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公开(公告)号：US20210250477A1
公开(公告)日：2021-08-12
申请号：US17195785
申请日：2021-03-09
发明人： Zhen HUANG , Qimin MEI , Bojie ZHAO , Zhewen MEI , Li LIU , Jiawei CHEN , Zongchun YANG , Chenxiang XU
IPC分类号： H04N5/225
摘要： A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.
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公开(公告)号：US20220179288A1
公开(公告)日：2022-06-09
申请号：US17603183
申请日：2020-03-02
发明人： Zhen HUANG , Zhongyu LUAN , Zongchun YANG , Fengsheng XI , Chenxiang XU
摘要： Provided are a camera module, a molded photosensitive assembly and a manufacturing method thereof, and an electronic device. The molded photosensitive assembly is assembled with at least one optical lenses to form a camera module. The molded photosensitive assembly includes an imaging assembly, a molded base, and a filter member. The molded base includes a first molded portion and a second molded portion. The first molded portion embeds a part of the imaging assembly. The second molded portion is integrally formed on a first upper surface of the first molded portion, and the second molded portion has a second upper surface and a second outer side surface. A filter member is attached to the second upper surface of the second molded portion, and corresponds to a photosensitive path of the imaging assembly. The second upper surface of the second molded portion is higher than the first upper surface of the first molded portion, so as to define and form an outer space by a second outer side surface of the second molded portion and the first upper surface of the first molded portion.
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3.发明公开公开(公告)号：US20230328350A1
公开(公告)日：2023-10-12
申请号：US18203731
申请日：2023-05-31
发明人： Zhen HUANG , Qimin MEI , Bojie ZHAO , Zhewen MEI , Li LIU , Jiawei CHEN , Chenxiang XU
CPC分类号： H04N23/55 , B29C43/18 , H04N23/54 , H04N23/57 , B29L2011/00
摘要： A camera module and a molded photosensitive assembly and manufacturing methods thereof, and an electronic device are disclosed. The molded photosensitive assembly includes an imaging assembly, a molded base and a filter assembly. The imaging assembly includes a circuit board and at least one photosensitive element, and each photosensitive element is conductively connected to the circuit board. The molded base has at least one stepped peripheral groove to define a light window through each stepped peripheral groove, the molded base embeds a part of the imaging assembly, and a photosensitive region of each photosensitive element respectively corresponds to each light window of the molded base. The filter assembly includes at least one filter element, and each filter element is correspondingly arranged in each stepped peripheral groove of the molded base, so that each filter element respectively corresponds to each light window of the molded base.
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公开(公告)号：US20210185804A1
公开(公告)日：2021-06-17
申请号：US17182353
申请日：2021-02-23
发明人： Zhen HUANG , Junjie ZENG , Chenxiang XU , Feifan CHEN
IPC分类号： H05K1/02 , G03B30/00 , G01S17/894 , H04N5/225
摘要： The present disclosure provides a circuit board assembly, a TOF camera module including the circuit board assembly and applications thereof. The circuit board assembly is used to support an electronic component, and includes a conductive portion and an insulating portion. The insulating portion is integrally bonded to the conductive portion, and the conductive portion extends through the insulating portion. The electronic component is supported by the conductive portion and is communicated with the conductive portion, so that the electronic component directly dissipates heat through the conductive portion during operation.
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公开(公告)号：US20220360694A1
公开(公告)日：2022-11-10
申请号：US17750743
申请日：2022-05-23
发明人： Zhen HUANG , Qimin MEI , Bojie ZHAO , Zhewen MEI , Li LIU , Jiawei CHEN , Zongchun YANG , Chenxiang XU
摘要： A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.
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公开(公告)号：US20210195074A1
公开(公告)日：2021-06-24
申请号：US17195816
申请日：2021-03-09
发明人： Zhen HUANG , Qimin MEI , Bojie ZHAO , Zhewen MEI , Li LIU , Jiawei CHEN , Zongchun YANG , Chenxiang XU
IPC分类号： H04N5/225
摘要： A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.
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公开(公告)号：US20230060371A1
公开(公告)日：2023-03-02
申请号：US17983592
申请日：2022-11-09
发明人： Zhen HUANG , Qimin MEI , Bojie ZHAO , Zhewen MEI , Li LIU , Jiawei CHEN , Chenxiang XU
摘要： A camera module and a molded photosensitive assembly and manufacturing methods thereof, and an electronic device are disclosed. The molded photosensitive assembly includes an imaging assembly, a molded base and a filter assembly. The imaging assembly includes a circuit board and at least one photosensitive element, and each photosensitive element is conductively connected to the circuit board. The molded base has at least one stepped peripheral groove to define a light window through each stepped peripheral groove, the molded base embeds a part of the imaging assembly, and a photosensitive region of each photosensitive element respectively corresponds to each light window of the molded base. The filter assembly includes at least one filter element, and each filter element is correspondingly arranged in each stepped peripheral groove of the molded base, so that each filter element respectively corresponds to each light window of the molded base.
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公开(公告)号：US20220201169A1
公开(公告)日：2022-06-23
申请号：US17600735
申请日：2020-03-02
发明人： Zhen HUANG , Zhongyu LUAN , Zongchun YANG , Lifeng KAN , Chenxiang XU
摘要： Disclosed are a camera module, a blocking-type photosensitive assembly, a manufacturing method thereof, and an electronic device. The camera module includes a blocking-type photosensitive assembly and at least one motor camera lens assembly arranged on the blocking-type photosensitive assembly. The blocking-type photosensitive assembly includes a molded photosensitive assembly and a blocking structure arranged on the molded photosensitive assembly. A blocking surface of the blocking structure is higher than an upper surface of a filter element, and at least a part of the projection of the blocking surface of the blocking structure on the molded photosensitive assembly overlaps with the projection of an optical lens of the motor camera lens assembly on the molded photosensitive assembly to block the optical lens from directly contacting the filter element.
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公开(公告)号：US20210321025A1
公开(公告)日：2021-10-14
申请号：US17266776
申请日：2019-07-10
发明人： Zhen HUANG , Qimin MEI , Bojie ZHAO , Zhewen MEI , Li LIU , Jiawei CHEN , Chenxiang XU
摘要： A camera module and a molded photosensitive assembly and manufacturing methods thereof, and an electronic device are disclosed. The molded photosensitive assembly includes an imaging assembly, a molded base and a filter assembly. The imaging assembly includes a circuit board and at least one photosensitive element, and each photosensitive element is conductively connected to the circuit board. The molded base has at least one stepped peripheral groove to define a light window through each stepped peripheral groove, the molded base embeds a part of the imaging assembly, and a photosensitive region of each photosensitive element respectively corresponds to each light window of the molded base. The filter assembly includes at least one filter element, and each filter element is correspondingly arranged in each stepped peripheral groove of the molded base, so that each filter element respectively corresponds to each light window of the molded base.
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