公开(公告)号：US08680690B1

公开(公告)日：2014-03-25

申请号：US13708117

申请日：2012-12-07

Applicant: NXP B.V.

Inventor： Peter Steeneken ,  Rameswor Shrestha ,  Martijn Bredius

IPC: H01L23/49 ,  H01L23/66

CPC classification number: H01L24/49 ,  H01L23/66 ,  H01L24/48 ,  H01L2223/6611 ,  H01L2223/6638 ,  H01L2224/05554 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49052 ,  H01L2224/4909 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H04L25/0266 ,  H04L25/0272 ,  H04L25/0274 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00

Abstract: In one embodiment, a device includes a first IC having a differential signal driver and a first isolation circuit configured to provide differential signals transmitted by the differential signal driver to a first pair of bond pads of the first IC. First and second bond wires are configured to provide differential signals from the first pair of bond pads to a second pair of bond pad included in a second IC. The second IC includes a second isolation circuit configured to provide differential signals from the second pair of bond pads to a differential receiver circuit of the second IC. The bond wires are specifically arranged such that a distance between the first and second bond wires varies by at least 10% as measured at two points along a length of the first bond wire.

Abstract translation: 在一个实施例中，设备包括具有差分信号驱动器的第一IC和被配置为将差分信号驱动器发送的差分信号提供给第一IC的第一对接合焊盘的第一隔离电路。 第一和第二接合线被配置为提供从第一对接合焊盘到包括在第二IC中的第二对接合焊盘的差分信号。 第二IC包括第二隔离电路，其被配置为将来自第二对接合焊盘的差分信号提供给第二IC的差分接收器电路。 接合线被特别布置成使得在沿着第一接合线的长度的两个点处测量的第一和第二接合线之间的距离变化至少10％。