公开(公告)号：US06249435B1

公开(公告)日：2001-06-19

申请号：US09374786

申请日：1999-08-16

申请人： Nathaniel B. Vicente ,  Javier I. Larranaga ,  Edward E. Kim ,  Joseph Criniti ,  Charles Pitzen ,  Esteban Santos

发明人： Nathaniel B. Vicente ,  Javier I. Larranaga ,  Edward E. Kim ,  Joseph Criniti ,  Charles Pitzen ,  Esteban Santos

IPC分类号： H05K720

CPC分类号： H05K7/20909

摘要： An arrangement for connection between motor controller electronic components and silicon controlled rectifiers (SCR) contained within the controller circuit is presented with line and load straps being arranged on the bottom surface of the motor controller compartment at opposite ends thereof. The SCR's are positioned under the compartment on an elongated heat-sink support plate. Intermediate block connectors interconnect the SCR's with the controller line and load straps.

摘要翻译： 在电机控制器电子部件和控制器电路中包含的可控硅整流器（SCR）之间的连接的布置呈现线和负载带布置在电动机控制器室的相对端的底表面上。 SCR位于延长的散热器支撑板上的隔室下方。 中间块连接器将SCR与控制器线路和负载带相互连接。

公开(公告)号：US6108206A

公开(公告)日：2000-08-22

申请号：US337095

申请日：1999-06-21

申请人： Joseph Criniti ,  Javier I. Larranaga ,  Edward E. Kim ,  Esteban Santos ,  Nathaniel B. Vicente

发明人： Joseph Criniti ,  Javier I. Larranaga ,  Edward E. Kim ,  Esteban Santos ,  Nathaniel B. Vicente

IPC分类号： H01L23/467 ,  H05K7/14 ,  H05K7/20

CPC分类号： H05K7/20909 ,  H01L23/467 ,  H01L2924/0002

摘要： A cooling assembly for semiconductor devices in the form of an enclosure including an inlet and outlet with a semiconductor support assembly is presented. The air passage connection with the inlet defines vortex configuration for the rapid transport of compressed air to the semiconductor devices arranged between the enclosure inlet and outlet.

摘要翻译： 本发明提供一种具有包括具有半导体支撑组件的入口和出口的外壳形式的半导体器件的冷却组件。 与入口的空气通道连接限定了涡流结构，用于将压缩空气快速输送到布置在外壳入口和出口之间的半导体器件。