公开(公告)号：US20230184469A1

公开(公告)日：2023-06-15

申请号：US17790105

申请日：2021-08-24

申请人： Nihon Itomic Co., Ltd.

发明人： Masami OGATA

IPC分类号： F25B30/02 ,  F25B41/20 ,  F25B41/31 ,  F25B41/37

CPC分类号： F25B30/02 ,  F25B41/20 ,  F25B41/31 ,  F25B41/37 ,  F25B2600/2515 ,  F25B2700/21151 ,  F25B2700/2117

摘要： Provided is a heat pump device capable of efficiently adjusting the temperature in a buffer tank for collecting or discharging a refrigerant in a high-pressure space of a refrigerant circulation circuit.
Disclosed is a heat pump device in which a compressor, a gas cooler, a refrigerant heat exchanger, a refrigerant expansion valve, and an evaporator are connected to configure a refrigerant circulation circuit, wherein the heat pump device includes a buffer tank, one end of which is connected to the high-pressure side of the refrigerant expansion valve and arranged to store a refrigerant, and a first refrigerant pipe, one end of which is connected to the high-pressure side of the compressor and the other end of which is connected to the low-pressure side of the evaporator and arranged to exchange heat with the buffer tank, wherein the first refrigerant pipe includes a first control valve arranged between the high-pressure side of the compressor and the buffer tank to control the opening and closing of the first refrigerant pipe, and a first flow rate regulator arranged between the buffer tank and the low-pressure side of the evaporator to control the flow rate of the refrigerant.