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公开(公告)号：US20250003694A1
公开(公告)日：2025-01-02
申请号：US18223154
申请日：2023-07-18
Applicant: NVIDIA CORPORATION
Inventor： Ron CHAO , Elad Mentovich , Harrison Sangwha Kim , Mark North , Xinwei Lu , Tahir Cader , Fei Zhang , Yunseok Kim , David Haley , Yuezhan Steven Zhu , Lei Huang
Abstract: A heat transfer apparatus including a housing and a wick structure is provided that is configured to dissipate heat from a heat source. The housing defines a chamber that holds working fluid. The wick structure includes a body and pores defined by the body. The heat transfer apparatus defines an evaporator section configured to evaporate the working fluid using heat from a heat source and a condenser section configured to dissipate heat carried by the evaporated working fluid through condensation of the evaporated working fluid. The wick structure has a repeatable, configurable, and controlled geometry optimized to move the working fluid from the condenser section to the evaporator section via capillary action. The body of the wick structure may have a gyroidal geometry. Associated methods are also provided.
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公开(公告)号：US11832416B1
公开(公告)日：2023-11-28
申请号：US17903547
申请日：2022-09-06
Applicant: Nvidia Corporation
Inventor： Ryan Kelsey Albright , William Andrew Mecham , Benjamin Goska , Aaron Richard Carkin , Tahir Cader , William Ryan Weese , Michael Thompson , Jordan Levy , Siddha Ganju , Fred Devoir , Elad Mentovich , Elijah Chen
CPC classification number: H05K7/1498 , G06T19/003 , H05K7/1492
Abstract: Systems and methods for datacenter are disclosed. In at least one embodiment, a system or method herein causes a process for a structure that includes a component tracking system, where such a system includes individual components within individual servers or individual racks, the process being based in part on at least location information and configuration information from one or more of an optical sensor or a radio sensor associated with a motile-support that is adapted for at least three dimensional (3D) movement in a space having the individual servers or the individual racks.
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公开(公告)号：US20240069005A1
公开(公告)日：2024-02-29
申请号：US17893834
申请日：2022-08-23
Applicant: NVIDIA Corporation
Inventor： Ryan Kelsey Albright , William Andrew Mecham , Tahir Cader , Michael Scott Thompson , Aaron Richard Carkin , William Ryan Weese , Benjamin Joseph Goska , Marc Davis
CPC classification number: G01N33/2888 , G01N11/02 , G01N21/9072 , G06N20/00
Abstract: A method includes determining, using a processing device, a set of observations from coolant data, the coolant data being received from one or more sensors in an environment associated with a coolant. The method further includes determining, using a machine learning model and the set of observations, a contamination level of the coolant. The method also includes initiating an operation, using the processing device, responsive to determining the coolant contamination level.
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公开(公告)号：US20240049380A1
公开(公告)日：2024-02-08
申请号：US17879620
申请日：2022-08-02
Applicant: NVIDIA Corporation
Inventor： David Mohr , Tahir Cader , Elad Mentovich , Boaz Atias , Chong Tan
CPC classification number: H05K1/0209 , H05K7/20154 , H05K7/209 , H05K7/20909
Abstract: A power arrangement and cooling system for electronic devices includes a processing unit electrically interconnected and disposed to a first side of a printed circuit board and a power converter electrically interconnected and disposed on a second side of the printed circuit board. The power converter includes a thermally conductive material layer that transfers heat generated by the power converter during operation away from the power converter toward a heatsink that is disposed adjacent the second side of the printed circuit board. Heat generated by the processing unit is absorbed by a heatsink disposed adjacent the first side of the printed circuit board. Power for the processing unit is provided, by the power converter, through a thickness of the printed circuit board.
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公开(公告)号：US20250068132A1
公开(公告)日：2025-02-27
申请号：US18237233
申请日：2023-08-23
Applicant: Nvidia Corporation
Inventor： Elad Mentovich , Siddha Ganju , Jeff Whitmer , Ryan Albright , Tahir Cader , Ron Chao
Abstract: Methods are described herein for manufacturing multi-component objects using artificial intelligence. The present invention may be directed to a method that includes determining an actual value of a first attribute of a first component of an object and determining, using a machine learning model and based on the actual value of the first attribute, an optimized value for a second attribute of a second component that is functionally interrelated to the first component in the object. The method may include selecting, from a plurality of second components each having a value for the second attribute within a tolerance range, a second component having the optimized value for the second attribute. The method may further include manufacturing the object using the first component and the selected second component.
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Patent Agency Ranking
公开(公告)号：US20240379084A1
公开(公告)日：2024-11-14
申请号：US18195073
申请日：2023-05-09
Applicant: NVIDIA CORPORATION
Inventor： William Mecham , Ryan Albright , William Ryan Weese , Benjamin Goska , Aaron Carkin , Michael Thompson , Tahir Cader , Jordan Levy
Abstract: Thermal management systems and associated methods are provided with acoustic isolation. An example system includes a computing device that defines a first housing supporting one or more processing units and a thermal management system. The thermal management system includes a pressure generation mechanism and one or more cooling conduits operably coupled with the pressure generation mechanism, and the one or more cooling conduits provide fluid communication between the computing device and the pressure generation mechanism. The pressure generation mechanism causes circulation of cooling fluid to the computing device via the one or more cooling conduits so as to dissipate heat generated by the one or more processing units, and the pressure generation mechanism is acoustically isolated from the computing device.
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公开(公告)号：US20250120052A1
公开(公告)日：2025-04-10
申请号：US18377017
申请日：2023-10-05
Applicant: Nvidia Corporation
Inventor： Ryan Albright , Tahir Cader , Aaron Carkin , Siddha Ganju , Kenneth Misin , William Mecham , William Ryan Weese , Benjamin Goska , Jordan Levy , Michael Thompson , Elad Mentovich , Fred Devoir
IPC: H05K7/20
Abstract: Devices, apparatuses, and systems for thermal management in networking and computing systems are provided. An example in-rack thermal management system includes a cooling distribution unit (CDU) that includes a housing that defines a fluid inlet and a fluid outlet, thermal management components supported by the housing, and direct mechanical connections coupled with the fluid inlet and the fluid outlet. The in-rack thermal management system includes a fluid distribution system that includes a primary fluid channel directly coupled with the direct mechanical connection of the fluid inlet, and a secondary fluid channel directly coupled with the direct mechanical connection of the fluid outlet. In operation, the thermal management components dissipate heat of a fluid received by the CDU via the fluid inlet. The direct mechanical connections directly interface with the fluid distribution system to provide fluid communication between the CDU and the fluid distribution system to maximize dimensions of the housing.
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公开(公告)号：US20250098108A1
公开(公告)日：2025-03-20
申请号：US18369917
申请日：2023-09-19
Applicant: NVIDIA CORPORATION
Inventor： Tahir Cader , David Copeland , Elad Mentovich
Abstract: Devices, apparatuses, systems, and methods are provided for hybrid thermal management in computing modules. An example computing module includes a first computing component having a first operating temperature and a second computing component having a second operating temperature. The first operating temperature is greater than the second operating temperature. The example computing module further includes a hybrid thermal management system including a cooling delivery device configured to receive a cooling fluid. The cooling delivery device defines a first section configured to dissipate heat generated by the first computing component and a second section configured to dissipate heat generated by the second computing component. The first section of the cooling delivery device may be fluidically isolated from the second section of the cooling delivery device or the second section may be in fluid communication with the first section.
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公开(公告)号：US12245360B2
公开(公告)日：2025-03-04
申请号：US17879620
申请日：2022-08-02
Applicant: NVIDIA Corporation
Inventor： David Mohr , Tahir Cader , Elad Mentovich , Boaz Atias , Chong Tan
Abstract: A power arrangement and cooling system for electronic devices includes a processing unit electrically interconnected and disposed to a first side of a printed circuit board and a power converter electrically interconnected and disposed on a second side of the printed circuit board. The power converter includes a thermally conductive material layer that transfers heat generated by the power converter during operation away from the power converter toward a heatsink that is disposed adjacent the second side of the printed circuit board. Heat generated by the processing unit is absorbed by a heatsink disposed adjacent the first side of the printed circuit board. Power for the processing unit is provided, by the power converter, through a thickness of the printed circuit board.
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公开(公告)号：US20240381582A1
公开(公告)日：2024-11-14
申请号：US18144971
申请日：2023-05-09
Applicant: NVIDIA CORPORATION
Inventor： Siddha Ganju , Fred Devoir , Elad Mentovich , Ryan Albright , Tahir Cader , Kenneth Misin , William Mecham , Benjamin Goska , Jordan Levy , Aaron Carkin , Michael Thompson , William Ryan Weese , Ran Rakovsky , Rotem Barzilay , Itamar Frenkel , Yaakov Gridish
Abstract: Some embodiments described herein provide intelligent movable racks for a data center and a central system for monitoring and directing the positioning of such racks within the data center. For example, a rack may include computing equipment as well as a power system, a cooling system, and a cabling system (e.g., for data communication). The rack may include a controller in communication with the computing equipment, the power system, the cooling system, and the cabling system. The rack may also include a rack interface for physically supporting the rack and operatively connecting the systems of the rack to power, cooling, and cabling infrastructure of the data center. The rack interface may receive an autonomous robot for moving the rack within the data center. The controller may control the power system and the cooling system based in part on the autonomous movement of the rack.
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