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公开(公告)号：US20230009006A1
公开(公告)日：2023-01-12
申请号：US17783212
申请日：2020-12-02
发明人： Masaki ITO , Hayato TAKAKURA , Ryohei KAKIUCHI
摘要： A method for manufacturing a wiring circuit board includes first forming an insulating base layer on a one-side surface in a thickness direction of a metal sheet, second forming a conductor layer on a one-side surface in the thickness direction of the insulating base layer so that a width of a wire is smaller than a width W2 of a wiring body base portion, third forming an insulating cover layer on a one-side surface in the thickness direction of the wiring body base portion exposed from the wire so that the wire is covered with the insulating cover layer and a width of a wiring body cover portion is smaller than the width W2, and fourth forming a metal supporting layer by etching the metal sheet from both sides in the thickness direction so that a width of a wiring body metal portion is smaller than the width W2.
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公开(公告)号：US20210185826A1
公开(公告)日：2021-06-17
申请号：US17265922
申请日：2019-07-12
摘要： A wiring circuit board assembly sheet is partitioned by a product region in which a plurality of wiring circuit boards serving as products are disposed in alignment and a margin region surrounding the product region with the margin region having a first area adjacent to the product region and a second area located at the opposite side of the product region with respect to the first area. The wiring circuit board assembly sheet includes a dummy wiring circuit board disposed in at least a portion of the first area and smaller than the wiring circuit board.
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