公开(公告)号：US20140160607A1

公开(公告)日：2014-06-12

申请号：US14072122

申请日：2013-11-05

Applicant: NXP B.V.

Inventor： Klaus REIMANN ,  Hans-Martin RITTER ,  Wolfgang Schnitt ,  Anco HERINGA

IPC: H02H9/04

CPC classification number: H02H9/046 ,  H01L27/0255

Abstract: An ESD protection circuit comprises a series connection of at least two protection components between a signal line to be protected and a return line (e.g. ground), comprising a first protection component connected to the signal line and a second protection component connected to the ground line. They are connected with opposite polarity so that when one conducts in forward direction the other conducts in reverse breakdown mode. A bias voltage source connects to the junction between the two protection components through a bias impedance. The use of the bias voltage enables the signal distortions resulting from the ESD protection circuit to be reduced.

Abstract translation: ESD保护电路包括在待保护的信号线和返回线（例如接地）之间的至少两个保护部件的串联连接，包括连接到信号线的第一保护部件和连接到接地线的第二保护部件 。 它们以相反的极性连接，使得当一个正向导通时，另一个导通反向击穿模式。 偏置电压源通过偏置阻抗连接到两个保护元件之间的接点。 使用偏置电压可以降低由ESD保护电路产生的信号失真。

公开(公告)号：US20160260651A1

公开(公告)日：2016-09-08

申请号：US15049419

申请日：2016-02-22

Applicant: NXP B.V.

Inventor： Shun Tik YEUNG ,  Pompeo Umali ,  Hans-Juergen Funke ,  Chi Ho Leung ,  Wolfgang Schnitt ,  Zhihao Pan

IPC: H01L23/367 ,  H01L27/02 ,  H01L23/31 ,  H01L23/528 ,  H01L21/56 ,  H01L23/532 ,  H01L21/78

Abstract: A semiconductor device and a method of making the same. The device includes an electrically conductive heat sink having a first surface. The device also includes a semiconductor substrate. The device further includes a first contact located on a first surface of the substrate. The device also includes a second contact located on a second surface of the substrate. The first surface of the substrate is mounted on the first surface of the heat sink for electrical and thermal conduction between the heat sink and the substrate via the first contact. The second surface of the substrate is mountable on a surface of a carrier.

Abstract translation: 半导体器件及其制造方法。 该装置包括具有第一表面的导电散热器。 该器件还包括半导体衬底。 该装置还包括位于基板的第一表面上的第一触点。 该装置还包括位于基板的第二表面上的第二触点。 衬底的第一表面安装在散热器的第一表面上，用于通过第一接触件在散热器和衬底之间进行电和热传导。 基板的第二表面可安装在载体的表面上。

公开(公告)号：US09368963B2

公开(公告)日：2016-06-14

申请号：US14072122

申请日：2013-11-05

Applicant: NXP B.V.

Inventor： Klaus Reimann ,  Hans-Martin Ritter ,  Wolfgang Schnitt ,  Anco Heringa

IPC: H02H9/04 ,  H01L27/02

CPC classification number: H02H9/046 ,  H01L27/0255

Abstract: An ESD protection circuit comprises a series connection of at least two protection components between a signal line to be protected and a return line (e.g. ground), comprising a first protection component connected to the signal line and a second protection component connected to the ground line. They are connected with opposite polarity so that when one conducts in forward direction the other conducts in reverse breakdown mode. A bias voltage source connects to the junction between the two protection components through a bias impedance. The use of the bias voltage enables the signal distortions resulting from the ESD protection circuit to be reduced.

Abstract translation: ESD保护电路包括在待保护的信号线和返回线（例如接地）之间的至少两个保护部件的串联连接，包括连接到信号线的第一保护部件和连接到接地线的第二保护部件 。 它们以相反的极性连接，使得当一个正向导通时，另一个导通反向击穿模式。 偏置电压源通过偏置阻抗连接到两个保护元件之间的接点。 使用偏置电压可以降低由ESD保护电路产生的信号失真。