摘要:
Accumulation mode MOS transistors and methods for fabricating such transistors are provided. A method comprises providing an SOI layer disposed overlying a substrate with an insulating layer interposed therebetween. The SOI layer is impurity doped with a first dopant of a first conductivity type and spacers and a gate stack having a sacrificial polycrystalline silicon gate electrode is formed on the SOI layer. A first and a second silicon region are impurity doped with a second dopant of the first conductivity type. The first silicon region and the second silicon region are aligned to the gate stack and spacers. The sacrificial polycrystalline silicon gate electrode is removed and a metal-comprising gate electrode is formed from a metal-comprising material having a mid-gap work function.
摘要:
An approach for methodology enabling a verification of IC designs that compensates for degraded performance due to a physical placement, particularly a stacked physical placement is disclosed. A set of stacked devices from a plurality of devices in an IC design is determined. One or more instance parameters indicating a physical placement of a device in the set is determined. A compensation metric indicating one or more electrical characteristics of a device in the set is determined based on the one or more instance parameters.
摘要:
A semiconductor transistor device is provided. The transistor device includes a layer of semiconductor material, a gate structure overlying the layer of semiconductor material, a source region in the layer of semiconductor material, and a drain region in the layer of semiconductor material. The source region has a stress-inducing semiconductor material located therein, while the drain region is free of any stress-inducing semiconductor material. This asymmetric arrangement of stress-inducing elements results in relatively high source-body leakage, and relatively low drain-body leakage, which is beneficial in analog circuit applications.