公开(公告)号：US20220135836A1

公开(公告)日：2022-05-05

申请号：US17452162

申请日：2021-10-25

Applicant: NEXFLEX CO.,LTD.

Inventor： Dae Nyoun KIM ,  Yun Jeong JO ,  Ra Mi LEE

IPC: C09D179/08 ,  C08G73/10 ,  H05K1/03 ,  H05K1/05

Abstract: The present disclosure relates to a polyimide film for a flexible metal clad laminate and a flexible metal clad laminate including the same, and an aspect of the present disclosure is to provide a polyimide film for a flexible metal clad laminate, which is derived from a polyimide precursor composition including an acid dianhydride and a diamine, in which the acid dianhydride includes 70% by mol or more of pyromellitic dianhydride (PMDA), and the diamine includes m-tolidine and dimer diamine.

公开(公告)号：US20240254286A1

公开(公告)日：2024-08-01

申请号：US18534022

申请日：2023-12-08

Applicant: NexFlex Co., Ltd.

Inventor： Hyuk Jun KIM ,  Dae Nyoun KIM ,  Yun Jeong JO ,  Ki Hoon KIM ,  Ra Mi LEE

IPC: C08G73/16 ,  B32B15/08 ,  B32B15/20 ,  B32B27/08 ,  C08G73/10

CPC classification number: C08G73/16 ,  B32B15/08 ,  B32B15/20 ,  B32B27/08 ,  C08G73/1067 ,  B32B2250/02 ,  B32B2250/03 ,  B32B2250/04 ,  B32B2250/05 ,  B32B2307/204 ,  B32B2311/12 ,  B32B2379/08 ,  B32B2457/08

Abstract: A polyesterimide resin composition, a polyesterimide resin layer, a flexible metal foil laminate, and methods of preparing the polyesterimide resin composition, the polyesterimide resin layer, and the flexible metal foil laminate are provided. The polyesterimide resin composition includes a compound having a structural unit represented by Chemical Formula 1:




In Chemical Formula 1, m and n are mole fractions, and “m+n=1” “0.2≤m≤0.8” and “0.2≤n≤0.8” are satisfied. Ar1 and Ar2 are the same as or different from each other and are each independently a tetravalent organic group having at least one aromatic ring. R1, R2, and R4 to R6 each independently include at least one of —H, —F, —CH3, —OCH3, —CF3, and —OCF3. R3 is an ester group and includes —COO— or —OOC—.