公开(公告)号：US12022633B2

公开(公告)日：2024-06-25

申请号：US17011437

申请日：2020-09-03

Applicant: NVIDIA CORPORATION

Inventor： David Haley ,  Xiang Sun ,  Gabriele Gorla ,  Andrew Bell ,  Boris Landwehr

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20145 ,  G06F1/20 ,  H05K7/20163 ,  H05K7/20172

Abstract: A graphics subsystem includes a printed circuit board (PCB), a blower, and a heat sink. A graphics processing unit (GPU) is integrated into the PCB. The PCB is shortened to occupy a portion of the width of the graphics subsystem. The heat sink is coupled to the PCB and/or GPU similarly occupies just a portion of the width of the graphics subsystem. The blower is disposed adjacent to the PCB and heat sink and configured to occupy the full height of the graphics subsystem. The blower is further configured to intake air from both the top side of the graphics subsystem and the bottom side of the graphics subsystem. In this configuration, the blower provides an elevated air flow rate in order to facilitate cooling of the PCB and/or GPU.

公开(公告)号：US09775229B1

公开(公告)日：2017-09-26

申请号：US15414902

申请日：2017-01-25

Applicant: Nvidia Corporation

Inventor： David Haley ,  Carlo Galutera

IPC: H05K1/02 ,  H05K3/30 ,  H05K5/00

CPC classification number: H05K1/0203 ,  G06F1/203 ,  H01L23/40 ,  H01L23/42 ,  H01L23/4338 ,  H05K3/30 ,  H05K5/0086

Abstract: This disclosure describes an electronics device that effectively removes heat from the SoC, which increases its efficiency and extends its useful life by spreading heat in the thermally conductive plate before transferring it across the interface. Surface area is a significant factor in TIM thermal performance, so this increases the performance substantially when using the same type of TIM pad. This device allows the use of lower performance TIM pads that resolve the issues of high die pressure and non-resilient behavior of high thermal conductivity TIMs. Additionally, the device mechanically isolates the SoC from the heatsink, which reduces stress and provides improved thermal performance.

公开(公告)号：US12298825B2

公开(公告)日：2025-05-13

申请号：US16653095

申请日：2019-10-15

Applicant: Nvidia Corporation

Inventor： Qi Lin ,  David Haley ,  Chad Plummer ,  Hans Schulze ,  Darryl Moore

IPC: G06F1/20 ,  G01K7/42 ,  G01M99/00 ,  G05B19/404 ,  H05K7/20

Abstract: The disclosure provides a cooling solution that evaluates the thermal environment of a computer component based on transient thermal responses of the computer component. The transient thermal responses are generated by measuring the temperature rise of the computer component over a designated amount of time for multiple “good” assemblies and multiple “bad” assemblies to determine a duration and allowable temperature rise needed to set a pass/fail criteria for different failure modes of cooling devices. A cooling device may not be operating as designed due to damage, needed maintenance, missing thermal interface material (TIM), improper installation, etc. From the transient thermal responses, a thermal problem, such as a malfunctioning fan, can be determined and a corrective action can be performed.

公开(公告)号：US12219691B2

公开(公告)日：2025-02-04

申请号：US17728731

申请日：2022-04-25

Applicant: NVIDIA CORPORATION

Inventor： David Haley ,  James Stephen Fields, Jr. ,  Seungkug Park

IPC: H05K1/02 ,  G06F1/20 ,  H05K1/18

Abstract: A printed circuit board assembly comprises: a printed circuit board (PCB); an integrated circuit (IC) package that is mounted on the PCB and includes a first surface and a bare IC die disposed on the first surface; and a vapor chamber coupled to the first surface of the IC package.

公开(公告)号：US11681340B2

公开(公告)日：2023-06-20

申请号：US17121565

申请日：2020-12-14

Applicant: NVIDIA CORPORATION

Inventor： David Haley ,  Xiang Sun ,  Gabriele Gorla ,  Andrew Bell ,  Boris Landwehr

IPC: G06F1/20 ,  H05K7/20

CPC classification number: G06F1/20 ,  H05K7/2039 ,  H05K7/20154 ,  G06F2200/201

Abstract: A graphics subsystem includes a printed circuit board (PCB), a set of one or more fans, and a heat sink. A graphics processing unit (GPU) is integrated into the PCB. The PCB is shortened to occupy a portion of the width of the graphics subsystem. The heat sink is coupled to the PCB and/or GPU and configured to extend beyond an edge of the PCB, thereby occupying a larger portion of the width of the graphics subsystem compared to the PCB. A first fan is disposed partially or fully beyond the edge of the PCB and is configured to direct air through the portion of the heat sink that extends beyond the edge of the PCB, along a first airflow path, and out of the graphics subsystem. A second fan is configured to direct air through the heat sink, along a second airflow path, towards the GPU.

公开(公告)号：US20250003694A1

公开(公告)日：2025-01-02

申请号：US18223154

申请日：2023-07-18

Applicant: NVIDIA CORPORATION

Inventor： Ron CHAO ,  Elad Mentovich ,  Harrison Sangwha Kim ,  Mark North ,  Xinwei Lu ,  Tahir Cader ,  Fei Zhang ,  Yunseok Kim ,  David Haley ,  Yuezhan Steven Zhu ,  Lei Huang

IPC: F28D15/04 ,  F28D15/02

Abstract: A heat transfer apparatus including a housing and a wick structure is provided that is configured to dissipate heat from a heat source. The housing defines a chamber that holds working fluid. The wick structure includes a body and pores defined by the body. The heat transfer apparatus defines an evaporator section configured to evaporate the working fluid using heat from a heat source and a condenser section configured to dissipate heat carried by the evaporated working fluid through condensation of the evaporated working fluid. The wick structure has a repeatable, configurable, and controlled geometry optimized to move the working fluid from the condenser section to the evaporator section via capillary action. The body of the wick structure may have a gyroidal geometry. Associated methods are also provided.

公开(公告)号：US10571978B2

公开(公告)日：2020-02-25

申请号：US14882363

申请日：2015-10-13

Applicant: NVIDIA CORPORATION

Inventor： David Haley ,  Hans Schulze

IPC: G06F1/20

Abstract: A fan control module configured to control the speed of a fan receives a signal that indicates the power used by a graphics processing unit (GPU) and a signal that indicates the GPU temperature. Whenever the GPU power exceeds a power threshold level, but the GPU temperature is below a temperature threshold level, the control module turns the fan on and causes the fan to operate at a minimum speed. Whenever the GPU temperature is above the temperature threshold, the control module causes the fan speed to increase with increasing temperature, regardless of power. The control module turns the fan off only when both the GPU temperature is below the temperature threshold and the GPU power is below the power threshold. Although the algorithm is discussed in conjunction with a GPU, the algorithm can be implemented with any type of processor or subsystem that needs to be fan-cooled.