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公开(公告)号:US20240353627A1
公开(公告)日:2024-10-24
申请号:US18760550
申请日:2024-07-01
发明人: Yuriko Kawamura , Takashi Yamada , Yusuke Nasu
CPC分类号: G02B6/3628 , G02B6/262 , G02B6/424
摘要: An optical module according to the present invention includes: an optical device including an optical waveguide chip; an optical fiber block bonded to and arranged on an end face of the optical waveguide chip; an optical fiber that has one end optically connected to the optical waveguide chip via the optical fiber block; an optical fiber holding mechanism for holding the other end of the optical fiber; and an optical fiber carrier. The optical fiber is arranged while being curved from the optical fiber carrier toward the optical fiber block in a U-shape, and a wall structure is formed on the surface of the carrier while being adjacent to the optical fiber at, for example, a position on the outer side of the U-shaped curve of the optical fiber position at which the wall structure reduces a normal force of the optical fiber.
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公开(公告)号:US11424959B2
公开(公告)日:2022-08-23
申请号:US16483680
申请日:2018-02-07
发明人: Keita Nishimoto , Takashi Yamada , Akiyuki Takeda , Toshikiyo Tanaka , Masashi Tadokoro , Takeaki Mochida , Manabu Yoshino
IPC分类号: H04L12/46 , H04L47/283 , H04L49/00
摘要: A communication apparatus includes a packet reception unit; a packet transmission unit; and a processing sequence control unit that controls a processing sequence, and the processing sequence control unit includes a packet holding unit; function instances for respective function files including groups of procedures and groups of variables; an instance information management unit that holds instance information including function instance identifiers identifying the function instances, procedure identifiers identifying the procedures belonging to the function instances, and memory addresses of the procedures; an execution sequence information management unit that holds execution sequence information that associates the function instance identifiers, the procedure identifiers, return values of the procedures, and procedures belonging to function instances that are to be executed next; and a function execution unit that, on the basis of the execution sequence information and the instance information, calls a procedure, executes a process on the communication packet, and executes the next process depending on a return value.
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公开(公告)号:US20220214508A1
公开(公告)日:2022-07-07
申请号:US17602198
申请日:2020-04-16
发明人: Shunichi Soma , Yusuke Nasu , Ken Tsuzuki , Takashi Yamada , Kiyofumi Kikuchi
摘要: In a pipe structure in which an optical fiber passes, miniaturization of the optical module in the longitudinal direction of the optical fiber is prevented. In the optical module according to the present invention, a holding structure of the optical fiber necessary to adopt the pipe structure is moved to a cover extension unit of the package. The optical fiber is adhered and fixed to the cover extension unit protruding from the cover body unit of the package to ensure protection of the optical fiber, and the optical waveguide chip is disposed to be closer to an inner wall of a side surface of the package. By disposing the optical waveguide chip to be close to the inner wall of the package as much as possible and reducing the mounting area in the package to the utmost, it is possible to realize miniaturization of the entire optical module.
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公开(公告)号:US11367997B2
公开(公告)日:2022-06-21
申请号:US16978339
申请日:2019-02-28
发明人: Takahiko Shindo , Naoki Fujiwara , Kimikazu Sano , Hiroyuki Ishii , Hideaki Matsuzaki , Takashi Yamada , Kengo Horikoshi
摘要: A method for manufacturing a monolithically integrated semiconductor optical integrated element comprising a DFB laser, an EA modulator, and a SOA disposed in a light emitting direction, comprising the step of forming a semiconductor wafer on which the elements are two-dimensionally arrayed and aligned the optical axes; cleaving the semiconductor wafer along a plane orthogonal to the light emitting direction to form a semiconductor bar including a plurality of the elements arranged one-dimensionally along a direction orthogonal to the light emitting direction such that the elements adjacent to each other share an identical cleavage end face as a light emission surface; inspecting the semiconductor bar by driving the SOA and the DFB laser through a connection wiring part together; and separating out the semiconductor bar after the inspection to cut the connection wiring part connecting the electrode of the SOA and the DFB laser to isolate from each other.
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公开(公告)号:US20220413223A1
公开(公告)日:2022-12-29
申请号:US17779045
申请日:2019-11-28
发明人: Yuichiro Ikuma , Yusuke Nasu , Takashi Yamada
IPC分类号: G02B6/30
摘要: An optical fiber array includes a V-groove substrate in which a V-groove for optical fiber alignment is formed, a pressing plate laminated and bonded on the V-groove substrate, and an optical fiber bonded and fixed in the V-groove of the V-groove substrate, wherein a distance between the optical fiber and the V-groove is less than 20 μm.
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公开(公告)号:US20220357526A1
公开(公告)日:2022-11-10
申请号:US17623539
申请日:2019-07-08
发明人: Takashi Yamada , Yuichiro Ikuma
摘要: There is provided an optical fiber array that can be easily optically connected to cores of optical waveguides on a connection counterpart substrate without requiring a complicated fabrication process to the connection counterpart substrate and laborious diffusing fusion of the cores. In an array, coating-removed exposed portions of fibers are attached to grooves that are provided on a lower substrate in order to position the optical fibers. Further, the exposed portions are pressed by a lid. Coated portions of the fibers are placed on a flat surface of a concave portion that is provided on the substrate to form a step with the grooves in a state where the exposed portions are attached. Front end parts of the exposed portions of the fibers each have a light collecting portion that collects light beams passing through an inside of the corresponding fiber to reduce an MFD. The light collecting portions are lens-shaped portions that are formed by cutting and are used for optical alignment with the cores of the optical waveguides.
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公开(公告)号:US11982837B2
公开(公告)日:2024-05-14
申请号:US17427867
申请日:2020-01-24
发明人: Yuichiro Ikuma , Yusuke Nasu , Manabu Oguma , Takashi Yamada
CPC分类号: G02B6/122 , G02B6/12016 , G02B6/30
摘要: An object is to improve crosstalk between ports while keeping an interposer circuit small. In an interposer circuit that includes a first surface connected to an optical circuit, a second surface that is connected to a fiber block and is located opposite to the first surface in parallel with the first surface, and a plurality of connection waveguides connected to a plurality of input/output waveguides included in the optical circuit and a plurality of input/output fibers included in the fiber block, the connection waveguides each have a straight shape, and an angle (θ) formed between the first surface and each of the connection waveguides is the same as an angle (φ) formed between the second surface and each of the connection waveguides.
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公开(公告)号:US20230258872A1
公开(公告)日:2023-08-17
申请号:US18005141
申请日:2020-08-05
发明人: Yuriko Kawamura , Takashi Yamada , Yusuke Nasu , Yuichiro Ikuma
IPC分类号: G02B6/36
CPC分类号: G02B6/362
摘要: An optical module is provided with a columnar protrusion over the entire pickup area (EP) for automatic suction by a mounting device at the center of the upper surface of a fiber holding carrier. The protrusion secures a dedicated pickup area (EP1) on a top surface. When an extra length of an optical fiber extending from an optical device is routed and held between a pair of wall portions, the extra length including a tip portion is held in a storage area of the fiber holding carrier by a restoring force caused by being pressed against the wall portions. In this holding state, since the tip portion of the extra length can be disposed along the outer periphery of the protrusion, even in a case where the position where the optical fiber is held is slightly shifted by a shock from outside.
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公开(公告)号:US20220357512A1
公开(公告)日:2022-11-10
申请号:US17619124
申请日:2019-07-01
发明人: Yuriko Kawamura , Takashi Yamada , Yusuke Nasu
摘要: An optical module according to the present invention includes: an optical device including an optical waveguide chip; an optical fiber block bonded to and arranged on an end face of the optical waveguide chip; an optical fiber that has one end optically connected to the optical waveguide chip via the optical fiber block; an optical fiber holding mechanism for holding the other end of the optical fiber; and an optical fiber carrier. The optical fiber is arranged while being curved from the optical fiber carrier toward the optical fiber block in a U-shape, and a wall structure is formed on the surface of the carrier while being adjacent to the optical fiber at, for example, a position on the outer side of the U-shaped curve of the optical fiber position at which the wall structure reduces a normal force of the optical fiber.
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公开(公告)号:US12124086B2
公开(公告)日:2024-10-22
申请号:US17779045
申请日:2019-11-28
发明人: Yuichiro Ikuma , Yusuke Nasu , Takashi Yamada
CPC分类号: G02B6/30 , G02B6/3636
摘要: An optical fiber array includes a V-groove substrate in which a V-groove for optical fiber alignment is formed, a pressing plate laminated and bonded on the V-groove substrate, and an optical fiber bonded and fixed in the V-groove of the V-groove substrate, wherein a distance between the optical fiber and the V-groove is less than 20 μm.
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