公开(公告)号：US20210183797A1

公开(公告)日：2021-06-17

申请号：US16716711

申请日：2019-12-17

Applicant: NXP USA, Inc.

Inventor： Michael B. Vincent ,  Antonius Johannes Matheus de Graauw ,  Giorgio Carluccio ,  Waqas Hassan Syed ,  Maristella Spella

IPC: H01L23/66 ,  H01L23/367 ,  H01L23/538 ,  H01P1/30 ,  H01P3/12 ,  H01L21/48 ,  H01P11/00 ,  H01Q21/00

Abstract: A mechanism is provided to remove heat from an integrated circuit (IC) device die by directing heat through a waveguide to a heat sink. Embodiments provide the waveguide mounted on top of a package containing the IC device die. The waveguide is thermally coupled to the IC device die. The waveguide transports the heat to a heat sink coupled to the waveguide and located adjacent to the package on top of a printed circuit board on which the package is mounted. Embodiments provide both thermal dissipation of the generated heat while at the same time maintaining good radio frequency (RF) performance of the waveguide.

公开(公告)号：US11631625B2

公开(公告)日：2023-04-18

申请号：US17820300

申请日：2022-08-17

Applicant: NXP USA, Inc.

Inventor： Michael B. Vincent ,  Antonius Johannes Matheus de Graauw ,  Giorgio Carluccio ,  Waqas Hassan Syed ,  Maristella Spella

IPC: H01L23/367 ,  H01L21/48 ,  H01P1/26

Abstract: A mechanism is provided to remove heat from an integrated circuit (IC) device die by directing heat through a waveguide to a heat sink. The waveguide is mounted on top of a package containing the IC device die. The waveguide is thermally coupled to the IC device die. The waveguide transports the heat to a heat sink coupled to the waveguide and located adjacent to the package on top of a printed circuit board on which the package is mounted. Embodiments provide both thermal dissipation of the generated heat while at the same time maintaining good radio frequency performance of the waveguide.

公开(公告)号：US11456227B2

公开(公告)日：2022-09-27

申请号：US16716720

申请日：2019-12-17

Applicant: NXP USA, Inc.

Inventor： Michael B. Vincent ,  Antonius Johannes Matheus de Graauw ,  Giorgio Carluccio ,  Waqas Hassan Syed ,  Maristella Spella

IPC: H01L23/367 ,  H01L21/48 ,  H01P1/26

Abstract: A mechanism is provided to remove heat from an integrated circuit (IC) device die by directing heat through a waveguide to a heat sink. The waveguide is mounted on top of a package containing the IC device die. The waveguide is thermally coupled to the IC device die. The waveguide transports the heat to a heat sink coupled to the waveguide and located adjacent to the package on top of a printed circuit board on which the package is mounted. Embodiments provide both thermal dissipation of the generated heat while at the same time maintaining good radio frequency performance of the waveguide.

公开(公告)号：US11276654B2

公开(公告)日：2022-03-15

申请号：US16716711

申请日：2019-12-17

Applicant: NXP USA, Inc.

Inventor： Michael B. Vincent ,  Antonius Johannes Matheus de Graauw ,  Giorgio Carluccio ,  Waqas Hassan Syed ,  Maristella Spella

IPC: H01L23/66 ,  H01L23/367 ,  H01L23/538 ,  H01P1/30 ,  H01L21/48 ,  H01P11/00 ,  H01Q21/00 ,  H01P3/12

Abstract: A mechanism is provided to remove heat from an integrated circuit (IC) device die by directing heat through a waveguide to a heat sink. Embodiments provide the waveguide mounted on top of a package containing the IC device die. The waveguide is thermally coupled to the IC device die. The waveguide transports the heat to a heat sink coupled to the waveguide and located adjacent to the package on top of a printed circuit board on which the package is mounted. Embodiments provide both thermal dissipation of the generated heat while at the same time maintaining good radio frequency (RF) performance of the waveguide.

公开(公告)号：US12196881B2

公开(公告)日：2025-01-14

申请号：US17361511

申请日：2021-06-29

Applicant: NXP USA, INC.

Inventor： Gilles Montoriol ,  Cristian Pavao Moreira ,  Maarten Lont ,  Antonius Johannes Matheus de Graauw

IPC: G01S7/35 ,  G01S7/02 ,  G01S13/02 ,  G01S13/34

Abstract: A radar system includes a hybrid-power amplifier and a power control unit coupled to the hybrid-power amplifier. The power control unit is configured to control the amplification of a chirp signal output by the radar system based upon an assessment of an interchirp time provided by a chirp profile. The interchirp time is a time difference between a first chirp signal and a second chirp signal that are to be output by the hybrid-power amplifier. When the power control unit determines that the interchirp time is less than an interchirp time threshold, a fast-power loop control configuration is used to control the transmitted output power at hybrid amplifier level. When the power control unit determines that the interchirp time is equal to or greater than the interchirp time threshold, a slow-power loop configuration or a combination of the slow-loop configuration and the fast-loop configuration is used to control the transmitted output power at the hybrid-power amplifier. A look-up table generated by the power control unit in a controller is used to ascertain the control signals and values that are to be used by the hybrid-power amplifier and voltage regulator to amplify the chirp signal.

公开(公告)号：US20220392821A1

公开(公告)日：2022-12-08

申请号：US17820300

申请日：2022-08-17

Applicant: NXP USA, Inc.

Inventor： Michael B. Vincent ,  Antonius Johannes Matheus de Graauw ,  Giorgio Carluccio ,  Waqas Hassan Syed ,  Maristella Spella

IPC: H01L23/367 ,  H01L21/48 ,  H01P1/26

Abstract: A mechanism is provided to remove heat from an integrated circuit (IC) device die by directing heat through a waveguide to a heat sink. The waveguide is mounted on top of a package containing the IC device die. The waveguide is thermally coupled to the IC device die. The waveguide transports the heat to a heat sink coupled to the waveguide and located adjacent to the package on top of a printed circuit board on which the package is mounted. Embodiments provide both thermal dissipation of the generated heat while at the same time maintaining good radio frequency performance of the waveguide.

公开(公告)号：US20220018929A1

公开(公告)日：2022-01-20

申请号：US17361511

申请日：2021-06-29

Applicant: NXP USA, INC.

Inventor： Gilles Montoriol ,  Cristian Pavao Moreira ,  Maarten Lont ,  Antonius Johannes Matheus de Graauw

IPC: G01S7/35

Abstract: A radar system includes a hybrid-power amplifier and a power control unit coupled to the hybrid-power amplifier. The power control unit is configured to control the amplification of a chirp signal output by the radar system based upon an assessment of an interchirp time provided by a chirp profile. The interchirp time is a time difference between a first chirp signal and a second chirp signal that are to be output by the hybrid-power amplifier. When the power control unit determines that the interchirp time is less than an interchirp time threshold, a fast-power loop control configuration is used to control the transmitted output power at hybrid amplifier level. When the power control unit determines that the interchirp time is equal to or greater than the interchirp time threshold, a slow-power loop configuration or a combination of the slow-loop configuration and the fast-loop configuration is used to control the transmitted output power at the hybrid-power amplifier. A look-up table generated by the power control unit in a controller is used to ascertain the control signals and values that are to be used by the hybrid-power amplifier and voltage regulator to amplify the chirp signal.

公开(公告)号：US20210183725A1

公开(公告)日：2021-06-17

申请号：US16716720

申请日：2019-12-17

Applicant: NXP USA, Inc.

Inventor： Michael B. Vincent ,  Antonius Johannes Matheus de Graauw ,  Giorgio Carluccio ,  Waqas Hassan Syed ,  Maristella Spella

IPC: H01L23/367 ,  H01P1/26 ,  H01L21/48

Abstract: A mechanism is provided to remove heat from an integrated circuit (IC) device die by directing heat through a waveguide to a heat sink. The waveguide is mounted on top of a package containing the IC device die. The waveguide is thermally coupled to the IC device die. The waveguide transports the heat to a heat sink coupled to the waveguide and located adjacent to the package on top of a printed circuit board on which the package is mounted. Embodiments provide both thermal dissipation of the generated heat while at the same time maintaining good radio frequency performance of the waveguide.