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1.
公开(公告)号:US20180345440A1
公开(公告)日:2018-12-06
申请号:US15970041
申请日:2018-05-03
发明人: Kenji Aoki , Naoki Sugita , Toshihiro Igawa , Mitsunobu Shishido
摘要: A polishing method and a polishing film are provided for automatically performing multi-stage batch polishing on an end surface of a workpiece. An end surface of a workpiece and a polishing plate are moved relative to each other while bringing the end surface of the workpiece into contact with a polishing film of the polishing plate. The end surface is moved in a circular motion with a diameter 2 R relative to the polishing film; the center of the circular motion is moved linearly by a distance S on the polishing film; the polishing film is provided with first, second, and third polishing surfaces; and the polishing film is further provided with cleaning surfaces between the polishing surfaces so that the range of the distance S in which one rotation in the circular motion crosses over different polishing surfaces is reduced, or does not cross over different polishing surfaces.
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2.
公开(公告)号:US10981256B2
公开(公告)日:2021-04-20
申请号:US15970041
申请日:2018-05-03
发明人: Kenji Aoki , Naoki Sugita , Toshihiro Igawa , Mitsunobu Shishido
摘要: A polishing method and a polishing film are provided for automatically performing multi-stage batch polishing on an end surface of a workpiece. An end surface of a workpiece and a polishing plate are moved relative to each other while bringing the end surface of the workpiece into contact with a polishing film of the polishing plate. The end surface is moved in a circular motion with a diameter 2 R relative to the polishing film; the center of the circular motion is moved linearly by a distance S on the polishing film; the polishing film is provided with first, second, and third polishing surfaces; and the polishing film is further provided with cleaning surfaces between the polishing surfaces so that the range of the distance S in which one rotation in the circular motion crosses over different polishing surfaces is reduced, or does not cross over different polishing surfaces.
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公开(公告)号:US10451816B2
公开(公告)日:2019-10-22
申请号:US15992295
申请日:2018-05-30
申请人: Mipox Corporation
发明人: Toshihiro Igawa
摘要: A polishing sheet capable of reducing recesses formed at the core of the end surface of an optical fiber, and a manufacturing method for an optical fiber connector using the polishing sheet are provided. The method includes a step of the final polishing of an optical fiber ferrule assembly in which an optical fiber protrudes from the end surface of a ferrule, the protruding optical fiber having a recess in the tip end core. During the final polishing step, the optical fiber having the recess in the core is inserted into a flocked portion of a flocked polishing sheet. The optical fiber ferrule assembly and the flocked polishing sheet are disposed opposite one another and moved relatively to each other in order to polish the optical fiber. Fibers constituting the flocked portion have silica particles with an average particle diameter from 0.01 μm to 0.1 μm adhered to the surface.
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公开(公告)号:US20180341068A1
公开(公告)日:2018-11-29
申请号:US15992295
申请日:2018-05-30
申请人: Mipox Corporation
发明人: Toshihiro Igawa
CPC分类号: G02B6/3863 , B24B19/226 , B24B49/12 , G02B6/3885
摘要: A polishing sheet capable of reducing recesses formed at the core of the end surface of an optical fiber, and a manufacturing method for an optical fiber connector using the polishing sheet are provided. The method includes a step of the final polishing of an optical fiber ferrule assembly in which an optical fiber protrudes from the end surface of a ferrule, the protruding optical fiber having a recess in the tip end core. During the final polishing step, the optical fiber having the recess in the core is inserted into a flocked portion of a flocked polishing sheet. The optical fiber ferrule assembly and the flocked polishing sheet are disposed opposite one another and moved relatively to each other in order to polish the optical fiber. Fibers constituting the flocked portion have silica particles with an average particle diameter from 0.01 μm to 0.1 μm adhered to the surface.
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