公开(公告)号：US07909087B2

公开(公告)日：2011-03-22

申请号：US11780218

申请日：2007-07-19

申请人： Naoki Kimura ,  Akira Hideno

发明人： Naoki Kimura ,  Akira Hideno

IPC分类号： F28F7/00

CPC分类号： F28F3/02 ,  F28F3/022 ,  F28F13/02 ,  H01L23/467 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat exchanger including a base plate portion with at least one heat generating component thermally connected thereto; at least one fin portion comprising a plurality of fins thermally connected to said base plate portion, arranged in parallel at a prescribed angle along a longitudinal direction of said base plate portion; an inlet portion through which a cooling fluid is introduced to each of said at least one fin portion; a baffle plate portion and a partition plate portion guiding said cooling fluid so that the cooling fluid is decelerated to be uniformly flown through fins in said at least one fin portion; and an outlet portion to evacuate the cooling fluid.

摘要翻译： 一种热交换器，包括具有与其热连接的至少一个发热部件的基板部分; 至少一个翅片部分，其包括热连接到所述基板部分的多个翅片，沿着所述基板部分的纵向方向以预定角度平行设置; 入口部分，冷却流体通过该入口部分引导到所述至少一个翅片部分中的每一个; 挡板部分和引导所述冷却流体的分隔板部分，使得冷却流体减速以均匀地流过所述至少一个翅片部分中的翅片; 以及排出冷却流体的出口部。

公开(公告)号：US20080023189A1

公开(公告)日：2008-01-31

申请号：US11780218

申请日：2007-07-19

申请人： Naoki Kimura ,  Akira Hideno

发明人： Naoki Kimura ,  Akira Hideno

IPC分类号： F28F13/00

CPC分类号： F28F3/02 ,  F28F3/022 ,  F28F13/02 ,  H01L23/467 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat exchanger including a base plate portion with at least one heat generating component thermally connected thereto; at least one fin portion comprising a plurality of fins thermally connected to said base plate portion, arranged in parallel at a prescribed angle along a longitudinal direction of said base plate portion; an inlet portion through which a cooling fluid is introduced to each of said at least one fin portion; a baffle plate portion and a partition plate portion guiding said cooling fluid so that the cooling fluid is decelerated to be uniformly flown through fins in said at least one fin portion; and an outlet portion to evacuate the cooling fluid.

摘要翻译： 一种热交换器，包括具有与其热连接的至少一个发热部件的基板部分; 至少一个翅片部分，其包括热连接到所述基板部分的多个翅片，沿着所述基板部分的纵向方向以预定角度平行设置; 入口部分，冷却流体通过该入口部分引导到所述至少一个翅片部分中的每一个; 挡板部分和引导所述冷却流体的分隔板部分，使得冷却流体减速以均匀地流过所述至少一个翅片部分中的翅片; 以及排出冷却流体的出口部。

公开(公告)号：US5993576A

公开(公告)日：1999-11-30

申请号：US790949

申请日：1997-01-29

申请人： Akira Ichinose ,  Akira Hideno ,  Nobuaki Ohara

发明人： Akira Ichinose ,  Akira Hideno ,  Nobuaki Ohara

IPC分类号： C22C21/04 ,  C22F1/043 ,  F01C1/02 ,  C22C21/02

CPC分类号： F01C1/0246 ,  C22C21/04 ,  C22F1/043 ,  F05C2201/903

摘要： A wear-resistant wrought Al alloy having a desirable high fatigue strength, toughness and flexure strength when subjected to a quenching and an age hardening heat treatment. The Al alloy contains 8.0 to 13.0% by weight of Si, 0.1 to 0.5% by weight of Fe, 1.5 to 5.0% by weight of Cu, 0.4 to 1.5% by weight of Mg, 0.05 to 0.5% by weight of Cr, 0.05 to 0.5% by weight of Ni, an element selected from the group consisting of 0.005 to 0.05% by weight of Sr and 0.05 to 0.3% by weight of Sb, and the remainder being Al and unavoidable impurities, wherein there is no more than 0.04% by weight of Mn as an unavoidable impurity. The Al alloy having Si particles being finely dispersed therein, wherein an average diameter of an equivalent circle of Si particles is not more than 5.00 .mu.m and an average roundness of Si particles is not less than 0.50. The amounts of Fe, Cr and Ni contained in the alloy and the amount of Mn as an impurity are such to prevent Si particles and other intermetallic compounds from enlarging. At the same time, with the above amounts of Sr or Sb, it is possible to reduce the size of the Si particles and to control the shape. Thus the occurrence or propagation of cracking, which is caused by Si particles can be delayed. The Al alloy exhibits the characteristics necessary for a scroll compressor.

摘要翻译： 耐磨锻造的Al合金在进行淬火和时效硬化热处理时具有理想的高疲劳强度，韧性和挠曲强度。 Al合金含有8.0〜13.0重量％的Si，0.1〜0.5重量％的Fe，1.5〜5.0重量％的Cu，0.4〜1.5重量％的Mg，0.05〜0.5重量％的Cr，0.05 至0.5重量％的Ni，选自由0.005至0.05重量％的Sr和0.05至0.3重量％的Sb的元素，其余为Al和不可避免的杂质，其中不超过0.04 重量％的Mn作为不可避免的杂质。 其中Si粒子细分散的Al合金，其中Si粒子的当量圆的平均直径不大于5.00μm，Si粒子的平均圆度不小于0.50。 合金中所含的Fe，Cr和Ni的量以及作为杂质的Mn的量是为了防止Si粒子等金属间化合物的扩大。 同时，通过上述量的Sr或Sb，可以减小Si粒子的尺寸并控制其形状。 因此，可以延迟由Si颗粒引起的裂纹的发生或扩展。 Al合金具有涡旋压缩机所需的特性。

公开(公告)号：US5846348A

公开(公告)日：1998-12-08

申请号：US703432

申请日：1996-08-26

申请人： Shoichi Sakoda ,  Akira Hideno ,  Nobuaki Ohara

发明人： Shoichi Sakoda ,  Akira Hideno ,  Nobuaki Ohara

IPC分类号： B22D17/00 ,  B22D17/32 ,  B22D21/00 ,  C22C1/02 ,  C22C21/02 ,  C22C21/06 ,  C22C21/08 ,  C22C21/10

CPC分类号： C22C21/06 ,  B22D17/00 ,  B22D21/007 ,  C22C21/02 ,  C22C21/08 ,  C22C21/10

摘要： An aluminum alloy cast molding produced by a high-pressure casting method, and having a composition containing Si in an amount of 0.6 to 1.0% by weight (which will be hereinafter simply referred to as %), Cu in an amount of 0.6 to 1.2%, Mg in an amount of 0.8 to 1.2%, Zn in an amount of 0.4 to 1.2%, Ti in an amount of 0.01 to 0.20%, and B in an amount of 0.002 to 0.015%, with the remainder being aluminum and inevitable impurities. The maximum dendrite cell size of the metal structure of the aluminum alloy casting is limited to 60 .mu.m or less. The present invention also provides a method of manufacturing an aluminum alloy casting by high-pressure casting, which manufacturing method includes the steps of charging a mold with a molten aluminum alloy having the above alloy composition, and subsequently solidifying the charged molten metal under pressures as high as 500 Kgf/cm.sup.2 or above so that the maximum dendrite cell size of the metal structure of the aluminum alloy casting is limited to 60 .mu.m or less.

摘要翻译： 通过高压铸造法制造的铝合金铸造成型体，其含有0.6〜1.0重量％的Si（以下简称为％）的组成，Cu为0.6〜1.2 ％，Mg为0.8〜1.2％，Zn为0.4〜1.2％，Ti为0.01〜0.20％，B为0.002〜0.015％，余量为铝，不可避免 杂质。 铝合金铸件的金属结构的最大枝晶电池尺寸限制在60μm以下。 本发明还提供一种通过高压铸造制造铝合金铸件的方法，该制造方法包括以下步骤：将具有上述合金组成的熔融铝合金装入模具中，随后在带电熔融金属的压力下固化 高达500Kgf / cm 2以上，使得铝合金铸件的金属结构的最大枝晶电池尺寸限制在60μm以下。

公开(公告)号：US5981085A

公开(公告)日：1999-11-09

申请号：US814111

申请日：1997-03-10

申请人： Junji Ninomiya ,  Akira Hideno ,  Takahiro Okada

发明人： Junji Ninomiya ,  Akira Hideno ,  Takahiro Okada

IPC分类号： H01L21/48 ,  H01L23/373 ,  H05K1/05 ,  H05K3/00 ,  B32B15/20 ,  H01L23/14

CPC分类号： H01L23/3733 ,  H01L21/4871 ,  H01L23/3736 ,  H01L2924/0002 ,  H05K1/05 ,  H05K3/0058 ,  Y10T428/12486 ,  Y10T428/12528

摘要： A composite substrate on which a heat-generating semiconductor device is to be mounted, comprising a composite layer which includes a matrix made of a metal having a high thermal conductivity and a fibrous or particulate dispersion material having low thermal expansion properties present in the matrix, and a metal layer provided onto one main surface of the composite layer, wherein either one of a heat-generating semiconductor device or a substrate with low thermal expansion properties having a heat-generating semiconductor device provided thereon, is mounted on the other main surface of the composite layer.

摘要翻译： 其上安装有发热半导体装置的复合基板包括复合层，该复合层包括由具有高导热性的金属制成的基体和在基质中存在的具有低热膨胀性质的纤维或颗粒分散材料， 以及设置在复合层的一个主表面上的金属层，其中在其上设置有发热半导体器件的发热半导体器件或具有低热膨胀特性的基板中的任一个安装在另一个主表面上 复合层。