-
公开(公告)号：US20210285832A1
公开(公告)日：2021-09-16
申请号：US17215186
申请日：2021-03-29
Applicant: NextInput, Inc.
Inventor： Mehrnaz Rouhi Youssefi , Julius Minglin Tsai
Abstract: Described herein is a MEMS force sensor with stress concentration design. The stress concentration can be performed by providing slots, whether through or blind, and/or selective thinning of the substrate. The MEMS force sensor is in chip scale package with solder bumps or metal pillars and there are sensing elements formed on the sensor substrate at the stress concentrate area. The stress concentration can be realized through slots, selective thinning and a combination of both.
-
公开(公告)号：US11698310B2
公开(公告)日：2023-07-11
申请号：US17215186
申请日：2021-03-29
Applicant: NextInput, Inc.
Inventor： Mehrnaz Rouhi Youssefi , Julius Minglin Tsai
CPC classification number: G01L1/18 , B81B3/0072 , B81B2201/0264 , B81B2203/04
Abstract: Described herein is a MEMS force sensor with stress concentration design. The stress concentration can be performed by providing slots, whether through or blind, and/or selective thinning of the substrate. The MEMS force sensor is in chip scale package with solder bumps or metal pillars and there are sensing elements formed on the sensor substrate at the stress concentrate area. The stress concentration can be realized through slots, selective thinning and a combination of both.
-
Search Results
2
records
(took 0.009 seconds)
