K3/013 ,  C08K5/0041 ,  C09J7/22 ,  C09J7/35 ,  C09J2203/322 ,  C09J2205/102 ,  C09J2423/00 ,  H01L31/0481 ,  Y02E10/50 ,  Y10T428/264 ,  Y10T428/265 ,  Y10T428/273 ,  Y10T428/2835 ,  Y10T428/2848 ,  Y10T428/2857 ,  Y10T428/2878 ,  Y10T428/2891

摘要： A readily adhesive sheet including a base material film and an olefin-based polymer layer which is disposed on at least one surface of the base material film and contains at least one binder, which is an olefin-based binder having an elastic modulus of 320 MPa or less, at least one coloring pigment selected from titanium oxide, carbon black, titanium black, black combined metal oxides, cyanine-based colors and quinacridone-based colors, and a crosslinking agent has a favorable adhesion to the sealing material even after aged in a hot and humid environment.

公开(公告)号：US09868883B2

公开(公告)日：2018-01-16

申请号：US14547993

申请日：2014-11-19

申请人： LG CHEM, LTD.

发明人： Kee Young Kim ,  No Ma Kim ,  In Ho Hwang ,  In Kyu Park

IPC分类号： C09J9/02 ,  G02B1/18 ,  C09J133/06 ,  C09J133/14 ,  C09J7/02 ,  C08K5/3435 ,  C09J11/06 ,  C09J133/08 ,  G02B1/10 ,  H04B1/3888 ,  G02B1/14 ,  G02B1/16

CPC分类号： C09J9/02 ,  C08K5/3435 ,  C09J7/385 ,  C09J11/06 ,  C09J133/066 ,  C09J133/08 ,  C09J133/14 ,  C09J2201/122 ,  C09J2201/128 ,  C09J2201/606 ,  C09J2203/318 ,  C09J2433/00 ,  G02B1/105 ,  G02B1/14 ,  G02B1/16 ,  G02B1/18 ,  G02F2202/28 ,  H04B1/3888 ,  Y10T428/1462 ,  Y10T428/2848 ,  Y10T428/2887 ,  Y10T428/2891 ,  Y10T428/31935 ,  Y10T428/31938

摘要： Provided are a pressure-sensitive adhesive composition, a protective film, an optical device, and a display device. The pressure-sensitive adhesive composition may exhibit suitable low speed and high speed peel-off strengths after forming a crosslinking structure, and have an excellent balance between them. Accordingly, the pressure-sensitive adhesive composition may exhibit an excellent protective effect when applied to a protective film, may be easily peeled in a high speed peel-off and thus advantageous for the high speed process, and may exhibit an excellent antistatic characteristic.

公开(公告)号：US09798056B2

公开(公告)日：2017-10-24

申请号：US14271193

申请日：2014-05-06

申请人： LG CHEM, LTD.

发明人： Min Ki Lee ,  No Ma Hoon Kim ,  Sung Soo Yoon ,  Su Jeong Kim

IPC分类号： G02B5/30 ,  C09J153/00 ,  C08G18/62 ,  C09J175/04 ,  C08F293/00 ,  C09J7/02 ,  G02F1/1335

CPC分类号： G02B5/3025 ,  B32B2457/202 ,  C08F293/005 ,  C08F2438/01 ,  C08G18/6229 ,  C08G2170/40 ,  C09J7/22 ,  C09J7/38 ,  C09J153/00 ,  C09J175/04 ,  C09J2203/318 ,  C09J2453/00 ,  G02B5/3033 ,  G02F1/133528 ,  G02F2202/28 ,  Y10T428/1082 ,  Y10T428/2891 ,  C08F220/14 ,  C08F2220/1825 ,  C08F220/20 ,  C08F2220/1808

摘要： The present application is relates to a pressure-sensitive adhesive composition. The pressure-sensitive adhesive composition of the present application may form a pressure-sensitive adhesive having excellent durability and reliability, stress relaxation and reworkability. In addition, when the pressure-sensitive adhesive composition is used collaterally, for example, a coating process may be efficiently performed even when a coating solid content is high, thereby maintaining excellent productivity and forming a pressure-sensitive adhesive having excellent uniformity in thickness. The pressure-sensitive adhesive composition may be used for an optical film such as a polarizing plate.

公开(公告)号：US09793103B2

公开(公告)日：2017-10-17

申请号：US13915176

申请日：2013-06-11

申请人： LG CHEM, LTD.

发明人： Hyun Jee Yoo ,  Dong Han Kho ,  Jang Soon Kim ,  Hyo Soon Park ,  Jong Wan Hong ,  Hyo Sook Joo

IPC分类号： H01L21/02 ,  C09J5/06 ,  C09J163/00 ,  C09J133/14 ,  C09J133/02 ,  C08K5/13 ,  C08L61/06 ,  C08L61/12 ,  C08L61/20 ,  C08L63/00 ,  C09J133/06 ,  C08L33/06 ,  C08G59/62 ,  H01L21/683 ,  C09J7/02

CPC分类号： H01L21/02002 ,  C08G59/621 ,  C08K5/13 ,  C08L33/066 ,  C08L33/068 ,  C08L61/06 ,  C08L61/12 ,  C08L61/20 ,  C08L63/00 ,  C08L2666/02 ,  C09J5/06 ,  C09J7/20 ,  C09J133/066 ,  C09J133/068 ,  C09J163/00 ,  C09J2201/36 ,  C09J2201/60 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2463/00 ,  H01L21/6836 ,  Y10T428/269 ,  Y10T428/287 ,  Y10T428/2891 ,  Y10T428/31515

摘要： Provided are an epoxy composition, an adhesive film, a dicing die bonding film and a semiconductor device using the same. Specifically, the epoxy composition and a use thereof are provided, wherein the epoxy composition has a gel content of 5˜20%, measured under certain conditions. The epoxy composition according to the present invention, as an adhesive agent, shows excellent elastic properties, when prepared to have a low glass transition temperature, exhibiting good adhesion at high temperature and having minimal occurrence of burrs during processing. According to the present invention, it is therefore possible to prevent defects owing to die cut shift, during a wire bonding or molding process at high temperature, and obtain a highly reliable semiconductor device owing to the excellent adhesiveness and workability of the adhesive agent.

公开(公告)号：US09761790B2

公开(公告)日：2017-09-12

申请号：US14391231

申请日：2013-06-18

申请人： Parker-Hannifin Corporation

发明人： Mikyong Yoo ,  Hooman Mousavi Nazari ,  Xina Quan

IPC分类号： H01L41/33 ,  H01L41/45 ,  B32B37/12 ,  B32B37/24 ,  B32B38/00 ,  H01L41/08 ,  H01L41/193 ,  H04R17/00

CPC分类号： H01L41/33 ,  B32B37/12 ,  B32B37/24 ,  B32B38/0012 ,  B32B2037/243 ,  B32B2038/0028 ,  H01L41/0536 ,  H01L41/0805 ,  H01L41/193 ,  H01L41/45 ,  H04R17/005 ,  Y10T428/28 ,  Y10T428/2826 ,  Y10T428/2839 ,  Y10T428/287 ,  Y10T428/2878 ,  Y10T428/2891 ,  Y10T428/2896

摘要： An apparatus comprising a frame and a pressure sensitive adhesive applied to at least a portion of the frame, where the pressure sensitive adhesive is arranged to bond a pre-strained film to the frame is disclosed. A method of making the apparatus also is disclosed. Also disclosed is a method of preparing a stretch frame for manufacturing electroactive polymer devices thereon.

公开(公告)号：US09752059B2

公开(公告)日：2017-09-05

申请号：US14678126

申请日：2015-04-03

申请人： Sirrus, Inc.

发明人： Bernard Miles Malofsky ,  Adam Gregg Malofsky ,  Matthew McBrayer Ellison ,  Joseph D. Desousa

IPC分类号： B32B7/10 ,  B32B7/12 ,  B32B27/06 ,  B32B27/26 ,  C09J5/04 ,  C09J11/06 ,  C09J4/00 ,  B32B37/00 ,  B32B37/18 ,  B32B38/00 ,  C09J5/00 ,  B32B27/14

CPC分类号： C09J4/00 ,  B32B7/10 ,  B32B7/12 ,  B32B27/06 ,  B32B27/14 ,  B32B27/26 ,  B32B37/0038 ,  B32B37/182 ,  B32B38/0012 ,  B32B2038/0016 ,  B32B2250/02 ,  B32B2605/00 ,  C09J5/00 ,  C09J5/04 ,  C09J11/06 ,  C09J2400/20 ,  C09J2400/226 ,  Y10T428/287 ,  Y10T428/2891 ,  Y10T428/31645 ,  Y10T428/31692 ,  Y10T428/31895 ,  Y10T428/31938

摘要： Reactive composition includes a reactive component able to form an adhesive bond between two substrates, at least one of which comprises a plastic material. The substrate may include an initiator on or near the surface thereof. The initiator may be present in the plastic material inherently, by blending in an additive package, through injection molding, or other process. The reactive component may comprise a methylene malonate, a reactive multifunctional methylene, a methylene beta ketoester, a methylene beta diketone. A carrier component for the reactive component may be selected to interact with the plastic substrate to soften and/or penetrate the surface to be bonded. The surface of the plastic may be abraded or otherwise treated to expose the initiator. The reactive component, upon contact with a suitable initiator, is able to polymerize to form an interpenetrating polymer weld.

公开(公告)号：US09735299B2

公开(公告)日：2017-08-15

申请号：US13989087

申请日：2011-11-23

申请人： Donald Herr ,  Brian A. Harkins

发明人： Donald Herr ,  Brian A. Harkins

IPC分类号： C09J7/02 ,  H01L31/05 ,  C09J9/02 ,  H01L31/0224 ,  C08K3/04 ,  C08K3/08

CPC分类号： H01L31/0512 ,  C08K3/04 ,  C08K3/08 ,  C09J7/22 ,  C09J7/28 ,  C09J7/385 ,  C09J9/02 ,  C09J2201/602 ,  C09J2203/322 ,  C09J2205/102 ,  C09J2400/163 ,  C09J2433/00 ,  H01L31/022425 ,  Y02E10/50 ,  Y10T428/252 ,  Y10T428/256 ,  Y10T428/2852 ,  Y10T428/2857 ,  Y10T428/287 ,  Y10T428/2874 ,  Y10T428/2887 ,  Y10T428/2891 ,  Y10T428/2896 ,  Y10T442/10

摘要： A reactive pressure sensitive adhesive composition is disclosed. A tape formed using the reactive pressure sensitive adhesive is also disclosed. In its cured state, the pressure sensitive adhesive shows superior mechanical and electrical properties compared to conventional, non-curable charge collection tapes. The tape has a cure profile pre-selected to correspond to that of a photovoltaic cell fabrication process, such that curing can take place during cell fabrication and may occur simultaneously with one or more other curing steps employed in cell fabrication.