公开(公告)号：US20180345440A1

公开(公告)日：2018-12-06

申请号：US15970041

申请日：2018-05-03

申请人： NTT Advanced Technology Corporation ,  Mipox Corporation

发明人： Kenji Aoki ,  Naoki Sugita ,  Toshihiro Igawa ,  Mitsunobu Shishido

IPC分类号： B24B19/22 ,  B24B21/00 ,  B24D11/04

CPC分类号： B24B19/00 ,  B24B21/00 ,  B24D11/04

摘要： A polishing method and a polishing film are provided for automatically performing multi-stage batch polishing on an end surface of a workpiece. An end surface of a workpiece and a polishing plate are moved relative to each other while bringing the end surface of the workpiece into contact with a polishing film of the polishing plate. The end surface is moved in a circular motion with a diameter 2 R relative to the polishing film; the center of the circular motion is moved linearly by a distance S on the polishing film; the polishing film is provided with first, second, and third polishing surfaces; and the polishing film is further provided with cleaning surfaces between the polishing surfaces so that the range of the distance S in which one rotation in the circular motion crosses over different polishing surfaces is reduced, or does not cross over different polishing surfaces.

公开(公告)号：US10981256B2

公开(公告)日：2021-04-20

申请号：US15970041

申请日：2018-05-03

申请人： NTT Advanced Technology Corporation ,  Mipox Corporation

发明人： Kenji Aoki ,  Naoki Sugita ,  Toshihiro Igawa ,  Mitsunobu Shishido

IPC分类号： B24B19/22 ,  B24B19/00 ,  B24B21/00 ,  B24B51/00 ,  B24D11/04 ,  B24B47/12 ,  B24D13/14

摘要： A polishing method and a polishing film are provided for automatically performing multi-stage batch polishing on an end surface of a workpiece. An end surface of a workpiece and a polishing plate are moved relative to each other while bringing the end surface of the workpiece into contact with a polishing film of the polishing plate. The end surface is moved in a circular motion with a diameter 2 R relative to the polishing film; the center of the circular motion is moved linearly by a distance S on the polishing film; the polishing film is provided with first, second, and third polishing surfaces; and the polishing film is further provided with cleaning surfaces between the polishing surfaces so that the range of the distance S in which one rotation in the circular motion crosses over different polishing surfaces is reduced, or does not cross over different polishing surfaces.