公开(公告)号：US20240395737A1

公开(公告)日：2024-11-28

申请号：US18663503

申请日：2024-05-14

Applicant: NXP B.V.

Inventor： Ralph Matthijs van Schelven ,  Waqas Hassan Syed ,  Konstantinos Doris ,  Lukas Frederik Tiemeijer ,  Gilles Montoriol ,  Francis Jean Guy AUVRAY

IPC: H01L23/66 ,  H01L23/498

Abstract: A package for an integrated circuit, IC, the package comprising an interposer comprising: a first metal layer including a first metal plate; a second metal layer including a second metal plate; and a dielectric layer separating the first metal layer and the second metal layer, wherein the first metal plate and the second metal plate are arranged to form a parallel plate waveguide, PPW, and wherein the first metal plate comprises a slot for receiving one or more differential signals from the IC.

公开(公告)号：US20240106105A1

公开(公告)日：2024-03-28

申请号：US18469605

申请日：2023-09-19

Applicant: NXP B.V.

Inventor： Waqas Hassan Syed ,  Ralph Matthijs van Schelven ,  Giorgio Carluccio ,  Pieter Lok ,  Antonius Johannes Matheus de Graauw ,  Konstantinos Doris ,  Daniele Cavallo ,  Andrea Neto

IPC: H01Q1/22 ,  H01Q1/42 ,  H01Q21/06

CPC classification number: H01Q1/2283 ,  H01Q1/42 ,  H01Q21/061

Abstract: In accordance with a first aspect of the present disclosure, an antenna unit is provided, comprising: an integrated circuit package containing an integrated circuit die and an antenna structure coupled to the integrated circuit die; a dielectric layer separated from the integrated circuit package, wherein the dielectric layer is placed at a predefined distance above an upper surface of the integrated circuit package. In accordance with a second aspect of the present disclosure, a corresponding method of producing an antenna unit is conceived.