公开(公告)号：US20240247986A1

公开(公告)日：2024-07-25

申请号：US18597341

申请日：2024-03-06

Applicant: NextInput, Inc.

Inventor： Julius Minglin Tsai ,  Ryan Diestelhorst ,  Dan Krstyen Benjamin

IPC: G01L1/18 ,  B81B3/00 ,  B81C1/00 ,  G01L1/26

CPC classification number: G01L1/18 ,  B81B3/0021 ,  B81C1/00595 ,  G01L1/26 ,  B81B2203/0127 ,  B81C2201/014

Abstract: An example microelectromechanical system (MEMS) force sensor is described herein. The MEMS force sensor can include a sensor die configured to receive an applied force. The sensor die can include a first substrate and a second substrate, where a cavity is formed in the first substrate and where at least a portion of the second substrate defines a deformable membrane. The MEMS force sensor can also include an etch stop layer arranged between the first substrate and the second substrate, and a sensing element arranged on a surface of the second substrate. The sensing element can be configured to convert a strain on the surface of the membrane substrate to an analog electrical signal that is proportional to the strain.