公开(公告)号：US11613676B2

公开(公告)日：2023-03-28

申请号：US17258941

申请日：2019-07-10

申请人： NITTO DENKO CORPORATION

发明人： Yuichi Takamura ,  Yoshinari Takayama

IPC分类号： C09J183/04 ,  C09J7/40 ,  C09J7/30 ,  C09J7/38 ,  C09J7/24

摘要： An adhesive tape includes: a substrate made of a fluorine resin; and a silicone-based adhesive agent layer disposed on one surface of the substrate. The adhesive tape has a thickness of 50 μm or more. An adhesive strength of an adhesive surface to the other surface of the substrate after a friction test is 4.0 N/19 mm or more. The friction test is performed according to a test method for coefficient of friction specified in JIS K7125: 1999, and performed in a state where: a contact surface, of a sliding piece used in the test method, brought into contact with a surface to be tested is covered with a single fiber cloth (cotton, for friction) specified in JIS L0803: 2011; the other surface of the substrate is defined as the surface to be tested; and the number of times of reciprocation is set to 10 times.

公开(公告)号：US20150291859A1

公开(公告)日：2015-10-15

申请号：US14439339

申请日：2013-10-25

申请人： NITTO DENKO CORPORATION

发明人： Yuichi Takamura ,  Shigeki Kawabe ,  Hiroomi Hanai

IPC分类号： C09J133/08 ,  C09J7/02 ,  H01M4/66 ,  H01M4/131 ,  H01M4/04 ,  H01M4/139

CPC分类号： C09J133/08 ,  C09J7/385 ,  C09J2203/33 ,  H01M4/0404 ,  H01M4/131 ,  H01M4/139 ,  H01M4/64 ,  H01M4/661 ,  H01M10/052 ,  C08F2220/1825 ,  C08F220/06 ,  C08F220/14 ,  C08F218/08 ,  C08F2220/1858 ,  C08F2220/1808 ,  C08F222/40 ,  C08F220/20

摘要： Provided is a pressure-sensitive adhesive tape for electrochemical devices according to the present invention. The adhesive tape is for use in electrochemical device production and includes a substrate and a pressure-sensitive adhesive layer. The adhesive layer is disposed on or over at least one side of the substrate and contains an acrylic polymer as a base polymer. The adhesive tape has a first and a second 180° peel adhesion strength. The first 180° peel adhesion strength is measured at 25° C. and a peeling speed of 300 mm/min after bonded to a SUS 304BA plate at a temperature of from 40° C. to below 150° C. The second 180° peel adhesion strength is measured at 25° C. and a peeling speed of 300 mm/min after bonded to a SUS 304BA plate at 25° C. The first 180° peel adhesion strength is twice or more as high as the second 180° peel adhesion strength.

摘要翻译： 提供了根据本发明的用于电化学装置的压敏粘合带。 胶带用于电化学装置生产，包括基材和压敏粘合剂层。 粘合剂层设置在基材的至少一侧上或上方，并且含有作为基础聚合物的丙烯酸类聚合物。 胶带具有第一和第二180°剥离粘合强度。 在40℃至低于150℃的温度下，在SUS304BA板上粘合后，在25℃下测量第一180°剥离粘合强度，剥离速度为300mm / min。第二180°剥离 在25℃下，粘合强度为25℃，剥离速度为300mm / min。第一180°剥离粘合强度为第二180°剥离粘合力的两倍以上 强度。