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公开(公告)号：US20190150275A1
公开(公告)日：2019-05-16
申请号：US16098593
申请日：2017-04-14
发明人： Naoyuki Tanaka , Yusuke Matsuoka , Yasuto Ishimaru
摘要： An optical circuit board sheet which has little or no warpage to have no cracking in cores, and an opto-electric hybrid board sheet including the same are provided. The optical circuit board sheet includes: an insulative sheet; an under cladding layer formed on a first surface of the insulative sheet; and at least one core formed on a surface of the under cladding layer. A hole is formed in a portion of the surface of the under cladding layer other than where the core is formed. The area percentage of an opening area of the hole is in the range of 5% to 99% with respect to the first surface of the insulative sheet.
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