公开(公告)号：US12120829B2

公开(公告)日：2024-10-15

申请号：US17913055

申请日：2021-03-05

Applicant: NITTO DENKO CORPORATION

Inventor： Shusaku Shibata ,  Shun Shiga ,  Teppei Niino

IPC: H05K3/00 ,  H05K1/11 ,  H05K3/28 ,  H05K3/46

CPC classification number: H05K3/0097 ,  H05K1/118 ,  H05K3/28 ,  H05K3/4608 ,  H05K2203/1545 ,  H05K2203/308

Abstract: An assembly sheet as a wiring circuit board assembly sheet includes a metal substrate, a wiring circuit structure portion, and a dummy structure portion. The metal substrate includes a product region and a frame region adjacent thereto. The wiring circuit structure portion is disposed on one surface in a thickness direction of the metal substrate in the product region, and includes a terminal portion. The dummy structure portion is disposed on one surface in the thickness direction of the metal substrate in the frame region, includes a plurality of conductive layers aligned in the thickness direction, and has a greater height above the metal substrate than the terminal portion.