公开(公告)号：US5005939A

公开(公告)日：1991-04-09

申请号：US499238

申请日：1990-03-26

申请人： Nicolaos C. Arvanitakis ,  Vincent J. BLack ,  Richard E. Corley, Jr. ,  Richard G. Nolan ,  Leonard T. Olson, Jr.

发明人： Nicolaos C. Arvanitakis ,  Vincent J. BLack ,  Richard E. Corley, Jr. ,  Richard G. Nolan ,  Leonard T. Olson, Jr.

IPC分类号： G02B6/42 ,  H01L31/02 ,  H01L31/0232 ,  H01L31/12 ,  H01L33/00 ,  H01S5/00

CPC分类号： G02B6/4277 ,  G02B6/4204 ,  G02B6/4246 ,  G02B6/4292

摘要： An optoelectronic assembly for providing bidirectional data transmission between fiber optic means (e.g., a pair of optical fibers) and an electrical circuit member (e.g., a printed circuit board). The assembly includes a two-part housing with first and second receptacle sections designed for accommodating a pair of optoelectronic devices. One of these devices serves as a receiver and the other a transmitter. These devices are aligned within the housing and electrically connected to a substrate member (e.g., ceramic) also positioned within the housing. The substrate provides the necessary electrical functioning and is in turn electrically connected (e.g., via conductor pins) to the described circuit member, this connection occurring through an opening within the bottom portion of the two-part housing. The assembly is designed for coupling with individual optical fiber members or, alternatively with a common duplex connector having optical fibers therein.

公开(公告)号：US07354794B2

公开(公告)日：2008-04-08

申请号：US11062019

申请日：2005-02-18

申请人： Frank E. Anderson ,  Richard E. Corley, Jr. ,  Paul T. Spivey ,  Carl E. Sullivan

发明人： Frank E. Anderson ,  Richard E. Corley, Jr. ,  Paul T. Spivey ,  Carl E. Sullivan

IPC分类号： H01L21/00

CPC分类号： B41J2/14072 ,  H01L2224/48091 ,  H01L2224/73265 ,  Y10T29/49401 ,  H01L2924/00014

摘要： Methods of connecting a circuit device to a semiconductor substrate and micro-fluid ejection devices made by the methods. One method includes printing an elongate strip of an electrically conductive fluid to electrically interconnect a first contact pad on a semiconductor substrate containing fluid ejection actuator devices with a second contact pad on an electrical trace circuit, wherein the electrical trace circuit is disposed adjacent to and spaced-apart from the semiconductor substrate. The electrically conductive fluid contains a liquid component and a conductive particle component. The liquid component is removed from the conductive particle component to provide a solid elongate strip of conductive material interconnecting the first contact pad and the second contact pad.

摘要翻译： 将电路装置与半导体基板连接的方法和由该方法制成的微流体喷射装置。 一种方法包括印刷导电流体的细长条以将包含流体喷射致动器装置的半导体衬底上的第一接触焊盘与电迹线电路上的第二接触焊盘电互连，其中电迹线电路邻近并间隔开 从半导体衬底放置。 导电流体包含液体组分和导电颗粒组分。 将液体组分从导电颗粒组分移除以提供将第一接触垫和第二接触垫相互连接的导电材料的实心细长带。