CONDUCTIVITY REDUCING FEATURES IN AN INTEGRATED CIRCUIT

    公开(公告)号:US20220375923A1

    公开(公告)日:2022-11-24

    申请号:US17374214

    申请日:2021-07-13

    Applicant: NXP B.V.

    Abstract: An integrated circuit includes two N wells from two different devices in close proximity to each other with each N well biased by two different terminals. The N wells are at least partially surrounded by P type regions that are biased by a terminal. The integrated circuit includes conductivity reduction features that increase the resistivity of current paths to a P type regions of one device on a side closest the other device. The integrated circuit includes two conductive tie biasing structures each located directly over an N type region of the substrate and directly over a P type region of the substrate. The two conductive tie biasing structures are not electrically connected to each other and are not electrically coupled to each other by a conductive biasing structure.

    Conductivity reducing features in an integrated circuit

    公开(公告)号:US12205942B2

    公开(公告)日:2025-01-21

    申请号:US17374214

    申请日:2021-07-13

    Applicant: NXP B.V.

    Abstract: An integrated circuit includes two N wells from two different devices in close proximity to each other with each N well biased by two different terminals. The N wells are at least partially surrounded by P type regions that are biased by a terminal. The integrated circuit includes conductivity reduction features that increase the resistivity of current paths to a P type regions of one device on a side closest the other device. The integrated circuit includes two conductive tie biasing structures each located directly over an N type region of the substrate and directly over a P type region of the substrate. The two conductive tie biasing structures are not electrically connected to each other and are not electrically coupled to each other by a conductive biasing structure.

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