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公开(公告)号：US10649585B1
公开(公告)日：2020-05-12
申请号：US16242116
申请日：2019-01-08
Applicant: NXP B.V.
Inventor： Jozef Thomas Martinus van Beek , James Raymond Spehar , Kim Phan Le
IPC: H01Q13/20 , H01Q13/28 , G06F3/042 , H01Q1/24 , H03K17/955 , H04B1/02 , H01Q21/06 , H01Q13/08 , H01Q3/44
Abstract: An electric field sensor including a dielectric layer having a plane surface, at least one transceiver antenna disposed on one side of the dielectric layer, the at least one transceiver antenna configured to emit a wave above the plane surface of the dielectric layer and detect an event adjacent the plane surface, an integrated circuit coupled to the at least one transceiver antenna.
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公开(公告)号：US11368036B2
公开(公告)日：2022-06-21
申请号：US16860944
申请日：2020-04-28
Applicant: NXP B.V.
Abstract: One example discloses a power management circuit, including: an ultrasonic transmitter configured to generate an ultrasonic signal having a set of transmitted ultrasonic signal attributes; an ultrasonic receiver configured to detect the ultrasonic signal having a set of received ultrasonic signal attributes; wherein the power management circuit is configured to cause a device to be operated at a first power level and a second power level; and a proximity detection circuit configured to transition the device from the first power level to the second power level in response to a preselected difference between the transmitted set of ultrasonic signal attributes and the received set of ultrasonic signal attributes.
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公开(公告)号：US20210336470A1
公开(公告)日：2021-10-28
申请号：US16860944
申请日：2020-04-28
Applicant: NXP B.V.
Abstract: One example discloses a power management circuit, including: an ultrasonic transmitter configured to generate an ultrasonic signal having a set of transmitted ultrasonic signal attributes; an ultrasonic receiver configured to detect the ultrasonic signal having a set of received ultrasonic signal attributes; wherein the power management circuit is configured to cause a device to be operated at a first power level and a second power level; and a proximity detection circuit configured to transition the device from the first power level to the second power level in response to a preselected difference between the transmitted set of ultrasonic signal attributes and the received set of ultrasonic signal attributes.
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公开(公告)号：US10192837B1
公开(公告)日：2019-01-29
申请号：US15849656
申请日：2017-12-20
Applicant: NXP B.V.
Inventor： Chung Hsiung Ho , Wayne Hsiao , Richard Te Gan , James Raymond Spehar
IPC: H01L23/00
Abstract: A wafer-level chip-scale package (WLCSP) includes an integrated circuit (IC) chip, and die bonding pads with a redistribution layer (RDL) having multiple via structures located directly below the footprint of a solder ball placed on the bonding pad. The via structures electrically connect the solder ball to a top metal layer of the IC chip. The RDL may extend beyond the solder ball's footprint and have additional vias that connect to the top metal layer, including vias located under and connected to other solder balls. The bonding pads have a low R-on resistance and are not susceptible to thermal-induced cracking.
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