公开(公告)号：US20160260651A1

公开(公告)日：2016-09-08

申请号：US15049419

申请日：2016-02-22

Applicant: NXP B.V.

Inventor： Shun Tik YEUNG ,  Pompeo Umali ,  Hans-Juergen Funke ,  Chi Ho Leung ,  Wolfgang Schnitt ,  Zhihao Pan

IPC: H01L23/367 ,  H01L27/02 ,  H01L23/31 ,  H01L23/528 ,  H01L21/56 ,  H01L23/532 ,  H01L21/78

Abstract: A semiconductor device and a method of making the same. The device includes an electrically conductive heat sink having a first surface. The device also includes a semiconductor substrate. The device further includes a first contact located on a first surface of the substrate. The device also includes a second contact located on a second surface of the substrate. The first surface of the substrate is mounted on the first surface of the heat sink for electrical and thermal conduction between the heat sink and the substrate via the first contact. The second surface of the substrate is mountable on a surface of a carrier.

Abstract translation: 半导体器件及其制造方法。 该装置包括具有第一表面的导电散热器。 该器件还包括半导体衬底。 该装置还包括位于基板的第一表面上的第一触点。 该装置还包括位于基板的第二表面上的第二触点。 衬底的第一表面安装在散热器的第一表面上，用于通过第一接触件在散热器和衬底之间进行电和热传导。 基板的第二表面可安装在载体的表面上。