摘要:
The disclosure provides a gasification process for the production of a methane-rich syngas at temperatures exceeding 700° C. through the use of an alkali hydroxide MOH, using a gasification mixture comprised of at least 0.25 moles and less than 2 moles of water for each mole of carbon, and at least 0.15 moles and less than 2 moles of alkali hydroxide MOH for each mole of carbon. These relative amounts allow the production of a methane-rich syngas at temperatures exceeding 700° C. by enabling a series of reactions which generate H2 and CH4, and mitigate the reforming of methane. The process provides a methane-rich syngas comprised of roughly 20% (dry molar percentage) CH4 at temperatures above 700° C., and may effectively operate within an IGFC cycle at reactor temperatures between 700-900° C. and pressures in excess of 10 atmospheres.
摘要:
The disclosure provides a SOFC comprised of an electrolyte, anode, and cathode, where the cathode comprises an MIEC and an oxygen-reducing layer. The oxygen-reducing layer is in contact with the MIEC, and the MIEC is generally between and separating the oxygen-reducing layer and the electrolyte. The oxygen-reducing layer is comprised of single element oxides, single element carbonates, or mixtures thereof, and has a thickness of less than about 30 nm. In a particular embodiment, the thickness is less than 5 nm. In another embodiment, the thickness is about 3 monolayers or less. The oxygen-reducing layer may be a continuous film or a discontinuous film with various coverage ratios. The oxygen-reducing layer at the thicknesses described may be generated on the MIEC surface using means known in the art such as, for example, ALD processes.
摘要:
A method for forming electrical connections between parts of a fuel cell that includes subjecting a contact paste positioned between the parts to alternating flows of gasses having varying high and low partial pressures of oxygen. This method demonstrates the ability to form conductive interconnections that have sufficient mechanical stability because these pastes can be cured at a temperature less than the temperatures of the surrounding materials thus allowing desired portions to be cured while allowing other portions such as the glass or ceramic portions to maintain their desired mechanical and electrical properties.