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公开(公告)号：US20230137656A1
公开(公告)日：2023-05-04
申请号：US17973180
申请日：2022-10-25
发明人： Hayato TAKAKURA , Naoki SHIBATA , Ryosuke SASAOKA
摘要： Provided is a wiring circuit board that allows the electrical connection between the elements and the terminals to be easy and sure. The wiring circuit board includes an insulating base layer, a plurality of wires with different thicknesses from each other, and an insulating cover layer sequentially toward an upper side. The wires include a first wire having the greatest thickness. The wiring circuit board further includes a plurality of terminals disposed on an upper surface of the insulating base layer. The terminals are electrically connected with the wires, respectively. The upper surfaces and of the terminals are each located at an upper side as compared to an upper surface of the insulating cover layer (a wire covering portion) covering the first wire.
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公开(公告)号：US20230007785A1
公开(公告)日：2023-01-05
申请号：US17779890
申请日：2020-11-05
发明人： Kenya TAKIMOTO , Naoki SHIBATA , Hayato TAKAKURA
IPC分类号： H05K3/28
摘要： A method for producing a wiring circuit board includes a first step, a second step, and a third step. In the first step, while a work film which is a long metal substrate having a first surface and a second surface opposite to the first surface is fed and wound by a roll-to-roll method, a composition containing a photosensitive resin is applied onto the first surface to form an insulating film, and a protective film is interposed between the second surface and the insulating film of the work film in being wound. In the second step, while the work film having undergone the first step is fed and wound by the roll-to-roll method, the protective film is peeled from the insulating film, and the insulating film is subjected to light exposure treatment to be formed with a latent image pattern. In a third step, the insulating film having undergone the second step is subjected to development treatment to be patterned.
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公开(公告)号：US20210185826A1
公开(公告)日：2021-06-17
申请号：US17265922
申请日：2019-07-12
摘要： A wiring circuit board assembly sheet is partitioned by a product region in which a plurality of wiring circuit boards serving as products are disposed in alignment and a margin region surrounding the product region with the margin region having a first area adjacent to the product region and a second area located at the opposite side of the product region with respect to the first area. The wiring circuit board assembly sheet includes a dummy wiring circuit board disposed in at least a portion of the first area and smaller than the wiring circuit board.
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公开(公告)号：US20220386463A1
公开(公告)日：2022-12-01
申请号：US17884176
申请日：2022-08-09
发明人： Ryosuke SASAOKA , Naoki SHIBATA , Yasunari OYABU
摘要： A method for producing a wiring circuit board includes a first step of preparing a wiring circuit board assembly sheet including a support sheet, a plurality of wiring circuit boards supported by the support sheet, and a joint connecting the support sheet to the plurality of wiring circuit boards, having flat-shaped one surface and the other surface facing one surface at spaced intervals thereto in a thickness direction, and having a thin portion in which the other surface is recessed toward one surface and a second step of forming a burr portion protruding toward the other side in the thickness direction and cutting the thin portion.
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公开(公告)号：US20220386459A1
公开(公告)日：2022-12-01
申请号：US17775797
申请日：2020-10-13
发明人： Rihito FUKUSHIMA , Hayato TAKAKURA , Naoki SHIBATA
摘要： A wiring circuit board includes a base insulating layer; a first wiring disposed on the base insulating layer; an intermediate insulating layer disposed on the base insulating layer so as to cover the first wiring; a second wiring disposed on the intermediate insulating layer; a single layer first terminal, disposed on the base insulating layer, and electrically connected to the first wiring; and a single layer second terminal, disposed on the base insulating layer, and electrically connected to the second wiring. The first terminal is continuous with the first wiring. The second terminal is discontinuous from the second wiring. The wiring circuit board further includes a connecting portion disposed on the base insulating layer and continuous with the second terminal to electrically connect to the second wiring.
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公开(公告)号：US20220201871A1
公开(公告)日：2022-06-23
申请号：US17610060
申请日：2020-03-31
发明人： Kenya TAKIMOTO , Naoki SHIBATA , Hayato TAKAKURA
摘要： A wiring circuit board includes a metal support layer, a base insulating layer disposed on one side in a thickness direction of the metal support layer, and a conductive layer disposed on one side in the thickness direction of the base insulating layer, and including a first terminal and a ground lead residual portion electrically connected to the first terminal. The base insulating layer has a through hole penetrating in the thickness direction. The ground lead residual portion has an opening continuous so as to surround the through hole.
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公开(公告)号：US20210185832A1
公开(公告)日：2021-06-17
申请号：US17265925
申请日：2019-07-12
发明人： Ryosuke SASAOKA , Naoki SHIBATA , Yasunari OYABU
摘要： A method for producing a wiring circuit board includes a first step of preparing a wiring circuit board assembly sheet including a support sheet, a plurality of wiring circuit boards supported by the support sheet, and a joint connecting the support sheet to the plurality of wiring circuit boards, having flat-shaped one surface and the other surface facing one surface at spaced intervals thereto in a thickness direction, and having a thin portion in which the other surface is recessed toward one surface and a second step of forming a burr portion protruding toward the other side in the thickness direction and cutting the thin portion.
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公开(公告)号：US20220256712A1
公开(公告)日：2022-08-11
申请号：US17610058
申请日：2020-04-08
发明人： Kenya TAKIMOTO , Naoki SHIBATA , Hayato TAKAKURA
摘要： A wiring circuit board includes a metal support layer, a base insulating layer disposed on one side in a thickness direction of the metal support layer, and a conductive layer disposed on one side in the thickness direction of the base insulating layer, and including a first terminal and a ground lead residual portion electrically connected to the first terminal. A thickness of the ground lead residual portion is thinner than a thickness of the first terminal.
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公开(公告)号：US20210212196A1
公开(公告)日：2021-07-08
申请号：US17057912
申请日：2019-05-10
发明人： Masaki ITO , Naoki SHIBATA , Yasunari OYABU , Kenya TAKIMOTO
摘要： A wiring circuit board includes a support metal layer having thermal conductivity of 5 W/m·K or more, an insulating layer disposed on at least one side in a thickness direction of the support metal layer, a wiring layer disposed on a front surface of the insulating layer, a protective metal film disposed on the entire surface of the support metal layer between the support metal layer and the insulating layer, and a protective thin film disposed on an exposed surface exposed from the protective metal film in the support metal layer.
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公开(公告)号：US20230073563A1
公开(公告)日：2023-03-09
申请号：US17900406
申请日：2022-08-31
发明人： Hayato TAKAKURA , Yasunari OYABU , Naoki SHIBATA
摘要： Provided is a method for producing a wired circuit board in which a first preparation step of preparing a first substrate having an insulating layer and a conductive layer disposed on one surface of the insulating layer; a second preparation step of preparing a second substrate having a metal layer; a bonding step of laminating the first substrate and the second substrate so that the conductive layer and the metal layer are in contact with each other, and metal-bonding the conductive layer and the metal layer; and a patterning step of forming a conductive pattern on the other surface of the insulating layer are carried out.
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