公开(公告)号：US3739232A

公开(公告)日：1973-06-12

申请号：US3739232D

申请日：1972-04-10

Applicant: NORTHROP CORP

Inventor： GROSSMAN N ,  HEID K ,  PITTMAN R ,  MAC DOUGALL R

IPC: H01L21/764 ,  H01L21/60 ,  H01L23/36 ,  H01L23/538 ,  H05K1/00 ,  H05K1/04

CPC classification number: H01L23/538 ,  H01L23/36 ,  H01L23/544 ,  H01L24/01 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01059 ,  H01L2924/01067 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/021 ,  H05K1/0268 ,  H05K1/0269 ,  H05K1/182 ,  H05K3/0058 ,  H05K2201/0397 ,  H05K2203/166 ,  Y10T29/49004 ,  Y10T29/49121 ,  Y10T29/49128 ,  H01L2924/00

Abstract: An electrical circuit board assembly is formed by first depositing a conductive material on a substrate which forms both a ground and a heat sink for components subsequently mounted thereon. A cavity pattern is then formed in a dielectric material placed over the conductive layer to form an alignment plate, the pattern in the plate being designed to receive various components which are placed therein. An etched circuit board which has apertures therein corresponding to the cavities in the alignment plate and having beam leads extending into these apertures and from the edges thereof, is placed over the alignment plate in alignment therewith, with the beam leads contacting corresponding terminals on the components mounted in the cavities. With the components resting on the conductive layer in the cavities but not attached thereto, and with the beam leads contacting but not attached to the component terminals, the unit is tested both electrically and mechanically and any faulty components replaced. After all testing and replacement of faulty components has been completed, the components are bonded in their aligned positions to the conductive layer on the substrate and the beam leads are bonded to associated terminals of the components.