公开(公告)号：US20250098108A1

公开(公告)日：2025-03-20

申请号：US18369917

申请日：2023-09-19

Applicant: NVIDIA CORPORATION

Inventor： Tahir Cader ,  David Copeland ,  Elad Mentovich

IPC: H05K7/20 ,  G06F1/20

Abstract: Devices, apparatuses, systems, and methods are provided for hybrid thermal management in computing modules. An example computing module includes a first computing component having a first operating temperature and a second computing component having a second operating temperature. The first operating temperature is greater than the second operating temperature. The example computing module further includes a hybrid thermal management system including a cooling delivery device configured to receive a cooling fluid. The cooling delivery device defines a first section configured to dissipate heat generated by the first computing component and a second section configured to dissipate heat generated by the second computing component. The first section of the cooling delivery device may be fluidically isolated from the second section of the cooling delivery device or the second section may be in fluid communication with the first section.