公开(公告)号：US20230158604A1

公开(公告)日：2023-05-25

申请号：US17761221

申请日：2021-03-04

Applicant: Nagoya Institute of Technology

Inventor： Fumihiro Itoigawa ,  Osamu Konda ,  Sho Fujiwara ,  Shotaro Yasuda

IPC: B23K26/08 ,  B23K26/03 ,  B23K26/36

CPC classification number: B23K26/083 ,  B23K26/032 ,  B23K26/36

Abstract: Provided is a laser processing apparatus configured to machine a corner portion of a sample by causing the corner portion to relatively approach a laser, the laser being emitted such that an optical axis of the laser extends in a predetermined direction, the corner portion being formed by a plurality of adjacent surfaces of the sample, the laser processing apparatus including: a detection unit provided at a position at least outside an irradiation region of the laser, the irradiation region extending in a tubular shape in a plan view intersecting the optical axis, the detection unit being configured to detect intensity of light reaching the position; approach control means for controlling an actuator relatively displacing the sample along a direction intersecting the optical axis such that the sample relatively approaches the optical axis; value acquisition means for acquiring the intensity of the light defined as a value detected by the detection unit in a predetermined positional relationship in which a tip of the corner portion has reached the irradiation region; and relationship determination means for determining a positional relationship between the laser and the sample based on the intensity of the light detected by the detection unit while the sample relatively approaches the optical axis.

公开(公告)号：US20220347791A1

公开(公告)日：2022-11-03

申请号：US17761243

申请日：2021-02-26

Applicant: Nagoya Institute of Technology

Inventor： Fumihiro Itoigawa ,  Osamu Konda ,  Sho Fujiwara ,  Shotaro Yasuda

IPC: B23K26/03 ,  B23K26/38 ,  B23K26/06 ,  B23K26/402

Abstract: Provided is a laser processing apparatus configured to machine a corner portion of a machining target object by causing the corner portion to be relatively displaced toward a laser, the laser having an optical axis extending in a predetermined direction, the corner portion being formed by a plurality of adjacent surfaces of the machining target object and including a coating layer comprising a light-transmissive material, the laser processing apparatus including: displacement control means for controlling an actuator such that the machining target object becomes relatively close to or away from the optical axis; a detection unit provided at a position at least outside an irradiation region of the laser, the irradiation region extending in a tubular shape in a plan view intersecting the optical axis, the detection unit being configured to detect intensity of light reaching the position; and detection means for detecting a distance of relative displacement of the machining target object between points of detection of a first intensity and a third intensity as a thickness of the coating layer in a case where the predetermined first intensity, a second intensity smaller than the first intensity, and the third intensity larger than the first intensity are detected in order by the detection unit while the machining target object becomes relatively close to or away from the optical axis.