公开(公告)号：US20240260177A1

公开(公告)日：2024-08-01

申请号：US18007388

申请日：2021-05-24

Applicant: NITTO DENKO CORPORATION

Inventor： Kenya TAKIMOTO ,  Naoki SHIBATA ,  Hayato TAKAKURA

IPC: H05K1/02 ,  H05K3/02

CPC classification number: H05K1/0298 ,  H05K3/02

Abstract: Provided is a method for producing a wiring circuit board that includes the steps of forming a first metal layer on a metal supporting substrate; forming an insulating layer on the first metal layer; removing a portion of the first metal layer, the portion being exposed at the opening portion of the insulating layer, to expose the metal supporting substrate at the opening portion; forming a second metal layer on a portion of the metal supporting substrate exposed at the opening portion and on the insulating layer; and forming a conductive layer on the second metal layer. A wiring circuit board includes the metal supporting substrate, the first metal layer having a first opening portion, the insulating layer having a second opening portion having an opening along the first opening portion, the second metal layer connected to the metal supporting substrate, and the conductive layer on the second metal layer.

公开(公告)号：US20240164017A1

公开(公告)日：2024-05-16

申请号：US18504717

申请日：2023-11-08

Applicant: NITTO DENKO CORPORATION

Inventor： Hideki MATSUI ,  Naoki SHIBATA ,  Ryosuke SASAOKA

IPC: H05K1/11 ,  H05K3/10 ,  H05K3/18 ,  H05K3/38

CPC classification number: H05K1/11 ,  H05K3/108 ,  H05K3/18 ,  H05K3/38 ,  H05K3/244 ,  H05K2201/0347 ,  H05K2201/099

Abstract: A wiring circuit board includes a first insulating layer, a conductive pattern disposed at one side of the first insulating layer in a thickness direction and having a terminal and a wire connected with the terminal, and a second insulating layer for suppressing release of the terminal from the first insulating layer. The second insulating layer has a first portion disposed at the one side of the first insulating layer in the thickness direction and a second portion disposed at one side of a peripheral edge portion of the terminal in the thickness direction and covering the peripheral edge portion.

公开(公告)号：US20240114628A1

公开(公告)日：2024-04-04

申请号：US18471046

申请日：2023-09-20

Applicant: NITTO DENKO CORPORATION

Inventor： Kenta FUKUSHIMA ,  Hayato TAKAKURA ,  Naoki SHIBATA ,  Ryosuke SASAOKA

IPC: H05K3/10 ,  H05K1/02 ,  H05K3/00 ,  H05K3/32

CPC classification number: H05K3/103 ,  H05K1/0296 ,  H05K3/0017 ,  H05K3/32 ,  H05K2201/10287

Abstract: A method for producing a wiring circuit board includes a preparation step of preparing a substrate; a first patterning step of forming a first insulating layer on one side of the substrate in a thickness direction; a second patterning step of forming a conductive pattern on one side of the first insulating layer in the thickness direction; and a deposition step of depositing a metal on the other side of the substrate in the thickness direction and forming a first metal support layer. The conductive pattern has two terminals, and two wirings. The first metal support layer has a terminal support portion supporting the terminals, a wiring support portion supporting one of the wirings, and a second wiring support portion supporting the other wiring and disposed spaced from the wiring support portion.

公开(公告)号：US20230240007A1

公开(公告)日：2023-07-27

申请号：US18001681

申请日：2021-05-27

Applicant: NITTO DENKO CORPORATION

Inventor： Daigo TSUBAI ,  Naoki SHIBATA ,  Hiroaki MACHITANI

IPC: H05K1/05 ,  H05K1/11

CPC classification number: H05K1/05 ,  H05K1/11

Abstract: A wiring circuit board includes a metal support substrate, an insulating layer, and a conductive layer in this order in a thickness direction, and has an edge portion extending in a first direction. The edge portion includes a main structure portion and partially includes a partial structure portion. In the main structure portion, the metal support substrate has a substrate extension portion extending outwardly with respect to the insulating layer in a second direction perpendicular to the first direction and the thickness direction. In the partial structure portion, the insulating layer has an insulating layer extension portion extending outwardly with respect to the metal support substrate in the second direction.

公开(公告)号：US20240244742A1

公开(公告)日：2024-07-18

申请号：US18559498

申请日：2022-01-28

Applicant: NITTO DENKO CORPORATION

Inventor： Kenya TAKIMOTO ,  Naoki SHIBATA ,  Hayato TAKAKURA

IPC: H05K1/02 ,  H05K1/05

CPC classification number: H05K1/0296 ,  H05K1/05 ,  H05K2201/09927

Abstract: A wiring circuit board includes a support metal layer; a base insulating layer disposed on at least one surface in the thickness direction of the support metal layer, and a wiring layer disposed on one surface in the thickness direction of the base insulating layer. A plurality of stripe grooves that extends along a predetermined direction orthogonal to the thickness direction and a plurality of recesses that sinks in the thickness direction of the support metal layer are formed on one surface in the thickness direction and/or the other surface in the thickness direction of the support metal layer. The recesses form a two-dimensional code having a generally rectangular shape in plan view by means of a dot pattern. One side of the two-dimensional code is disposed so as to lie along the stripe grooves.

公开(公告)号：US20240224435A1

公开(公告)日：2024-07-04

申请号：US18550252

申请日：2022-01-25

Applicant: NITTO DENKO CORPORATION

Inventor： Hayato TAKAKURA ,  Naoki SHIBATA ,  Makoto TSUNEKAWA

IPC: H05K3/46

CPC classification number: H05K3/4644

Abstract: A method for producing a wiring circuit board includes a step of forming an insulating layer on one surface in a thickness direction of a substrate, a step of forming a plurality of wirings on one surface in the thickness direction of the insulating layer, a step of forming an opening portion including the plurality of wirings when projected in the thickness direction in the substrate, a step of forming a resist pattern having an opening portion having a pattern shape along the plurality of wirings on the other surface in the thickness direction of the insulating layer, a step of forming a metal support portion by depositing a metal material on the insulating layer inside the opening portion, and a step of removing the resist pattern.

公开(公告)号：US20240164024A1

公开(公告)日：2024-05-16

申请号：US18504725

申请日：2023-11-08

Applicant: NITTO DENKO CORPORATION

Inventor： Ikuya HASHIMOTO ,  Ryosuke SASAOKA ,  Naoki SHIBATA

IPC: H05K3/10 ,  H05K1/11 ,  H05K3/00 ,  H05K3/18

CPC classification number: H05K3/108 ,  H05K1/119 ,  H05K3/002 ,  H05K3/18 ,  H05K3/28 ,  H05K2203/0723

Abstract: A method for producing a wiring circuit board includes a region setting step of setting a pattern forming region and an opening forming region in a support layer; an insulating layer forming step of forming a base insulating layer on the support layer in the pattern forming region; a pattern step of forming a conductive pattern having a first conductive layer and a second conductive layer on the base insulating layer; and an etching step of etching the support layer in the opening forming region, and in the pattern step, a dummy pattern is formed in the opening forming region.

公开(公告)号：US20240107667A1

公开(公告)日：2024-03-28

申请号：US18471063

申请日：2023-09-20

Applicant: NITTO DENKO CORPORATION

Inventor： Kenta FUKUSHIMA ,  Hayato TAKAKURA ,  Naoki SHIBATA ,  Ryosuke SASAOKA

IPC: H05K1/05 ,  H05K3/00

CPC classification number: H05K1/05 ,  H05K3/0017 ,  H05K2203/0121 ,  H05K2203/0353

Abstract: A method for producing a wiring circuit board includes a step of preparing a substrate; a step of forming a metal layer on one side of the substrate in a thickness direction; a step of forming a first insulating layer on one side of the metal layer in the thickness direction; a step of forming a conductive pattern on one side of the first insulating layer in the thickness direction; a step of removing the substrate and exposing the metal layer; and a step of depositing a metal on the other side of the metal layer in the thickness direction and forming a first metal support layer. The first metal support layer has a terminal support portion supporting two terminals of a conductive pattern, a wiring support portion supporting a wiring of the conductive pattern, and a second wiring support portion supporting a second wiring of the conductive pattern.

公开(公告)号：US20230284394A1

公开(公告)日：2023-09-07

申请号：US18176900

申请日：2023-03-01

Applicant: NITTO DENKO CORPORATION

Inventor： Naoki SHIBATA ,  Ryosuke SASAOKA

IPC: H05K3/46 ,  G03F7/039 ,  G03F7/038

CPC classification number: H05K3/4676 ,  G03F7/039 ,  G03F7/0387 ,  H05K3/4608 ,  H05K3/0023

Abstract: Provided is a method for producing a wiring circuit board capable of improving the dimensional accuracy of a second conductive layer. The wiring circuit board produced by the producing method includes a metal supporting layer, a first insulating layer disposed on one surface of the metal supporting layer in a thickness direction, a first conductive layer disposed on one surface of the first insulating layer in the thickness direction, a second insulating layer disposed on one surface of the first insulating layer in the thickness direction so as to cover the first conductive layer, and a second conductive layer disposed on one surface of the second insulating layer in the thickness direction. The producing method includes a step of forming the second insulating layer by bonding a film made of a photosensitive resin to one surfaces of the first insulating layer and the first conductive layer in the thickness direction.

公开(公告)号：US20230254971A1

公开(公告)日：2023-08-10

申请号：US18163071

申请日：2023-02-01

Applicant: NITTO DENKO CORPORATION

Inventor： Hayato TAKAKURA ,  Naoki SHIBATA ,  Kenya TAKIMOTO ,  Chihiro WATANABE

IPC: H05K1/05

CPC classification number: H05K1/05 ,  H05K2201/09036

Abstract: Provided is a wiring circuit board and a wiring circuit board assembly that allow suppression of the recognition error of the dot pattern. The wiring circuit board includes a metal supporting layer, an insulating base layer, and a wiring layer. The wiring circuit board further includes a plurality of streak groove portions disposed on one surface of the metal supporting layer in the thickness direction and a plurality of concave portions depressed in the metal supporting layer in the thickness direction. The plurality of concave portions forms a dot pattern. Each of the dots in dot pattern has one concave surface. The concave surface has an approximately spherical cap shape or an approximately cone shape.