公开(公告)号：US20160122897A1

公开(公告)日：2016-05-05

申请号：US14894380

申请日：2014-05-26

申请人： COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

发明人： Gautier FORTIN ,  Vanessa AMARAL DE OLIVEIRA ,  Denis CAMEL ,  Etienne PIHAN

IPC分类号： C30B11/14 ,  B28D5/04 ,  C30B29/06

CPC分类号： C30B11/14 ,  B28D5/04 ,  B28D5/045 ,  C30B11/002 ,  C30B15/00 ,  C30B29/06

摘要： A method for producing a silicon ingot, provided with symmetrical grain boundaries, including at least steps made of: (i) providing crucible with longitudinal axis, bottom of which includes a paving formed from monocrystalline cuboid silicon seeds with a square or rectangular base and arranged contiguously, the paving, when viewed according to axis, being in shape of a grid of orthogonal directions (x) and (y) parallel to edges of seeds; and (ii) proceeding with controlled solidification of silicon by growth on seeds in a growth direction collinear to axis; wherein paving in step (i) is produced from identical silicon seeds, with two seeds contiguous in direction (x) being images of each other by turning axis (y) and two seeds contiguous in direction (y) being images of each other by turning axis (x), and misorientation 2θ between crystalline arrays of two contiguous seeds being greater than 4°.

摘要翻译： 一种生产具有对称晶界的硅锭的方法，至少包括以下步骤：（i）提供具有纵向轴线的坩埚，其底部包括由具有正方形或矩形基底的单晶长方体硅晶种形成的铺路物，并布置 连续地，当根据轴线观察时，铺路的形状是与种子边缘平行的正交方向（x）和（y）的网格的形状; 和（ii）通过在与轴线共线的生长方向上的种子生长进行硅的受控凝固; 其中步骤（i）中的铺路由相同的硅种子制成，两个在方向（x）上相邻的种子是通过转动轴线（y）彼此成像的图像，并且通过转动 轴（x）和方位误差2＆amp; 两个连续种子的晶体阵列之间大于4°。

公开(公告)号：US20160108548A1

公开(公告)日：2016-04-21

申请号：US14894385

申请日：2014-05-26

申请人： COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

发明人： Etienne PIHAN ,  Vanessa AMARAL DE OLIVEIRA ,  Denis CAMEL ,  Denis CHAVRIER ,  Gautier FORTIN ,  Anis JOUINI ,  Benoit MARIE ,  Nelly PLASSAT

IPC分类号： C30B11/14 ,  B28D5/00 ,  C30B29/06 ,  C30B11/02 ,  C30B11/00

CPC分类号： C30B11/14 ,  B28D5/00 ,  B28D5/04 ,  B28D5/045 ,  C30B11/002 ,  C30B11/02 ,  C30B15/00 ,  C30B29/06

摘要： A method for manufacturing a silicon cylinder by growth on seeds in a directed solidification furnace, including at least the following steps: (i) providing a crucible having a longitudinal axis (Z), in which the bottom is covered with a layer of seeds of monocrystalline silicon in a right prism shape; and (ii) proceeding with directed solidification of silicon by growth on seeds, in a direction of growth that is co-linear with the axis (Z) and with a concave solidification front, spatially or temporally; characterised in that the layer in step (i) of: one or more central seeds Gc; and one or more peripheral seeds Gp contiguous to the seed(s) Gc, the peripheral seeds Gp having a specific size.

摘要翻译： 一种通过在定向凝固炉中在种子上生长来制造硅胶圆筒的方法，其包括至少以下步骤：（i）提供具有纵轴（Z）的坩埚，其中底部被一层种子覆盖 单晶硅呈正棱镜状; 和（ii）通过在种子上生长的方向，在与轴线（Z）和凹形固化前沿在空间上或时间上同向的生长方向进行硅的有向凝固; 其特征在于步骤（i）中的层：一个或多个中心种子Gc; 以及与种子Gc相邻的一种或多种外周种子Gp，外周种子Gp具有特定尺寸。

公开(公告)号：US20150040884A1

公开(公告)日：2015-02-12

申请号：US14386071

申请日：2012-05-31

申请人： Yasuhiro Ueda

发明人： Yasuhiro Ueda

IPC分类号： B23D61/18 ,  B24B27/06 ,  B28D5/04

CPC分类号： B23D61/185 ,  B24B27/0633 ,  B24D3/06 ,  B24D18/0072 ,  B28D5/04

摘要： A fixed abrasive grain wire saw that can improve precision of a cut plane of a workpiece and grinding efficiency and can prolong product life, a method of manufacturing the fixed abrasive grain wire saw, and a method of machining a workpiece by the fixed abrasive grain wire-saw. To fasten abrasive grains to an outer circumferential surface of a metal core wire, a plurality of transfer rollers, in each of which many tiny holes filled with an adhesive are formed, are used to transfer the adhesive to the outer circumferential surface of the core wire to form, on the outer circumferential surface, a plurality of rows of punctiform adhesive layers that are linearly arrayed in the axial direction at regular intervals. The abrasive grains are tentatively fastened to the adhesive layers, after which the abrasive grains are permanently fastened with a metal plated layer formed by electrolytic deposition.

摘要翻译： 一种固定的磨粒线锯，可以提高工件的切割面的精度和研磨效率，并且可以延长产品的使用寿命，固定磨粒线锯的制造方法以及通过固定磨粒线加工工件的方法 -锯。 为了将磨料颗粒固定在金属芯线的外周面上，形成多个转印辊，其中形成有多个填充有粘合剂的小孔，所述多个转印辊用于将粘合剂转印到芯线的外圆周表面 在外周面上形成有规则间隔地沿轴向直线排列的多排点状粘接层。 将磨粒暂时固定在粘合剂层上，然后通过电沉积形成的金属镀层永久地固定磨粒。

公开(公告)号：US20140137395A1

公开(公告)日：2014-05-22

申请号：US13680873

申请日：2012-11-19

申请人： Dale A. Witte ,  Jihong John Chen ,  Travis L. Hambach ,  Linda K. Swiney

发明人： Dale A. Witte ,  Jihong John Chen ,  Travis L. Hambach ,  Linda K. Swiney

IPC分类号： B23D1/00

CPC分类号： B23D1/00 ,  B28D5/04 ,  C30B11/14 ,  C30B29/06 ,  C30B33/06 ,  C30B35/00 ,  Y10T29/49995 ,  Y10T29/52 ,  Y10T117/1016

摘要： A method of producing rectangular seed bricks for use in semiconductor or solar manufacturing is disclosed. The method includes connecting an alignment layer to a top surface of a template, drawing alignment lines on the alignment layer to demarcate a plurality of nodes, connecting cylindrical rods to the alignment layer such that a center of each rod is aligned with a corresponding node, and slicing through the rods and the alignment layer with a wire web to produce rectangular seed bricks.

摘要翻译： 公开了一种制造用于半导体或太阳能制造的矩形种子砖的方法。 该方法包括将对准层连接到模板的顶表面，在对准层上绘制对准线以划定多个节点，将圆柱形杆连接到对准层，使得每个杆的中心与相应的节点对齐， 并通过杆和对准层用线网切片以产生矩形种子砖。

公开(公告)号：US07749865B2

公开(公告)日：2010-07-06

申请号：US10586476

申请日：2005-01-20

申请人： Makoto Iida

发明人： Makoto Iida

IPC分类号： H01L21/00 ,  C30B21/04 ,  C30B15/26

CPC分类号： C30B29/06 ,  B28D5/022 ,  B28D5/04 ,  C30B33/00 ,  Y10T117/1004

摘要： A method for producing semiconductor wafers, from a semiconductor ingot, wherein an oxygen concentration distribution in the growth axis direction is measured in the ingot state (F2), a position at which the oxygen concentration is maximum or minimum in a range of a predetermined length is determined as a cut position according to the measurement results (F3), the ingot is cut in a perpendicular direction to the growth axis at the cut position into blocks each having the oxygen concentrations being maximum and minimum at both ends thereof (F4), each of the blocks is sliced, and thereby semiconductor wafers are produced. Thereby, there can be provided a technique by which when semiconductor wafers are produced from a semiconductor ingot, wafers having oxygen concentration being in a predetermined standard range can be certainly produced.

摘要翻译： 一种半导体晶片的制造方法，其特征在于，在锭状态（F2）中测定生长轴方向的氧浓度分布，氧浓度在规定长度的范围内为最大或最小的位置 根据测量结果（F3）确定为切割位置，将锭在切割位置沿与生长轴垂直的方向切割成其两端的氧浓度最大和最小的块（F4）， 将每个块切片，从而制造半导体晶片。 因此，可以提供一种通过半导体晶片制造半导体晶片的技术，可以可靠地制造氧浓度在规定标准范围内的晶片。

公开(公告)号：US20080105247A1

公开(公告)日：2008-05-08

申请号：US11935269

申请日：2007-11-05

申请人： Jurgen Dopping ,  Matthias Reinecke ,  Holger Brosche ,  Hans-Joachim Gretzschel ,  Steffen Pollack

发明人： Jurgen Dopping ,  Matthias Reinecke ,  Holger Brosche ,  Hans-Joachim Gretzschel ,  Steffen Pollack

IPC分类号： B28D1/06

CPC分类号： B28D5/0082 ,  B28D5/04 ,  H01L21/67313

摘要： The invention relates to a device for manufacturing semiconductor material wafers with a sawing device for the sawing of slices attached to a saw holder, a pre-cleaning device arranged in the process direction downstream of the sawing device for pre-cleaning the surfaces of the slices hanging on the saw holder, and a degluing device arranged downstream in the process direction for detaching the slices from the saw holder.

摘要翻译： 本发明涉及一种用于制造半导体材料晶片的装置，其具有锯切装置，用于锯切安装在锯保持器上的切片，预清洁装置沿锯切装置的下游方向布置，用于预清洁切片表面 悬挂在锯架上，以及脱模装置，其沿着处理方向布置在下游，以将切片从锯保持器上分离。

公开(公告)号：US20070243695A1

公开(公告)日：2007-10-18

申请号：US10586476

申请日：2005-01-20

申请人： Makoto Iida

发明人： Makoto Iida

IPC分类号： H01L21/02

CPC分类号： C30B29/06 ,  B28D5/022 ,  B28D5/04 ,  C30B33/00 ,  Y10T117/1004

摘要： A method for producing semiconductor wafers, from a semiconductor ingot, wherein an oxygen concentration distribution in the growth axis direction is measured in the ingot state (F2), a position at which the oxygen concentration is maximum or minimum in a range of a predetermined length is determined as a cut position according to the measurement results (F3), the ingot is cut in a perpendicular direction to the growth axis at the cut position into blocks each having the oxygen concentrations being maximum and minimum at both ends thereof (F4), each of the blocks is sliced, and thereby semiconductor wafers are produced. Thereby, there can be provided a technique by which when semiconductor wafers are produced from a semiconductor ingot, wafers having oxygen concentration being in a predetermined standard range can be certainly produced.

摘要翻译： 一种半导体晶片的制造方法，其特征在于，在锭状态（F 2）中测量生长轴方向的氧浓度分布，在规定的范围内氧浓度最大或最小的位置 根据测量结果（F 3）将长度确定为切割位置，将锭在切割位置沿垂直于生长轴的方向切割成两端的氧浓度最大和最小的块（F 4），对每个块进行切片，从而制造半导体晶片。 因此，可以提供一种通过半导体晶片制造半导体晶片的技术，可以可靠地制造氧浓度在规定标准范围内的晶片。

公开(公告)号：US06750118B2

公开(公告)日：2004-06-15

申请号：US10141299

申请日：2002-05-08

申请人： Daniel Kray ,  Gerhard Willeke

发明人： Daniel Kray ,  Gerhard Willeke

IPC分类号： H01L2144

CPC分类号： B28D5/0058 ,  B28D5/04 ,  C30B33/00

摘要： A process and an apparatus used to subdivide objects (4) into slices, in particular to manufacture wafers from semi-conducting monocrystalline blocks, wherein these blocks are subdivided into slices with the help of at least one cutting tool (3), and under the influence of an etchant. Prior to completely cutting and subdividing the object (4) (ingot) into individual slices (wafers), a separating foil (12) is introduced into each cut slit (9) to separate the slices. This efficiently prevents the resultant wafers from sticking together. The individual separation of the wafers is thus accomplished right when the cutting process takes place so that the necessary number of process steps to manufacture silicon wafers is reduced.

摘要翻译： 一种用于将物体（4）细分成切片的方法和装置，特别是从半导体单晶块制造晶片，其中借助于至少一个切削工具（3）将这些块细分成切片，并且在 蚀刻剂的影响。 在将物体（4）（锭）完全切割和细分成单个切片（晶片）之前，将分离箔片（12）引入每个切割狭缝（9）以分离切片。 这有效地防止所得到的晶片粘在一起。 因此，当进行切割处理时就可以完成晶片的单独分离，从而减少制造硅晶片所需的工艺步骤数量。

公开(公告)号：US06507984B2

公开(公告)日：2003-01-21

申请号：US09873141

申请日：2001-06-01

申请人： Glenn S. Colton ,  Francis R. Krug, Jr. ,  John R. Lankard, Jr. ,  Robert Weiss

发明人： Glenn S. Colton ,  Francis R. Krug, Jr. ,  John R. Lankard, Jr. ,  Robert Weiss

IPC分类号： B23Q522

CPC分类号： B23D1/16 ,  B28D5/04 ,  H05K1/0306 ,  H05K3/0052 ,  H05K2203/0228 ,  H05K2203/082 ,  Y10T29/5182 ,  Y10T29/5196 ,  Y10T409/501476 ,  Y10T409/50246 ,  Y10T409/506724

摘要： A detailing tool for processing electronic component substrate includes a supporting frame, a substrate carrier movable on the supporting frame to receive and secure the substrate during processing by the tool, and a pair of cutter assembly attached to said supporting frame for removing tails on said substrate. The cutter assemblies self-align “to” the substrate during initial substrate loading in a processing area of the tool. Each cutter assembly includes a pair of spaced, translatable and opposed cutters that simultaneously move towards each another while removing the tails from the corners of the substrate that remains stationary. The pair of cutter assemblies are symmetrically attached to the supporting frame with respect to an axis for indexing the substrate. Thus, the invention provides a tool for cutting tails from opposite corners on the substrate edge automatically and simultaneously during processing.

摘要翻译： 一种用于处理电子部件基板的细节工具包括支撑框架，可在支撑框架上移动以在工具处理期间接收和固定基板的基板载体以及附接到所述支撑框架上的一对切割器组件，用于去除所述基板上的尾部 。 刀具组件在工具的处理区域中的初始衬底加载期间自对准“到”衬底。 每个切割器组件包括一对间隔开的可平移和相对的切割器，其同时朝向彼此移动，同时从保持静止的基板的角部移除尾部。 该对切割器组件相对于用于分度基底的轴线对称地附接到支撑框架。 因此，本发明提供了一种用于在处理期间自动和同时地从底板边缘上的相对角度切割尾部的工具。

公开(公告)号：US20020182025A1

公开(公告)日：2002-12-05

申请号：US09873141

申请日：2001-06-01

申请人： International Business Machines Corporation

发明人： Glenn S. Colton ,  Francis R. Krug JR. ,  John R. Lankard JR. ,  Robert Weiss

IPC分类号： B23D001/16

CPC分类号： B23D1/16 ,  B28D5/04 ,  H05K1/0306 ,  H05K3/0052 ,  H05K2203/0228 ,  H05K2203/082 ,  Y10T29/5182 ,  Y10T29/5196 ,  Y10T409/501476 ,  Y10T409/50246 ,  Y10T409/506724

摘要： A detailing tool for processing electronic component substrate includes a supporting frame, a substrate carrier movable on the supporting frame to receive and secure the substrate during processing by the tool, and a pair of cutter assembly attached to said supporting frame for removing tails on said substrate. The cutter assemblies self-align nulltonull the substrate during initial substrate loading in a processing area of the tool. Each cutter assembly includes a pair of spaced, translatable and opposed cutters that simultaneously move towards each another while removing the tails from the corners of the substrate that remains stationary. The pair of cutter assemblies are symmetrically attached to the supporting frame with respect to an axis for indexing the substrate. Thus, the invention provides a tool for cutting tails from opposite corners on the substrate edge automatically and simultaneously during processing.

摘要翻译： 一种用于处理电子部件基板的细节工具包括支撑框架，可在支撑框架上移动以在工具处理期间接收和固定基板的基板载体以及附接到所述支撑框架上的一对切割器组件，用于去除所述基板上的尾部 。 刀具组件在工具的处理区域中的初始衬底加载期间自对准“到”衬底。 每个切割器组件包括一对间隔开的可平移和相对的切割器，其同时朝向彼此移动，同时从保持静止的基板的角部移除尾部。 该对切割器组件相对于用于分度基底的轴线对称地附接到支撑框架。 因此，本发明提供了一种用于在处理期间自动和同时地从底板边缘上的相对角度切割尾部的工具。