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公开(公告)号：US12219691B2
公开(公告)日：2025-02-04
申请号：US17728731
申请日：2022-04-25
Applicant: NVIDIA CORPORATION
Inventor： David Haley , James Stephen Fields, Jr. , Seungkug Park
Abstract: A printed circuit board assembly comprises: a printed circuit board (PCB); an integrated circuit (IC) package that is mounted on the PCB and includes a first surface and a bare IC die disposed on the first surface; and a vapor chamber coupled to the first surface of the IC package.
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