公开(公告)号：US20240043724A1

公开(公告)日：2024-02-08

申请号：US18358853

申请日：2023-07-25

Applicant: NITTO DENKO CORPORATION

Inventor： Yuji KATO ,  Jun AKIYAMA ,  Taiki UENO

IPC: C09J11/06 ,  C09J7/38 ,  C09J133/08 ,  H01L21/683

CPC classification number: C09J11/06 ,  C09J7/38 ,  C09J133/08 ,  H01L21/6836 ,  C09J2301/408 ,  C09J2301/302 ,  C09J2301/314 ,  C09J2433/00

Abstract: Provided is a pressure-sensitive adhesive sheet for semiconductor processing having excellent followability to unevenness of an adherend, and an excellent anchoring property. The pressure-sensitive adhesive sheet for semiconductor processing includes a pressure-sensitive adhesive layer formed of an ultra-violet (UV)-curable pressure-sensitive adhesive, and a base material. The UV-curable pressure-sensitive adhesive contains a base polymer, a photopolymerization initiator, and a phosphoric acid ester-based surfactant.

公开(公告)号：US20240034914A1

公开(公告)日：2024-02-01

申请号：US18358791

申请日：2023-07-25

Applicant: NITTO DENKO CORPORATION

Inventor： Jun AKIYAMA ,  Yuji KATO ,  Taiki UENO

IPC: C09J7/38 ,  C09J11/06 ,  C09J7/25 ,  C09J7/24 ,  H01L21/683

CPC classification number: C09J7/385 ,  C09J11/06 ,  C09J7/255 ,  C09J7/241 ,  H01L21/6836 ,  C09J2203/326 ,  C09J2301/302 ,  C09J2301/408 ,  C09J2433/00 ,  C09J2467/006 ,  C09J2423/006

Abstract: Provided is a pressure-sensitive adhesive sheet for semiconductor processing having excellent solvent resistance. The pressure-sensitive adhesive sheet for semiconductor processing includes a pressure-sensitive adhesive layer formed of a pressure-sensitive adhesive composition containing a base polymer, and a base material. The pressure-sensitive adhesive composition has a swelling degree SA of 2.1 times or less when immersed in an N,N-dimethylpropionamide solution at 23° C. for 1 hour.