Heat pump device
    2.
    发明授权

    公开(公告)号:US11965680B2

    公开(公告)日:2024-04-23

    申请号:US17790105

    申请日:2021-08-24

    发明人: Masami Ogata

    摘要: In a heat pump device in which a compressor, a gas cooler, a refrigerant heat exchanger, a refrigerant expansion valve, and an evaporator are connected to configure a refrigerant circulation circuit, the heat pump device includes a buffer tank, one end being connected to the high-pressure side of the refrigerant expansion valve and arranged to store a refrigerant, and a first refrigerant pipe, one end being connected to the high-pressure side of the compressor and the other end connected to the low-pressure side of the evaporator and arranged to exchange heat with the buffer tank. The first refrigerant pipe includes a first control valve arranged between the high-pressure side of the compressor and the buffer tank to control opening and closing of the first refrigerant pipe, and a first flow rate regulator arranged between the buffer tank and the low-pressure side of the evaporator to control the refrigerant flow rate.

    AIR CONDITIONING DEVICE
    3.
    发明公开

    公开(公告)号:US20230160614A1

    公开(公告)日:2023-05-25

    申请号:US17886654

    申请日:2022-08-12

    IPC分类号: F25B41/40 F25B41/37 F25B39/00

    摘要: An air conditioning device including a condenser configured to condense a refrigerant gas into a liquid refrigerant, an evaporator configured to phase-change the liquid refrigerant introduced from the condenser into a vapor refrigerant, a refrigerant inlet pipe connected to the evaporator and into which a refrigerant is introduced from the condenser, a capillary tube fully inserted into the refrigerant inlet pipe, and a clamping portion depressed a part of the refrigerant inlet pipe and a part of the capillary tube corresponding to the depressed part of the refrigerant inlet pipe to fix the capillary tube inside the refrigerant inlet pipe.

    HEAT PUMP DEVICE
    8.
    发明公开
    HEAT PUMP DEVICE 审中-公开

    公开(公告)号:US20230184469A1

    公开(公告)日:2023-06-15

    申请号:US17790105

    申请日:2021-08-24

    发明人: Masami OGATA

    摘要: Provided is a heat pump device capable of efficiently adjusting the temperature in a buffer tank for collecting or discharging a refrigerant in a high-pressure space of a refrigerant circulation circuit.
    Disclosed is a heat pump device in which a compressor, a gas cooler, a refrigerant heat exchanger, a refrigerant expansion valve, and an evaporator are connected to configure a refrigerant circulation circuit, wherein the heat pump device includes a buffer tank, one end of which is connected to the high-pressure side of the refrigerant expansion valve and arranged to store a refrigerant, and a first refrigerant pipe, one end of which is connected to the high-pressure side of the compressor and the other end of which is connected to the low-pressure side of the evaporator and arranged to exchange heat with the buffer tank, wherein the first refrigerant pipe includes a first control valve arranged between the high-pressure side of the compressor and the buffer tank to control the opening and closing of the first refrigerant pipe, and a first flow rate regulator arranged between the buffer tank and the low-pressure side of the evaporator to control the flow rate of the refrigerant.