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公开(公告)号：US20210185826A1
公开(公告)日：2021-06-17
申请号：US17265922
申请日：2019-07-12
Applicant: NITTO DENKO CORPORATION
Inventor： Takuya TANIUCHI , Ryohei KAKIUCHI , Naoki SHIBATA , Yasunari OYABU
Abstract: A wiring circuit board assembly sheet is partitioned by a product region in which a plurality of wiring circuit boards serving as products are disposed in alignment and a margin region surrounding the product region with the margin region having a first area adjacent to the product region and a second area located at the opposite side of the product region with respect to the first area. The wiring circuit board assembly sheet includes a dummy wiring circuit board disposed in at least a portion of the first area and smaller than the wiring circuit board.
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公开(公告)号：US20220386463A1
公开(公告)日：2022-12-01
申请号：US17884176
申请日：2022-08-09
Applicant: NITTO DENKO CORPORATION
Inventor： Ryosuke SASAOKA , Naoki SHIBATA , Yasunari OYABU
Abstract: A method for producing a wiring circuit board includes a first step of preparing a wiring circuit board assembly sheet including a support sheet, a plurality of wiring circuit boards supported by the support sheet, and a joint connecting the support sheet to the plurality of wiring circuit boards, having flat-shaped one surface and the other surface facing one surface at spaced intervals thereto in a thickness direction, and having a thin portion in which the other surface is recessed toward one surface and a second step of forming a burr portion protruding toward the other side in the thickness direction and cutting the thin portion.
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公开(公告)号：US20210185832A1
公开(公告)日：2021-06-17
申请号：US17265925
申请日：2019-07-12
Applicant: NITTO DENKO CORPORATION
Inventor： Ryosuke SASAOKA , Naoki SHIBATA , Yasunari OYABU
Abstract: A method for producing a wiring circuit board includes a first step of preparing a wiring circuit board assembly sheet including a support sheet, a plurality of wiring circuit boards supported by the support sheet, and a joint connecting the support sheet to the plurality of wiring circuit boards, having flat-shaped one surface and the other surface facing one surface at spaced intervals thereto in a thickness direction, and having a thin portion in which the other surface is recessed toward one surface and a second step of forming a burr portion protruding toward the other side in the thickness direction and cutting the thin portion.
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公开(公告)号：US20220192010A1
公开(公告)日：2022-06-16
申请号：US17441918
申请日：2020-03-05
Applicant: NITTO DENKO CORPORATION
Inventor： Ryosuke SASAOKA , Yasunari OYABU , Hiroaki MACHITANI , Hayato TAKAKURA
Abstract: A wiring circuit board includes an alignment mark layer. The alignment mark layer includes a first alignment mark and a second alignment mark. The condition A or the condition B is satisfied. Condition A: The first alignment mark has a first portion (a first starting point portion or a first center of gravity portion). The second alignment mark has a second portion (a second starting point portion or a second center of gravity portion). Condition B: The first alignment mark has the first portion, and the second alignment mark does not have the second portion, or the first alignment mark does not have the first portion, and the second alignment mark does not have the second portion.
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Patent Agency Ranking
公开(公告)号：US20210212196A1
公开(公告)日：2021-07-08
申请号：US17057912
申请日：2019-05-10
Applicant: NITTO DENKO CORPORATION
Inventor： Masaki ITO , Naoki SHIBATA , Yasunari OYABU , Kenya TAKIMOTO
Abstract: A wiring circuit board includes a support metal layer having thermal conductivity of 5 W/m·K or more, an insulating layer disposed on at least one side in a thickness direction of the support metal layer, a wiring layer disposed on a front surface of the insulating layer, a protective metal film disposed on the entire surface of the support metal layer between the support metal layer and the insulating layer, and a protective thin film disposed on an exposed surface exposed from the protective metal film in the support metal layer.
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公开(公告)号：US20240114615A1
公开(公告)日：2024-04-04
申请号：US17768758
申请日：2020-09-15
Applicant: NITTO DENKO CORPORATION
Inventor： Hayato TAKAKURA , Naoki SHIBATA , Yasunari OYABU
CPC classification number: H05K1/0269 , H05K1/05 , H05K1/09 , H05K3/16 , H05K2201/2054
Abstract: A method for manufacturing a wiring circuit board includes steps: 1) preparing a metal supporting layer, a different-reflectance layer, an insulating base layer, and a wiring layer sequentially toward one side in a thickness direction, and 2) irradiating the circuit board with reflected light including light containing one wavelength in light between wavelengths 650 nm and 950 nm from one side in the thickness direction of the circuit board to inspect the wiring layer based on the reflected light at the circuit board. In 2), the outer shape of the wiring layer is inspected based on the contrast between first reflected light at one surface in the thickness direction of the wiring layer and second reflected light at one surface in the thickness direction of the different-reflectance layer. The difference between a reflectance R1 of the wiring layer and a reflectance R2 of the different-reflectance layer is 40% or more.
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公开(公告)号：US20230073563A1
公开(公告)日：2023-03-09
申请号：US17900406
申请日：2022-08-31
Applicant: NITTO DENKO CORPORATION
Inventor： Hayato TAKAKURA , Yasunari OYABU , Naoki SHIBATA
Abstract: Provided is a method for producing a wired circuit board in which a first preparation step of preparing a first substrate having an insulating layer and a conductive layer disposed on one surface of the insulating layer; a second preparation step of preparing a second substrate having a metal layer; a bonding step of laminating the first substrate and the second substrate so that the conductive layer and the metal layer are in contact with each other, and metal-bonding the conductive layer and the metal layer; and a patterning step of forming a conductive pattern on the other surface of the insulating layer are carried out.
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公开(公告)号：US20210212208A1
公开(公告)日：2021-07-08
申请号：US17057906
申请日：2019-05-10
Applicant: NITTO DENKO CORPORATION
Inventor： Naoki SHIBATA , Hiroaki MACHITANI , Yasunari OYABU , Masaki ITO , Kenya TAKIMOTO
Abstract: A wiring circuit board includes an insulating layer and a conductive layer disposed on a front surface of the insulating layer. The conductive layer includes a first wiring, a first terminal electrically connected to the first wiring, a second wiring independent of the first wiring and having a thick thickness T2 with respect to a thickness T1 of the first wiring, and a second terminal electrically connected to the second wiring. The surfaces of the first terminal and the second terminal are disposed at generally the same position in a thickness direction.
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公开(公告)号：US20210204402A1
公开(公告)日：2021-07-01
申请号：US17058513
申请日：2019-05-10
Applicant: NITTO DENKO CORPORATION
Inventor： Takuya TANIUCHI , Naoki SHIBATA , Ryosuke SASAOKA , Yasunari OYABU
Abstract: A wiring circuit board assembly sheet includes a support sheet having two end edges parallel with each other and a plurality of wiring circuit boards disposed at spaced intervals to each other in the support sheet. The wiring circuit board includes a metal-based portion having a generally rectangular frame shape. The metal-based portion includes a first piece along a first direction perpendicular to a thickness direction of the support sheet, and a second piece along a second direction perpendicular to the thickness direction and the first direction. Both the first piece and the second piece are inclined with respect to the end edge of the support sheet.
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