公开(公告)号：US20240254286A1

公开(公告)日：2024-08-01

申请号：US18534022

申请日：2023-12-08

Applicant: NexFlex Co., Ltd.

Inventor： Hyuk Jun KIM ,  Dae Nyoun KIM ,  Yun Jeong JO ,  Ki Hoon KIM ,  Ra Mi LEE

IPC: C08G73/16 ,  B32B15/08 ,  B32B15/20 ,  B32B27/08 ,  C08G73/10

CPC classification number: C08G73/16 ,  B32B15/08 ,  B32B15/20 ,  B32B27/08 ,  C08G73/1067 ,  B32B2250/02 ,  B32B2250/03 ,  B32B2250/04 ,  B32B2250/05 ,  B32B2307/204 ,  B32B2311/12 ,  B32B2379/08 ,  B32B2457/08

Abstract: A polyesterimide resin composition, a polyesterimide resin layer, a flexible metal foil laminate, and methods of preparing the polyesterimide resin composition, the polyesterimide resin layer, and the flexible metal foil laminate are provided. The polyesterimide resin composition includes a compound having a structural unit represented by Chemical Formula 1:




In Chemical Formula 1, m and n are mole fractions, and “m+n=1” “0.2≤m≤0.8” and “0.2≤n≤0.8” are satisfied. Ar1 and Ar2 are the same as or different from each other and are each independently a tetravalent organic group having at least one aromatic ring. R1, R2, and R4 to R6 each independently include at least one of —H, —F, —CH3, —OCH3, —CF3, and —OCF3. R3 is an ester group and includes —COO— or —OOC—.

公开(公告)号：US20220220337A1

公开(公告)日：2022-07-14

申请号：US17646070

申请日：2021-12-27

Applicant: NexFlex Co., Ltd.

Inventor： So Jeong KIM ,  Joo Young KIM ,  Hyuk Jun KIM

IPC: C09D179/08 ,  B29C41/00 ,  B29C41/42

Abstract: The present disclosure relates to a polyimide varnish composition for a flexible substrate and a polyimide film using the same, and a polyimide varnish composition for a flexible substrate according to the present disclosure may include an acid anhydride including 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA) and pyromellitic dianhydride (PMDA), and a diamine. The polyimide varnish composition according to the present disclosure has the advantage of being able to manufacture a polyimide film having heat resistance, high flexural properties, and high flexibility by increasing elongation while having a low coefficient of thermal expansion.

公开(公告)号：US20240262963A1

公开(公告)日：2024-08-08

申请号：US18411220

申请日：2024-01-12

Applicant: NexFlex Co., Ltd.

Inventor： So Jeong KIM ,  Joo Young KIM ,  Hyuk Jun KIM

IPC: C08G73/10 ,  C08J5/18

CPC classification number: C08G73/1053 ,  C08G73/1032 ,  C08J5/18 ,  C08J2379/08

Abstract: A polyimide composition, a method of preparing the polyimide composition, a polyimide film, and a flexible copper clad laminate are provided. The polyimide composition includes a dianhydride, and a diamine, and the diamine comprises an aromatic diamine, and an aliphatic diamine.

公开(公告)号：US20240218170A1

公开(公告)日：2024-07-04

申请号：US18531256

申请日：2023-12-06

Applicant: NexFlex Co., Ltd.

Inventor： Se Jin KWON ,  Doo Hyeon KIM ,  Yu Jeong LEE ,  Sung Su KIM ,  Hyuk Jun KIM

IPC: C08L33/24 ,  C09J7/28 ,  C09J7/29 ,  C09J11/04 ,  C09J11/08 ,  C09J133/24

CPC classification number: C08L33/24 ,  C09J7/28 ,  C09J7/29 ,  C09J11/04 ,  C09J11/08 ,  C09J133/24 ,  C09J2301/408 ,  C09J2400/16

Abstract: A polyimide resin composition, a polyimide-based adhesive composition, a polyimide adhesive film, and a flexible metal clad laminate film are provided. The polyimide resin composition may be derived from a polyimide precursor composition including an aliphatic acid anhydride and an amine including an aromatic diamine and a dimer diamine, and the aliphatic acid anhydride may include an aliphatic tetracarboxylic acid anhydride.

公开(公告)号：US20240191028A1

公开(公告)日：2024-06-13

申请号：US17757101

申请日：2022-04-13

Applicant: NEXFLEX CO., LTD.

Inventor： So Jeong KIM ,  Joo Young KIM ,  Hyuk Jun KIM

IPC: C08G73/10 ,  B32B15/08 ,  C08J5/18

CPC classification number: C08G73/1007 ,  C08J5/18 ,  B32B15/08 ,  C08J2433/00

Abstract: The present disclosure relates to a composition for manufacturing a polyimide film and a polyimide film for a flexible metal clad laminate manufactured using the same. According to an aspect of the present disclosure, there is provided a composition for manufacturing a polyimide film, the composition comprising: an aromatic dianhydride; a diamine; and a curing catalyst, wherein the curing catalyst includes one or more selected from the group consisting of an imidazole-based compound, a quinolone-based compound, and a quinoline-based compound.