公开(公告)号：US20240237316A9

公开(公告)日：2024-07-11

申请号：US18048495

申请日：2022-10-21

申请人： NXP B.V.

发明人： Philipp Franz Freidl ,  Mustafa Acar ,  Antonius Hendrikus Jozef Kamphuis ,  Erik Daniel Björk ,  Konstantinos Giannakidis ,  Jan Willem Bergman ,  Rajesh Mandamparambil ,  Paul Mattheijssen

IPC分类号： H05K9/00 ,  H01L23/552

CPC分类号： H05K9/0032 ,  H01L23/552 ,  H05K9/0088

摘要： One example discloses an on-chip shielded device, including: a planar structure including a substrate and a passivation layer; an electrical component formed within the substrate and coupled to an input signal path and an output signal path; a first shielding element positioned above the electrical component and the passivation layer; and a second shielding element positioned above the electrical component, the passivation layer and the first shielding element.

公开(公告)号：US20240138129A1

公开(公告)日：2024-04-25

申请号：US18048495

申请日：2022-10-20

申请人： NXP B.V.

发明人： Philipp Franz Freidl ,  Mustafa Acar ,  Antonius Hendrikus Jozef Kamphuis ,  Erik Daniel Björk ,  Konstantinos Giannakidis ,  Jan Willem Bergman ,  Rajesh Mandamparambil ,  Paul Mattheijssen

IPC分类号： H05K9/00 ,  H01L23/552

CPC分类号： H05K9/0032 ,  H01L23/552 ,  H05K9/0088

摘要： One example discloses an on-chip shielded device, including: a planar structure including a substrate and a passivation layer; an electrical component formed within the substrate and coupled to an input signal path and an output signal path; a first shielding element positioned above the electrical component and the passivation layer; and a second shielding element positioned above the electrical component, the passivation layer and the first shielding element.