公开(公告)号：US20130256825A1

公开(公告)日：2013-10-03

申请号：US13852978

申请日：2013-03-28

Applicant: NXP B.V.

Inventor： Aurelie HUMBERT ,  Roel DAAMEN ,  Viet Hoang NGUYEN

IPC: H01L27/16 ,  H01L37/00

CPC classification number: H01L27/16 ,  G01N27/18 ,  G01N33/004 ,  H01L37/00 ,  H01L37/02

Abstract: An integrated circuit and a method of making the same. The integrated circuit includes a semiconductor substrate having a major surface. The integrated circuit also includes a thermal conductivity based gas sensor having an electrically resistive sensor element located on the major surface for exposure to a gas to be sensed. The integrated circuit further includes a barrier located on the major surface for inhibiting a flow of the gas across the sensor element.

Abstract translation: 一种集成电路及其制造方法。 集成电路包括具有主表面的半导体衬底。 集成电路还包括基于导热系数的气体传感器，其具有位于主表面上的用于暴露于待感测气体的电阻传感器元件。 集成电路还包括位于主表面上的阻挡气体穿过传感器元件的阻挡层。