公开(公告)号：US20240130086A1

公开(公告)日：2024-04-18

申请号：US18393724

申请日：2023-12-22

Applicant: Nano and Advanced Materials Institute Limited

Inventor： Wai Chung LI ,  Chi Ho KWOK

IPC: H05K7/20 ,  C09K5/04

CPC classification number: H05K7/20381 ,  C09K5/048 ,  H05K7/20236 ,  H05K7/20263 ,  H05K7/20272 ,  H05K7/20281 ,  H05K7/20318 ,  H05K7/20327

Abstract: A multimode immersion cooling system includes a first, single-phase immersion cooling mode and a second, two-phase immersion cooling mode. The system operates in a single phase mode and reserves a two-phase mode for peak energy consumption periods. A single thermal transfer fluid is used for both modes, remaining in a liquid phase in a first single-phase immersion cooling mode and vaporizing when the thermal transfer fluid temperature reaches its boiling point in a second two-phase immersion cooling mode. A heat exchanger extracts thermal energy from heated thermal transfer fluid in the single phase mode while a condenser cools vaporized thermal transfer fluid to condense the vapor during the second, two-phase immersion cooling mode. A controller determines whether the multimode immersion cooling system operates in the single-phase mode or the second two-phase mode, or both.

公开(公告)号：US20220165681A1

公开(公告)日：2022-05-26

申请号：US17530483

申请日：2021-11-19

Applicant: Nano and Advanced Materials Institute Limited

Inventor： Chi Ho KWOK ,  Xiaohua CHEN ,  Wai Chung LI ,  Chenmin LIU

IPC: H01L23/552 ,  H01F1/34 ,  C01B32/21 ,  H01F1/00

Abstract: The present invention provides an EMI shielding device including a flame retarding, thermal interface material composite with a through plane thermal conductivity of no less than 30 W/mK and a dielectric withstanding voltage of no less than 1 kV/mm, where the composite includes at least one dielectric layer of self-aligned, carbon-based materials associated with superparamagnetic particles and at least one layer of fillers including a blend of dielectric heat transfer materials with a thermal or UV curable polymer or phase change polymer. The anisotropic heat transfer carbon-based materials associated with superparamagnetic materials are aligned under a low magnetic field strength of less than 1 Tesla to an orientation that results in a high thermal conductivity direction which can conduct the maximum heat from the adjacent device of the present composite. The present invention also provides a method for preparing the composite.